6-Layer Hybrid PCB 16.6mil Rogers RO4350B High Tg FR-4 Material Multilayer Board

6-Layer Hybrid PCB 16.6mil Rogers RO4350B High Tg FR-4 Material Multilayer Board

Introduction

In today’s rapidly evolving electronics industry, high-frequency and high-speed PCB designs demand materials that balance performance, reliability, and cost-effectiveness. Our newly shipped 6-layer hybrid PCB combines the superior high-frequency properties of RO4350B with the mechanical strength and thermal stability of High-Tg FR-4, delivering an optimized solution for RF, microwave, and high-speed digital applications.

This hybrid construction leverages the strengths of both materials—RO4350B for critical high-frequency signal layers and High-Tg FR-4 for power distribution and mechanical stability—resulting in a PCB that offers enhanced signal integrity, superior thermal management, and cost efficiency.

Below, we provide an in-depth analysis of this hybrid PCB’s construction, material properties, advantages, and applications to help you understand why it stands out in the market.

Construction Details

The foundation of this mixed dielectric PCB is a fascinating symphony of materials:

PCB Stackup

This 6-layer RO4350B hybrid PCB features a carefully engineered stackup to maximize performance while maintaining structural integrity:

Key Statistics

This powerhouse of a PCB boasts the following vital statistics:

Hybrid PCB

Hybrid lamination of high-Tg FR-4 and Rogers 4350B is an advanced PCB manufacturing technology that combines traditional FR-4 with high-frequency material RO4350B, leveraging the strengths of both.

Why Choose a Hybrid RO4350B + High-Tg FR-4 PCB?

1. Performance Optimization for High-Frequency Applications

• Low Signal Loss: RO4350B’s ultra-low dissipation factor (Df = 0.0037 @ 10 GHz) minimizes RF losses, making it ideal for 5G, radar, and satellite communications.
• Stable Dielectric Constant (Dk = 3.48±0.05): Ensures consistent impedance control (±5%) for high-speed digital and RF circuits.
• Hybrid Design Flexibility: High-speed signals route on RO4350B layers, while FR-4 handles power distribution and low-frequency circuits, optimizing cost and performance.

2. Enhanced Thermal & Mechanical Reliability

• High-Tg FR-4 (Tg≥170°C): Withstands lead-free soldering (260°C+) and harsh operating environments. 
• Low Z-Axis CTE (32 ppm/°C for RO4350B): Reduces thermal stress, preventing delamination in high-power RF designs.
• UL 94 V-0 Flame Retardant: Meets stringent safety standards for industrial and automotive applications.

3. Cost-Effective Manufacturing

• Selective Material Usage: RO4350B is only used where needed (RF sections), reducing overall cost.
• Standard FR-4 Processes: Compatible with conventional PCB fabrication (drilling, plating, etching), eliminating the need for specialized equipment.

Material Comparison: RO4350B vs. High-Tg FR-4

Applications

The versatility of this hybrid circuit board unveils a myriad of applications:

• Cellular Base Station Antennas and Power Amplifiers.
• RF Identification Tags.
• Automotive Radar and Sensors.
• LNB’s for Direct Broadcast Satellites.

Conclusion

Our 6-layer hybrid circuit materials PCB (RO4350B + High-Tg FR-4) represents the perfect synergy of high-frequency performance, thermal resilience, and cost efficiency. By strategically combining RO4350B’s RF-optimized properties with the mechanical strength of high-Tg FR-4, thisHybrid PCB Board is an outstanding choice for next-gen wireless, automotive, and aerospace applications.

With strict impedance control, ultra-low loss, and robust thermal management, this board is ready to power your most demanding electronic systems. Available worldwide, it meets the highest industry standards while offering a competitive edge in high-frequency PCB solutions.

Contact us today to discuss how this hybrid PCB can enhance your next project!