6-Layer Hybrid PCB 10mil RO4350B and S1000-2M Materials 1.5mm Thick with Blind Vias ENIG
1. Introduction
In the demanding world of high-frequency RF, aerospace, and millimeter-wave applications, the 6-layer hybrid PCB combining RO4350B and S1000-2M materials stands out as a high-performance, cost-effective solution. Designed for superior signal integrity, thermal stability, and manufacturability, this hybrid circuit materials PCB is ideal for radar systems, 5G antennas, satellite communications, and defense electronics.
With a 1.5mm finished thickness, 4/4 mil trace/space capability, and controlled 50Ωimpedance, this hybrid board ensures low loss, high power handling, and excellent plated through-hole (PTH) reliability. The hybrid stackup (RO4350B + S1000-2M) balances RF performance with mechanical robustness, making it a top choice for mission-critical applications.
2. PCB Construction & Technical Specifications
Hybrid 6-Layer RO4350B S1000-2M PCB Specifications (RO4350B + S1000-2M)
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Parameter
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Specification
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PCB Type
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Hybrid 6-Layer (RO4350B + S1000-2M)
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Dimensions
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76.5mm × 83mm (±0.15mm)
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Thickness
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1.5mm
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Materials
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RO4350B (RF) + S1000-2M (Mechanical)
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Min Trace/Space
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4/4 mils
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Min Hole Size
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0.3mm
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Vias
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Blind (L1-L2) + Through-hole
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Copper Weight
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1oz (35μm) all layers
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Surface Finish
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ENIG
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Solder Mask
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Blue (Top/Bottom)
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Silkscreen
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White (Top/Bottom)
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Impedance Control
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50Ω (Top layer, 4mil trace)
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Testing
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100% Electrical Test
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Standard
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IPC-Class-2
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Quality Standard: IPC-Class-2 (Reliable for commercial & industrial applications)
Artwork Format: Gerber RS-274-X (Industry-standard for PCB fabrication)
3. PCB Stackup & Material Benefits
3.1 6-Layer Hybrid Stackup
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Layer
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Material
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Thickness
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Key Properties
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Layer 1 (Top)
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1 oz Cu (35 μm)
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Signal Layer
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ENIG finish, 50Ω impedance
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Core 1
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RO4350B
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0.254 mm (10 mil)
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Low loss (Dk=3.48, Df=0.0037)
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Layer 2
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1 oz Cu (35 μm)
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Ground/Power
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Blind vias (L1-L2)
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Prepreg
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1080 X2 (RC 63%)
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0.127 mm (5 mil)
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Bonding layer
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Layer 3
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1 oz Cu (35 μm)
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Signal Layer
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|
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Core 2
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S1000-2M
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0.254 mm (10 mil)
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High Tg (180°C), low CTE
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Layer 4
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1 oz Cu (35 μm)
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Ground/Power
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|
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Prepreg
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1080 X2 (RC 63%)
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0.127 mm (5 mil)
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Bonding layer
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Layer 5
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1 oz Cu (35 μm)
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Signal Layer
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|
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Core 3
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RO4350B
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0.254 mm (10 mil)
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Low loss, high thermal stability
|
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Layer 6 (Bottom)
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1 oz Cu (35 μm)
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Signal Layer
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ENIG finish
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3.2 Why This Hybrid Stackup?
✔RO4350B (Top/Bottom Layers)–Ensures low-loss signal propagation for RF circuits.
✔S1000-2M (Middle Layer)–Provides mechanical strength, thermal resistance, and PTH reliability.
✔Optimized Prepreg (1080 X2)–Ensures strong interlayer bonding & impedance control.
3.3 PCB Statistic
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Category
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Quantity
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Components
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149
|
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Total Pads
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215
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- Thru Hole Pads
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57
|
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- Top SMT Pads
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38
|
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- Bottom SMT Pads
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120
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Vias
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79
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Nets
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6
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4. Material Properties & Advantages
4.1 RO4350B–High-Frequency Performance
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Property
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Value
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Advantage
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Dielectric Constant (Dk)
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3.48 ±0.05 @ 10 GHz
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Stable signal propagation
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Dissipation Factor (Df)
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0.0037 @ 10 GHz
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Ultra-low insertion loss
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Thermal Conductivity
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0.69 W/m/°K
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Improved heat dissipation
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CTE (X/Y/Z)
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10/12/32 ppm/°C
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Matches copper, prevents delamination
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Tg
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>280°C
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Withstands high-temp assembly
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Moisture Absorption
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0.06%
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Reliable in humid conditions
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4.2 S1000-2M–Mechanical Robustness
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Property
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Value
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Advantage
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Tg (Glass Transition)
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180°C (DSC)
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Lead-free compatible
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Z-Axis CTE
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Lower than standard FR4
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Better PTH reliability
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Anti-CAF Performance
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Excellent
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Prevents conductive anodic filaments
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UV Blocking
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AOI compatible
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Eases inspection
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Moisture Absorption
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Low
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High reliability
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5. Applications of This Hybrid PCB
This Hybrid PCB Board is optimized for high-frequency, high-reliability applications, including:
✅5G & mmWave Antennas (Beamforming, MIMO arrays)
✅Radar & Defense Systems (Phased array radar, missile guidance)
✅Satellite Communications (SATCOM)
✅Aerospace Avionics
✅Point-to-Point Radio Links
✅High-Speed Digital RF Modules
6. Why Choose This PCB?
6.1 Performance Advantages
✔ Hybrid Material Optimization–Combines RF performance (Rogers4350B) with mechanical strength (S1000-2M).
✔Controlled Impedance (50Ω)–Critical for high-frequency signal integrity.
✔Blind Vias (L1-L2)–Enables high-density interconnects.
✔ENIG Surface Finish–Ensures long-term solderability & corrosion resistance.
7. Conclusion
The 6-layer Hybrid PCB Material PCB (RO4350B +ShengyiS1000-2M, 1.5mm thick) is a high-performance, cost-effective solution for RF, microwave, and aerospace applications. With low-loss signal transmission, excellent thermal stability, and robust mechanical properties, it is ideal for 5G, radar, satellite, and defense systems.
Available for worldwide shipment–Contact us for quotes & lead times!
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