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The 4-Layer Hybrid PCB featuring RO4350B and High Tg FR-4 epitomizes excellence in modern electronics.
Item NO.:
BIC-355-v427.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
4-Layer Hybrid PCB 10mil RO4350B and High Tg FR-4 Mixed Dielectric Circuit Board
Introduction
In today’s rapidly evolving electronics industry, high-frequency and high-speed applications demand PCBs with superior signal integrity, thermal stability, and mechanical reliability. Our 4-Layer Hybrid PCB, combining Rogers RO4350B andHigh Tg FR-4 (S1000-2M), is engineered to meet these stringent requirements. This advanced mixed dielectric PCB is ideal for RF/microwave applications, aerospace systems, radar, and high-speed digital circuits, where low loss, controlled impedance, and thermal management are critical.
With a 10mil RO4350B core and High Tg FR-4 prepreg, this hybrid construction ensures optimal electrical performance while maintaining cost efficiency and manufacturability. The hybrid circuit board features ENIG (Electroless Nickel Immersion Gold) surface finish, 4/6 mil trace/space, and 100% electrical testing, guaranteeing reliability for mission-critical applications.
PCB Construction Details:
The foundation of this 4-Layer Hybrid PCB lies in a combination of innovative materials:
|
Parameter |
Specification |
|
Base Material |
RO4350B + High Tg FR-4 (S1000-2M) |
|
Layer Count |
4-layer rigid PCB |
|
Board Dimensions |
173mm x 85.3mm (±0.15mm) |
|
Finished Thickness |
1.5mm |
|
Min Trace/Space |
4/6 mils |
|
Min Hole Size |
0.20mm |
|
Via Plating Thickness |
20 μm |
|
Copper Weight |
1oz (35μm) inner/outer layers |
|
Surface Finish |
ENIG (Electroless Nickel Immersion Gold) |
|
Solder Mask |
Top/Bottom: Green |
|
Silkscreen |
Top: White, Bottom: Green |
|
Electrical Test |
100% tested (IPC-Class-2) |
PCB Stackup Details:
This PCB boasts a well-engineered 4-layer rigid stackup:
|
Layer |
Material |
Thickness |
|
Top Layer (L1) |
Copper |
35 μm (1oz) |
|
Core |
RO4350B |
0.254mm (10mil) |
|
Inner Layer (L2) |
Copper |
35 μm (1oz) |
|
Prepreg |
1080 RC63% + 7628 (43%) |
0.254mm (10mil) |
|
Inner Layer (L3) |
Copper |
35 μm (1oz) |
|
Substrate |
S1000-2M (FR-4) |
0.8mm (31.5mil) |
|
Bottom Layer (L4) |
Copper |
35 μm (1oz) |
PCB Statistics:
|
PCB Statistics |
Count |
|
Components |
52 |
|
Total Pads |
247 |
|
Thru Hole Pads |
117 |
|
Top SMT Pads |
98 |
|
Bottom SMT Pads |
32 |
|
Vias |
78 |
|
Nets |
12 |
Features & Benefits of RO4350B and S1000-2M
S1000-2M (High Tg FR-4 Component)
Introduction to RO4350B
Rogers 4350B materials offer a blend of woven glass reinforced hydrocarbon/ceramics, marrying the electrical properties of PTFE/woven glass with the manufacturing ease of epoxy/glass. These RO4350B laminates maintain low loss, tight control on dielectric constant, and exhibit UL 94 V-0 rating for active devices and high-power RF designs. Their stability across various temperatures and compatibility with traditional processing methods make them a cost-effective and reliable choice for advanced PCB applications.
Typical Applications
Accepted Standard & Availability
This Hybrid PCB Board complies with IPC-Class-2 standards and is readily available worldwide, ensuring consistent quality and broad accessibility for our customers
Conclusion
In conclusion, the 4-Layer Hybrid PCB featuring RO4350B and High Tg FR-4 epitomizes excellence in modern electronics. From its intricate construction to its exceptional features and wide-ranging applications, this PCB represents a fusion of innovation and reliability that is unparalleled in the industry. Whether you're designing next-generation radar systems or cutting-edge guidance technology, this PCB is your trusted partner in pushing the boundaries of possibility. Choose excellence, choose reliability—choose our 4-Layer hybrid circuit materials PCB for all your high-performance needs.
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3-Layer F4BM265 PCB 6.2mm Thick DK2.65 ENIG Wangling F4BM LaminatesNext:
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