Rogers AD300D 2-layer 40mil 1.016 mm EPIG Bare Copper High Frequency PCB

Rogers AD300D 2-layer 40mil 1.016 mm EPIG Bare Copper High Frequency PCB

Product Overview

Designed for high-performance wireless and RF communication applications, the AD300D 2-layer 40mil EPIG PCB is a precision-engineered solution built to meet IPC-Class-2 quality standards, combining premium PTFE-based substrate performance with strict manufacturing tolerances and reliable surface finishing.

As a specialized RF-focused PCB, this product is optimized for low signal loss, consistent dielectric properties, and exceptional passive intermodulation (PIM) performance, addressing the core demands of modern wireless antenna systems, cellular infrastructure, and automotive telematics. Unlike standard commercial PCBs, this unit leverages AD300D ceramic-filled, glass-reinforced PTFE laminate material to deliver stable electrical performance across wide frequency and temperature ranges, with zero compromise on mechanical durability and manufacturing repeatability. Every unit undergoes 100% full electrical testing prior to global shipment, ensuring full compliance with customer design files and operational reliability in critical communication environments.

1.PCB Construction Overview

This section outlines the core physical and manufacturing parameters of the PCB, defining material selection, dimensional tolerances, conductive properties, and finishing specifications to confirm compatibility with standard RF assembly processes and strict quality benchmarks.

2. PCB Stackup

The 2-layer stackup is engineered for balanced electrical performance and mechanical stability, using a thick 40mil AD300D core with consistent 35μm copper foils on both outer layers to minimize signal distortion and ensure uniform dielectric distribution for RF applications.

3. PCB Statistics

This compact, low-component-count layout is optimized for dedicated RF antenna functions, featuring a minimal net count and targeted pad/via configuration to reduce signal interference and streamline assembly for specialized wireless communication modules.

4. Artwork, Quality, and Availability

To ensure a seamless transition from design to production, the following standards and logistics apply to this product:

• Type of Artwork Supplied: Gerber RS-274-X
• Quality Standard: IPC-Class-2 (Ensuring high reliability and extended lifecycles)
• Availability: Available for worldwide shipment.

5. Introduction to AD300D Material

The foundation of this Rogers PCB's superior performance is the AD300D laminate. This material is a ceramic-filled, glass-reinforced PTFE composite specifically developed to meet the stringent requirements of the modern wireless antenna market. Its formulation is designed to provide a controlled dielectric constant, exceptionally low signal loss, and industry-leading Passive Intermodulation (PIM) performance. Importantly, it is compatible with standard PTFE fabrication processes, offering a cost-effective path to enhanced electrical and mechanical stability in demanding RF environments.

6. Key Features

1)Controlled Dielectric Constant: DK of 2.94±0.05 at 10 GHz / 23°C, ensuring repeatable and predictable circuit performance.

2)Low Dissipation Factor: Df of 0.0021 at 10 GHz / 23°C, minimizing signal loss for high-efficiency power transfer.

3)Stable Thermal Expansion: CTE of 24 ppm/°C (X), 23 ppm/°C (Y), and 98 ppm/°C (Z) from -55 to 288°C, providing excellent plated through-hole (PTH) reliability.

4)Consistent Electrical Properties: Thermal coefficient of DK measured at -73 ppm/°C, ensuring stable performance across temperature fluctuations.

5)Flame Retardant: UL 94 V-0 rated for safety compliance.

7. Benefits

1)Superior Signal Integrity: The ultra-low loss tangent (<0.002 at 10 GHz) guarantees excellent circuit performance across all typical wireless frequency bands, from cellular to automotive telematics.

2)Enhanced Antenna Performance: The very low PIM rating (-159 dBc at 30 mil, 1900 MHz) is critical for high-performance antenna systems, significantly reducing yield loss due to PIM-related issues and ensuring cleaner signal transmission.

3)Manufacturing Reliability: Excellent dimensional stability translates directly to repeatable circuit performance and higher manufacturing yields, reducing costs and lead times.

4)Lead-Free & Reliable: The EPIG surface finish provides a flat, solderable surface without the use of magnetic nickel, preserving signal integrity and meeting modern environmental standards.

8. Typical Applications

This AD300D high frequency PCB is ideally suited for a range of high-frequency applications where material performance is critical to overall system success:

• Cellular Infrastructure: Base station antennas for 4G/LTE and 5G networks.
• Automotive: Telematics antenna systems (SDARS, GNSS, V2X).
• Consumer & Commercial: High-performance satellite radio antennas requiring consistent reception and low noise.

In summary, this AD300D double-sided PCB represents a convergence of advanced material science and precision manufacturing. It is designed not just to function, but to excel in the most challenging RF environments, providing our customers with a reliable, high-performance foundation for their critical technologies.