TMM10i 2-layer 30mil 0.762mm Immersion Tin Bare Copper Rogers TMM Series PCB

TMM10i 2-layer 30mil 0.762mm Immersion Tin Bare Copper Rogers TMM Series PCB

Introducing the TMM10i 2-Layer 30 mil Immersion Tin PCB—a cutting-edge printed circuit board engineered for high-reliability RF, microwave, and high-frequency applications. Built on Rogers' premium thermoset microwave material, thisdouble-sided TMM10i PCB combines exceptional dielectric stability, robust mechanical performance, and precise manufacturing to meet the stringent demands of advanced electronic systems. From satellite communications to RF power amplifiers, this Rogers TMM10i PCB delivers consistent performance, process compatibility, and long-term reliability, making it a top choice for engineers and manufacturers worldwide.

1. PCB Construction Details

This table outlines the critical manufacturing specifications, material selections, and quality control measures of the TMM10i PCB.

2. PCB Stackup

This table details the layered structure of the 2-layer rigid PCB, ensuring transparency on material distribution and thickness.

3. PCB Statistics

This table summarizes key data on components, pads, vias, and nets, reflecting the PCB's design density and connection configuration.

About Rogers TMM10i Material

At the core of this PCB is Rogers TMM10i—an isotropic thermoset microwave material engineered as a ceramic-thermoset polymer composite. Designed for high-reliability stripline and microstrip applications with plated thru-holes, TMM10i merges the superior electrical properties of ceramic substrates and PTFE (polytetrafluoroethylene) with the ease of processing of soft substrates. This unique combination makes it ideal for high-frequency circuits where dielectric stability and manufacturing efficiency are critical.

Key Material Features

The TMM10i material boasts exceptional electrical, thermal, and mechanical properties:

• Dielectric Constant (Dk): 9.80±0.245 (isotropic, ensuring consistent signal performance across directions)
• Dissipation Factor: 0.0020 at 10GHz (low signal loss for high-frequency applications)
• Thermal Coefficient of Dk: -43 ppm/°K (stable dielectric performance across temperature fluctuations)
• Coefficient of Thermal Expansion (CTE): 19ppm/K (x/y), 20ppm/K (z)—matched to copper, reducing thermal stress
• Decomposition Temperature (Td): 425°C (high thermal resistance for harsh operating environments)
• Thermal Conductivity: 0.76W/mk (efficient heat dissipation)
• Thickness Range: 0.0015 to 0.500 inches (±0.0015”)—flexible for diverse design needs

Benefits

The TMM10i 30mil PCB delivers tangible advantages for both manufacturing and end-use:

• Superior Mechanical Stability: Resists creep and cold flow, ensuring long-term structural integrity
• Chemical Resistance: Withstands process chemicals, minimizing damage during fabrication
• Simplified Manufacturing: No sodium naphthanate treatment required prior to electroless plating, reducing production steps and costs
• Reliable Wire Bonding: Thermoset resin base enables secure, consistent wire-bonding for high-reliability connections
• Plating Compatibility: Supports high-quality immersion tin finish and reliable via plating, enhancing conductivity and corrosion resistance

Typical Applications

Leveraging its exceptional material properties, the TMM10i 2-layer PCB is widely applicable in high-performance electronic systems:

- RF and microwave circuitry

- Power amplifiers and combiners

- Filters and coupler

- Satellite communication systems

- Global Positioning Systems Antennas

- Patch Antennas

- Dielectric polarizers and lenses

- Chip testers

Quality & Availability

• Artwork Standard: Gerber RS-274-X (industry-leading format for precise PCB manufacturing)
• Quality Certification: IPC-Class-2 (meets strict industry standards for performance and reliability)
• Global Availability: Shipped worldwide, ensuring timely access for international projects.

In summary, the TMM10i high frequency PCB stands as a high-performance, reliable solution for demanding RF and microwave applications. Its premium material selection, precise manufacturing, and broad compatibility make it a valuable asset for engineers seeking to optimize circuit performance and production efficiency.