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This multilayer PCB is designed for high-reliability RF/microwave applications where signal integrity, thermal stability, and mechanical strength are critical.
Item NO.:
BIC-356-v428.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
6-Layer CuClad 217 PCB 3.5mm ThickRogers DK2.17 Laminate ENIG Multilayer Board
Introduction
In today’s rapidly evolving electronics industry, high-frequency PCBs play a crucial role in ensuring signal integrity, low loss, and superior performance in demanding applications such as radar systems, aerospace, and telecommunications. Our 6-layer CuClad 217 PCB is engineered to meet the stringent requirements of high-frequency and microwave applications, offering exceptional electrical performance, mechanical stability, and reliability.
This PCB is constructed using Rogers CuClad 217 laminate, a high-performance PTFE-based material reinforced with woven fiberglass, ensuring low dielectric constant (Dk = 2.17), ultra-low dissipation factor (Df = 0.0009), and excellent thermal stability. With a finished thickness of 3.5mm, this Rogers board is optimized for high-power RF circuits, aerospace electronics, and military-grade systems.
Below, we provide an in-depth analysis of this DK2.17 PCB’s construction, materials, electrical properties, and applications to help engineers and procurement specialists make an informed decision.
PCB Construction Details
Crafted with precision, the CuClad 217 PCB boasts a 6-layer architecture with exceptional specifications:
|
Parameter |
Specification |
|
Base Material |
Rogers CuClad 217 / RF-27 Prepreg |
|
Layer Count |
6 layers |
|
Board Dimensions |
68.45mm x 97.18mm (±0.15mm tolerance) |
|
Minimum Trace/Space |
5/7 mils |
|
Minimum Hole Size |
0.4mm |
|
Blind Vias |
L1-L4 |
|
Finished Thickness |
3.5mm |
|
Copper Weight (Inner/Outer) |
1oz (35µm) |
|
Via Plating Thickness |
20µm |
|
Surface Finish |
Immersion Gold (ENIG) |
|
Top Silkscreen |
White |
|
Bottom Silkscreen |
None |
|
Top Solder Mask |
Green |
|
Bottom Solder Mask |
None |
|
Electrical Testing |
100% tested prior to shipment |
|
Quality Standard |
IPC-Class-2 |
PCB Stackup
The detailed 6-layer PCB stackup entails:
|
Layer |
Material |
Thickness |
|
Copper Layer 1 |
1oz (35µm) |
- |
|
Core |
Rogers CuClad 217 |
1.575mm (62mil) |
|
Copper Layer 2 |
1oz (35µm) |
- |
|
Bonding Ply |
RF-27 Prepreg |
0.05mm |
|
Copper Layer 3 |
1oz (35µm) |
- |
|
Core |
Rogers CuClad 217 |
0.787mm (31mil) |
|
Copper Layer 4 |
1oz (35µm) |
- |
|
Bonding Ply |
RF-27 Prepreg |
0.05mm |
|
Copper Layer 5 |
1oz (35µm) |
- |
|
Core |
Rogers CuClad 217 |
0.787mm (31mil) |
|
Copper Layer 6 |
1oz (35µm) |
- |
PCB Statistics
|
Parameter |
Value |
|
Total Components |
31 |
|
Total Pads |
143 |
|
Through-Hole Pads |
116 |
|
Top SMT Pads |
27 |
|
Bottom SMT Pads |
0 |
|
Vias |
39 |
|
Nets |
2 |
Introduction of CuClad 217
Rogers CuClad 217 substrates exhibit exceptional properties that elevate this PCB's performance:
Features
The CuClad 217 High frequency PCB is fortified with a myriad of impressive features:
Benefits
The CuClad 217 PCB offers a host of benefits that redefine performance standards:
Typical Applications
The versatility of the CuClad 217 PCB finds application in critical industries:
- Radars
- Electronic Countermeasures
- Electronic Support Measures
- Microwave Components (LNAs, filters, couplers, etc.)
Ordering & Availability
Conclusion
This PCB is designed for high-reliability RF/microwave applications where signal integrity, thermal stability, and mechanical strength are critical. With Rogers CuClad 217’s superior electrical properties and a rigid 6-layer stack-up, it ensures optimal performance in the most demanding environments.
For high-frequency, low-loss PCB solutions, this 6-Layer CuClad 217 PCB is the ideal choice for engineers demanding performance, reliability, and precision.
Whether for defense, aerospace, or telecom, this multilayer Rogers PCB delivers unmatched high-frequency performance.
Contact us today for quotes, lead times, and customization options!
Get in touch to discuss your project requirements!
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