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Home Newly Shipped RF PCB F4BTMS1000 PCB 2-layer 1.905mm Thick DK10.2 ENIG Wangling F4BTMS Series Substrates

F4BTMS1000 PCB 2-layer 1.905mm Thick DK10.2 ENIG Wangling F4BTMS Series Substrates

The F4BTMS1000 Wangling PCB is a high-performance, ultra-reliable circuit board designed for mission-critical applications in aerospace, defense, and RF communications.

  • Item NO.:

    BIC-359-v431.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail

F4BTMS1000 PCB 2-layer 1.905mm Thick DK10.2 ENIG Wangling F4BTMS Series Substrates

 

Product Overview

The F4BTMS1000 PCB is a high-reliability,two-layer printed circuit board designed for demanding applications in aerospace, military radar, RF/microwave systems, and satellite communications. Built with the advanced F4BTMS1000 base material—an upgraded ceramic-filled PTFE composite—this F4B High Frequency PCB delivers exceptional electrical performance, thermal stability, and mechanical durability.

 

With a thickness of 1.905mm (75 mil), immersion gold surface finish, and strict IPC-Class-2 quality compliance, this F4B PCB Material ensures superior signal integrity, low loss, and long-term reliability in harsh environments. Its low dielectric loss (Df = 0.0020 at 10GHz) and stable dielectric constant (Dk = 10.2 at 10GHz) make it ideal for high-frequency and phase-sensitive applications.

 

PCB Construction Details

The F4BTMS1000 substrate PCB boasts a meticulous construction that ensures optimal performance and reliability in a multitude of applications:

 

Parameter

Specification

Base Material

F4BTMS1000 (Ceramic-Filled PTFE)

Layer Count

2 layers

Board Dimensions

349mm x 361mm (±0.15mm tolerance)

Finished Thickness

2.0mm (1.905mm core + 35µm Cu each side)

Minimum Trace/Space

8/7 mils

Minimum Hole Size

0.3mm

Via Type

Through-hole only (No blind/buried vias)

Copper Weight (Outer Layers)

1oz (35µm)

Via Plating Thickness

20µm

Surface Finish

Immersion Gold (ENIG)

Silkscreen (Top/Bottom)

None

Solder Mask (Top/Bottom)

None

Electrical Testing

100% tested prior to shipment

 

 

PCB Stackup

The F4BTMS1000 DK10.2 PCB features a simple yet high-performance 2-layer stackup:

 

Layer

Material/Thickness

Top Copper Layer

35µm (1oz)

Core Material

F4BTMS1000 (1.905mm)

Bottom Copper Layer

35µm (1oz)

 

 This construction ensures low signal loss, high thermal dissipation, and excellent dimensional stability—critical for high-frequency and high-power applications.

 

PCB Statistics

The F4BTMS1000 high frequency PCB is not just a piece of hardware; it is a culmination of precise engineering and design, as reflected in its statistics:

 

Category

Count

Total Components

51

Total Pads

169

Thru-Hole Pads

67

Top SMT Pads

102

Bottom SMT Pads

0

Vias

67

Nets

2

 

F4BTMS1000 PCB 2-layer 1.905mm Thick 


Introducing the F4BTMS Series

The F4BTMS series substrate represents a groundbreaking evolution in PCB materials, offering unparalleled performance and reliability. Let's delve deeper into the features and benefits that make theWanglingF4BTMS series a preferred choice for high-end applications:

 

 

Features of the F4BTMS1000 PCB

 

1.Dielectric Constant (Dk): 

The PCB boasts a Dk of 10.2 at 10GHz, ensuring stable and efficient signal propagation.

 

2.Dissipation Factor:

With a low dissipation factor of .0020 at 10GHz and 0.0023 at 20GHz, the PCB minimizes signal loss and distortion.

 

3.CTE (Coefficient of Thermal Expansion):

The PCB exhibits a CTE of 16 ppm/°C (x-axis), 18 ppm/°C (y-axis), and 32 ppm/°C (z-axis) in the temperature range of -55°C to 288°C, ensuring thermal stability and reliability.

 

4.Thermal Conductivity:

With a high thermal conductivity of 0.81 W/mk, the PCB efficiently dissipates heat, enhancing performance and reliability.

 

5.Moisture Absorption:

The PCB features low moisture absorption of 0.03%, ensuring durability and longevity in diverse environments.

 

Applications of the F4BTMS1000 PCB

The versatility and performance of the F4BTMS1000 PCB make it an ideal choice for a wide range of applications, including:

 


  • -Aerospace equipment and space technologies
  • -Microwave and RF applications
  • -Radar systems, including military radar
  • -Feed networks for antennas
  • -Phase-sensitive and phased array antennas
  • -Satellite communications and more


 

Quality Assurance & Compliance


  • IPC-Class-2 Certified: Ensures high reliability for commercial and industrial applications.
  • 100% Electrical Testing: Guarantees functionality before shipment.
  • Gerber RS-274-X Files Accepted: Ensures precision in manufacturing.


 

Conclusion

The F4BTMS1000 Wangling PCB is a high-performance, ultra-reliable circuit board designed for mission-critical applications in aerospace, defense, and RF communications. With its ceramic-enhanced PTFE substrate, low-loss characteristics, and robust thermal properties, it outperforms conventional FR-4 and other high-frequency materials.

 

Whether you need low-loss RF circuits, radar systems, or satellite communication modules, this PCB delivers exceptional signal integrity, thermal stability, and long-term durability.

 

Available now for global orders–Contact us today for pricing & lead times!





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