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This RF-60A Taconic PCB delivers consistent, repeatable performance for low-to-medium volume production runs and prototype development, supporting seamless integration into end-use RF products with zero compromise on quality or performance.
Item NO.:
BIC-531-v616.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
50mil RF-60A Laminate Custom PCB double-sided Pure Gold Plating Bare Copper
This 50mil RF-60A double-sided PCB is a precision-engineered high-frequency circuit solution built for demanding RF and microwave applications that require uncompromised signal integrity, thermal stability, and long-term operational reliability. Unlike standard FR-4 PCBs tailored for general digital use, this board leverages Taconic ORCER family organic-ceramic RF-60A laminate, a industry-leading material optimized for consistent high-frequency performance, paired with a pure gold plating surface finish to eliminate signal loss, prevent oxidation, and ensure secure, low-resistance interconnects. Engineered with tight dimensional tolerances and zero non-essential coatings (solder mask, silkscreen) to preserve RF signal purity, this Taconic PCB is fully customizable for compact RF subsystem integration, making it a top-tier choice for engineers and OEMs specializing in compact RF power systems, signal filtering, and miniaturized antenna assemblies.
Core PCB Construction
This section outlines the foundational physical and manufacturing specifications of the RF-60A PCB, covering base material, layer configuration, dimensional tolerances, conductive features, and surface finishing, all optimized for high-frequency RF performance with minimal signal degradation and maximum mechanical stability. All parameters are held to tight manufacturing tolerances to ensure consistency across every unit.
|
Parameter |
Specification |
|
Base Material |
RF-60A (Taconic) |
|
Layer Count |
2 Layers |
|
Board Dimensions |
87 mm x 29 mm per panel (+/- 0.15 mm) |
|
Finished Board Thickness |
1.5 mm (59.1 mils) |
|
Minimum Trace / Space |
5 mil / 6 mil (0.127 mm / 0.152 mm) |
|
Minimum Hole Size |
0.4 mm |
|
Blind / Buried Vias |
None |
|
Finished Copper Weight |
1 oz (35 µm / 1.4 mils) on all layers |
|
Via Plating Thickness |
20 µm (0.79 mils) in hole |
|
Surface Finish |
Pure Gold Plating, 100 µinch (2.54 µm) over copper |
|
Top / Bottom Silkscreen |
No |
|
Top / Bottom Solder Mask |
No |
|
Electrical Testing |
100% netlist verification prior to shipment |
PCB Stackup
The 2-layer stackup is symmetric and precision-engineered for balanced electrical performance, uniform thermal distribution, and minimal signal interference between the top and bottom copper layers, with the50mil RF-60A core providing consistent dielectric properties across the entire board surface.
|
Layer |
Material |
Thickness |
|
Layer 1 (Top) |
Copper |
35 µm (1 oz) |
|
Dielectric Core |
RF-60A (Woven Glass/Ceramic) |
1.27 mm (50 mil) |
|
Layer 2 (Bottom) |
Copper |
35 µm (1 oz) |
PCB Statistics
This compact PCB is designed for high-efficiency miniaturized RF circuits, with a focused pad and via layout optimized for low signal loss, short trace lengths, and reliable component mounting, featuring exclusively top-side SMT pads and thru-hole pads for streamlined assembly and thermal management.
|
Parameter |
Quantity |
|
Components |
24 |
|
Total Pads |
39 |
|
Thru-Hole Pads |
17 |
|
Top SMT Pads |
22 |
|
Bottom SMT Pads |
0 |
|
Vias |
48 |
|
Nets |
2 |
Taconic RF-60A Material: Performance Features & Operational Benefits
RF-60A is a premium woven glass-reinforced organic-ceramic laminate from Taconic’s ORCER product line, engineered by combining advanced ceramic fill technology and coated PTFE fiberglass expertise to deliver unmatched high-frequency performance and mechanical durability. Unlike standard dielectric materials,Taconic RF-60A offers stable electrical properties across wide frequency ranges, minimal moisture absorption, and exceptional thermal stability, making it the gold standard for mission-critical RF applications.
Key Electrical & Physical Features
- Dielectric Constant (Dk): 6.15 at 10GHz (Stable across wide frequency bands)
- Dissipation Factor (Df): 0.0038 at 10GHz/23°C (Extremely Low Signal Loss)
- Low Moisture Absorption: 0.02% (Prevents Electrical Property Degradation in Humid Environments)
- Thermal Conductivity: 0.4W/MK (Efficient Heat Dissipation for High-Power RF Circuits)
- CTE (Coefficient of Thermal Expansion): X-axis 9 ppm/°C, Y-axis 8 ppm/°C, Z-axis 69 ppm/°C (Low Z-Axis Expansion for Plated-Through-Hole Reliability in Extreme Thermal Conditions)
- Low Outgassing: 0.02% TML, 0.01% WVR (Compliant with High-Reliability Industrial and Aerospace Standards)
Core Operational Benefits
- Full RoHS and WEEE Compliance, Meeting Global Environmental and Regulatory Standards
- Exceptional Interlaminar Bond Strength & Solder Resistance, Preventing Layer Separation Under Thermal Stress
- Enhanced Dimensional Stability and Flexural Strength, Resisting Warping in Variable Temperature Environments
- Uniform Electrical Properties Across the Entire Board Surface, Ensuring Consistent RF Signal Transmission
- Long-Term Reliability in Extreme Operating Conditions, Reducing Maintenance and Replacement Costs
Target Typical Applications
This high-performance RF-60A Taconic High Frequency PCB is purpose-built for compact, high-frequency RF subsystems where signal purity, thermal stability, and miniaturization are non-negotiable. Ideal use cases include:
- Compact RF Power Amplifiers for Wireless Communication Systems
- High-Performance RF Filters, Couplers, and Signal Dividers
- Miniaturized Antennas and RF Front-End Modules
- Precision Passive RF Components and Microwave Circuit Assemblies
With worldwide availability and strict IPC-Class-2 manufacturing standards, this RF-60A Taconic PCB delivers consistent, repeatable performance for low-to-medium volume production runs and prototype development, supporting seamless integration into end-use RF products with zero compromise on quality or performance.
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