3-Layer F4BM265 PCB 6.2mm Thick DK2.65 ENIG Wangling F4BM Laminates

3-Layer F4BM265 PCB 6.2mm Thick DK2.65 ENIG Wangling F4BM Laminates

Product Overview

Our newly shipped 3-Layer F4BM265 PCB is a high-frequency, high-reliability printed circuit board designed for demanding RF and microwave applications. With a 6.2mm thickness, low dielectric constant (Dk = 2.65), and ultra-low dissipation factor (0.0013 at 10GHz), this F4BM265 6.2 mm PCB is engineered for superior signal integrity, thermal stability, and long-term performance in critical environments.

Constructed using F4BM265 laminate—a PTFE-based material reinforced with fiberglass—this PCB offers enhanced dimensional stability, reduced signal loss, and excellent thermal management. It is ideal for radar systems, satellite communications, base station antennas, and high-frequency passive components.

PCB Construction

PCB Stackup & Layer Configuration

This 3-layer PCB follows a rigid construction with the following stackup:

PCB Statistic

F4BM265 Material Overview

F4BM265 is a high-performance material renowned for its superior electrical properties and dimensional stability. The dielectric constant of 2.65±0.05 at 10GHz, along with a low dissipation factor and excellent thermal conductivity, makes it ideal for applications requiring high-frequency performance and reliability. The precise control of dielectric constant in F4BM265 results in low loss and enhanced dimensional stability, setting it apart from conventional materials.

Features and Benefits

1)Dielectric Constant and Dissipation Factor:

F4BM265 offers a dielectric constant of 2.65±0.05 and a low dissipation factor, ensuring minimal signal loss and high transmission efficiency.

2)Thermal Performance:

With a TCDK of -100 ppm/°C and excellent thermal conductivity of 0.36 W/mk, this PCB maintains stability over a wide temperature range (-55°C to 150°C).

3)Dimensional Stability:

The precise control of the dielectric constant in F4BM265 results in enhanced dimensional stability, low thermal expansion coefficient, and improved temperature drift.

4)Moisture Resistance:

Featuring low moisture absorption of 0.08%, this PCB is resistant to environmental factors, ensuring long-term reliability in various conditions.

Typical Applications

This 3-Layer DK2.65 PCB is optimized for high-frequency and high-power RF applications, including:

✅Microwave & RF Systems

✅Radar & Satellite Communication (SATCOM) Equipment

✅Phase Shifters & Passive Components

✅Power Dividers, Couplers, Combiners

✅Phased Array Antennas & Feed Networks

✅5G Base Station Antennas

✅Aerospace & Defense Electronics

Conclusion

This 3-Layer F4BM265 high frequency PCB is a high-performance, ultra-low-loss solution for RF, microwave, and aerospace applications. With its 6.2mm thickness, PTFE-based laminate, and precision manufacturing, it delivers exceptional electrical performance, thermal stability, and long-term reliability.

Whether for radar systems, satellite communications, or 5G infrastructure, this F4BM PCB is engineered to meet the most demanding requirements.

Contact us today for pricing, lead times, and customization options!