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This 20mil RO3010 2-Layer Immersion Silver PCB represents a convergence of advanced material science and precision manufacturing.
Item NO.:
BIC-530-v615.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
20mil RO3010 Rogers PCB 2-layer High DK10.2 Immersion Silver Bare Copper
Introduce this precision 2-layer rigid PCB, built with 20mil Rogers RO3010 ceramic-filled PTFE substrate and finished with immersion silver. Designed for mission-critical RF, microwave, wireless and automotive radar applications where signal integrity and stability are critical, this board fully complies with IPC-Class-2 standards and is manufactured under ISO 9001 quality controls. Every unit adheres to Gerber RS-274-X artwork specifications and passes 100% electrical testing before worldwide shipment. CombiningRogers3010’s elite electrical properties with cost-effective volume production, it delivers reliable, miniaturized high-frequency performance for global industrial and telecom clients.
PCB Construction Details
This section compiles all core physical and manufacturing specifications of the circuit board, covering material selection, dimensional parameters, processing tolerances, surface treatment, and pre-shipment quality checks, reflecting our strict manufacturing controls to maintain stable high-frequency performance.
|
Parameter |
Specification |
|
Base Material |
Rogers RO3010 |
|
Layer Count |
2-Layer |
|
Board Dimensions |
102mm x 63 mm=1PCS |
|
Minimum Trace/Space |
5 mil / 7 mil |
|
Minimum Hole Size |
0.4 mm |
|
Finished Board Thickness |
0.5 mm (19.7 mils) |
|
Finished Copper Weight |
1 oz (35 µm / 1.4 mils) on all layers |
|
Via Plating Thickness |
20 µm (minimum in hole) |
|
Surface Finish |
Immersion Silver (ImAg) |
|
Solder Mask |
None (Both Sides) |
|
Silkscreen |
None (Both Sides) |
|
Electrical Testing |
100% Tested prior to shipment |
PCB Stackup Configuration
This symmetrical 2-layer stackup is carefully designed for balanced electrical performance and uniform heat distribution, ensuring consistent dielectric properties and precise impedance control across the entire board to support stable high-frequency signal transmission.
|
Layer |
Material |
Thickness |
|
Layer 1 (Top) |
Copper Foil |
35 µm (1 oz) |
|
Dielectric |
Rogers RO3010 |
20 mil (0.508 mm) |
|
Layer 2 (Bottom) |
Copper Foil |
35 µm (1 oz) |
PCB Circuit & Component Statistics
This table outlines key layout and component metrics, showcasing a compact, streamlined circuit design with minimal routing complexity, perfectly optimized to meet the specific requirements of targeted high-frequency applications.
|
Metric |
Count |
|
Components |
38 |
|
Total Pads |
45 |
|
Thru-Hole Pads |
16 |
|
Top SMT Pads |
29 |
|
Bottom SMT Pads |
0 |
|
Vias |
36 |
|
Nets |
2 |
Material Science: The Rogers RO3010 Advantage
The core of this Rogers PCB's exceptional performance lies in its substrate: RO3010. This material is a ceramic-filled PTFE composite specifically formulated to provide a high dielectric constant (Dk) with excellent stability over frequency and temperature. This stability is paramount for designing reliable broadband components and circuits that must operate consistently across a wide range of environmental conditions. The high Dk 10.2 PCB allows for significant circuit miniaturization, as the wavelength of signals is reduced within the material, enabling smaller form factors for antennas and impedance-matching networks.
Key Features of RO3010:
1)Stable Dielectric Constant: 10.2±0.30 at 10 GHz/23°C, ensuring consistent electrical performance.
2)Low Loss: Dissipation factor of 0.0022 at 10 GHz/23°C, minimizing signal attenuation.
3)Excellent Thermal Management: Thermal Conductivity of 0.95 W/mK and a high decomposition temperature (Td > 500°C) for reliable operation.
4)Coefficient of Thermal Expansion (CTE): Closely matched to copper (13-16 ppm/°C), providing excellent mechanical reliability through thermal cycling.
5)Very Low Moisture Absorption: 0.05%, preventing performance degradation in humid environments.
Benefits Realized:
1)Miniaturization: The high Dk allows for smaller circuit geometries, saving valuable board space.
2)Reliable Performance: Dimensional stability and a copper-matched CTE ensure the board withstands manufacturing and operational thermal stresses.
3)Cost-Effective High Performance: While a premium material, RO3010 offers an economical pathway to high-frequency circuit design compared to alternative technologies.
4)Manufacturing Confidence: The material is ISO 9001 certified and suitable for integration into more complex multi-layer designs if required.
Typical Applications
Engineered for superior high-frequency signal integrity and rugged performance, this RO3010 high frequency PCB is widely applied in:
Conclusion
This 20mil RO3010 2-Layer Immersion Silver PCB represents a convergence of advanced material science and precision manufacturing. It is more than just a board; it is a high-performance platform designed to accelerate your time-to-market for critical RF and microwave applications. We stand behind its quality and performance, offering a product ready to meet the challenges of today's most demanding high-frequency environments.
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