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The F4BTMS1000 Wangling PCB is a high-performance, ultra-reliable circuit board designed for mission-critical applications in aerospace, defense, and RF communications.
Item NO.:
BIC-359-v431.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 daysF4BTMS1000 PCB 2-layer 1.905mm Thick DK10.2 ENIG Wangling F4BTMS Series Substrates
Product Overview
The F4BTMS1000 PCB is a high-reliability,two-layer printed circuit board designed for demanding applications in aerospace, military radar, RF/microwave systems, and satellite communications. Built with the advanced F4BTMS1000 base material—an upgraded ceramic-filled PTFE composite—this F4B High Frequency PCB delivers exceptional electrical performance, thermal stability, and mechanical durability.
With a thickness of 1.905mm (75 mil), immersion gold surface finish, and strict IPC-Class-2 quality compliance, this F4B PCB Material ensures superior signal integrity, low loss, and long-term reliability in harsh environments. Its low dielectric loss (Df = 0.0020 at 10GHz) and stable dielectric constant (Dk = 10.2 at 10GHz) make it ideal for high-frequency and phase-sensitive applications.
PCB Construction Details
The F4BTMS1000 substrate PCB boasts a meticulous construction that ensures optimal performance and reliability in a multitude of applications:
Parameter |
Specification |
Base Material |
F4BTMS1000 (Ceramic-Filled PTFE) |
Layer Count |
2 layers |
Board Dimensions |
349mm x 361mm (±0.15mm tolerance) |
Finished Thickness |
2.0mm (1.905mm core + 35µm Cu each side) |
Minimum Trace/Space |
8/7 mils |
Minimum Hole Size |
0.3mm |
Via Type |
Through-hole only (No blind/buried vias) |
Copper Weight (Outer Layers) |
1oz (35µm) |
Via Plating Thickness |
20µm |
Surface Finish |
Immersion Gold (ENIG) |
Silkscreen (Top/Bottom) |
None |
Solder Mask (Top/Bottom) |
None |
Electrical Testing |
100% tested prior to shipment |
PCB Stackup
The F4BTMS1000 DK10.2 PCB features a simple yet high-performance 2-layer stackup:
Layer |
Material/Thickness |
Top Copper Layer |
35µm (1oz) |
Core Material |
F4BTMS1000 (1.905mm) |
Bottom Copper Layer |
35µm (1oz) |
This construction ensures low signal loss, high thermal dissipation, and excellent dimensional stability—critical for high-frequency and high-power applications.
PCB Statistics
The F4BTMS1000 high frequency PCB is not just a piece of hardware; it is a culmination of precise engineering and design, as reflected in its statistics:
Category |
Count |
Total Components |
51 |
Total Pads |
169 |
Thru-Hole Pads |
67 |
Top SMT Pads |
102 |
Bottom SMT Pads |
0 |
Vias |
67 |
Nets |
2 |
Introducing the F4BTMS Series
The F4BTMS series substrate represents a groundbreaking evolution in PCB materials, offering unparalleled performance and reliability. Let's delve deeper into the features and benefits that make theWanglingF4BTMS series a preferred choice for high-end applications:
Features of the F4BTMS1000 PCB
1.Dielectric Constant (Dk):
The PCB boasts a Dk of 10.2 at 10GHz, ensuring stable and efficient signal propagation.
2.Dissipation Factor:
With a low dissipation factor of .0020 at 10GHz and 0.0023 at 20GHz, the PCB minimizes signal loss and distortion.
3.CTE (Coefficient of Thermal Expansion):
The PCB exhibits a CTE of 16 ppm/°C (x-axis), 18 ppm/°C (y-axis), and 32 ppm/°C (z-axis) in the temperature range of -55°C to 288°C, ensuring thermal stability and reliability.
4.Thermal Conductivity:
With a high thermal conductivity of 0.81 W/mk, the PCB efficiently dissipates heat, enhancing performance and reliability.
5.Moisture Absorption:
The PCB features low moisture absorption of 0.03%, ensuring durability and longevity in diverse environments.
Applications of the F4BTMS1000 PCB
The versatility and performance of the F4BTMS1000 PCB make it an ideal choice for a wide range of applications, including:
Quality Assurance & Compliance
Conclusion
The F4BTMS1000 Wangling PCB is a high-performance, ultra-reliable circuit board designed for mission-critical applications in aerospace, defense, and RF communications. With its ceramic-enhanced PTFE substrate, low-loss characteristics, and robust thermal properties, it outperforms conventional FR-4 and other high-frequency materials.
Whether you need low-loss RF circuits, radar systems, or satellite communication modules, this PCB delivers exceptional signal integrity, thermal stability, and long-term durability.
Available now for global orders–Contact us today for pricing & lead times!
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