7.5mil AGC Taconic TLY-5 Substrate Custom PCB EPIG Finish Bare Copper

7.5mil AGC TaconicTLY-5 Substrate Custom PCB EPIG Finish Bare Copper

Executive Summary

This presentation delivers a comprehensive, differentiated technical profile of a custom 2-layer rigid microwave PCB fabricated on 7.5mil AGC TLY-5 high-frequency PTFE composite substrate with EPIG electroplated immersion gold surface finish. Designed for millimeter-wave radar, satellite communication and aerospace phased array hardware, the Taconic TLY-5 DK2.2 PCB adheres to IPC-Class-2 reliability standards with zero solder mask, zero silkscreen ultra-clean bare copper construction, tight dimensional tolerances and fully validated electrical performance.

The content is split into two distinct standalone modules: complete PCB hardware specification and in-depth TLY-5 CCL core substrate technical breakdown, with structured data tables, performance differentiation analysis, application mapping and conclusive technical takeaways for design, procurement and manufacturing stakeholders.

Part 1: Complete PCB Product Specification & Hardware Profile

1.1 PCB Construction Details Overview

This section tabulates all mechanical, surface treatment, fabrication and test rules governing the finished 45mmx 87mm single-piece Taconic TLY-5 PCB, covering dimensional control, trace/hole limits, copper weight, plating, surface finish and mandatory factory electrical validation.

1.2 PCB Stackup Architecture Overview

This table outlines the symmetrical two-layer rigid laminate stackup, defining each conductive copper layer and central TLY-5 dielectric core with exact thickness values for RF impedance calculation.

1.3 PCB Component & Circuit Statistics Overview

This table quantifies all circuit features, component footprints, pad types, vias and electrical nets to quantify circuit density and manufacturing complexity for high-volume production planning.

Conclusion for PCB Hardware Module

This custom 7.5mil TLY-5 2-layer EPIG PCB delivers a purpose-built ultra-thin high-frequency circuit platform optimized for millimeter-wave RF applications. Its core differentiators include mask/silkscreen-free bare copper construction, tightly controlled 7.5mil low-loss TLY-5 dielectric core, symmetrical dual 35μm copper stack, full through-via architecture, EPIG corrosion-resistant surface finish and IPC-Class-2 validated manufacturing. The balanced circuit density, minimal net count and 100% electrical pre-ship testing guarantee consistent RF performance, high manufacturing yield and global production scalability, making it a cost-effective alternative to complex multi-layer PTFE PCBs for automotive radar, satellite communication and aerospace mmWave subsystem designs.

Part 2: In-Depth Technical Breakdown of TLY-5 Core CCL Substrate

2.1 TLY-5 Material Core Introduction & Differentiation

AGC TLY-5 is an avionics and aerospace-grade woven lightweight fiberglass-reinforced PTFE copper clad laminate, engineered to outperform chopped-fiber PTFE composite substrates in dimensional stability and mass-production yield while retaining ultra-low high-frequency signal loss. Unlike discontinuous chopped fiber PTFE materials that suffer inconsistent dielectric uniformity and high thermal expansion variation, TLY-5’s continuous woven glass matrix delivers superior mechanical rigidity and predictable DK/Df across all operating frequencies from 10GHz up to 77GHz automotive radar and Ka/E/W band satellite hardware.

Independent OEM 77GHz insertion loss testing confirms TLY-5 matches the RF electrical performance of competing chopped-fiber PTFE laminates, with a dramatic uplift in production yield–a critical commercial differentiation for high-volume automotive radar manufacturing. The material supports laser ablation via formation, compatible with fine-line 6/10mil trace routing specified on the matching PCB hardware, and is available in incremental thickness steps starting at 7.5mil (0.191mm), the exact dielectric core selected for this PCB design.

2.2 Full TLY-5 CCL Datasheet Property Table

This consolidated datasheet compiles all electrical, thermal, mechanical, chemical and safety performance metrics with standardized industry test methods for cross-substrate comparison.

Table: Complete AGC TLY-5 CCL Material Property Datasheet

2.3 TLY-5 Standard Thickness & Production Panel Size Options

Standard Core Thickness Options

Standard Raw Laminate Panel Sizes

2.4 Core Functional Advantages of TLY-5 CCL (Differentiated Value Points)

1)Exceptional Dimensional Stability: Woven glass fiber matrix eliminates uneven shrinkage/expansion seen in chopped PTFE, delivering consistent impedance across thousands of RF PCBs in mass production.

2)Ultra-Low Dissipation Factor (Df=0.0009 @10GHz): Industry-leading low loss tangent minimizes millimeter-wave signal attenuation, critical for long-range automotive radar and high-gain satellite antennas.

3)Near-Zero Moisture Absorption (0.02%): Resists humidity-induced Dk shift, preserving stable RF performance in harsh automotive and aerospace temperature-humidity cycling environments.

4)High Copper Peel Strength: Maintains robust copper foil adhesion under high-temperature rework and thermal cycling, reducing delamination field failures.

5)Uniform, Tightly Toleranced Dk: Customizable dielectric constant with±0.02 tolerance eliminates unpredictable impedance drift for precision mmWave filter and coupler circuits.

6)Laser Ablatable Dielectric: Compatible with laser microvia processing for fine-line dense RF layouts, matching the 6/10mil trace routing capability of the target PCB design.

7)Aerospace-Qualified Low Outgassing: NASA outgassing metrics of 0.01% TML/CVCM/WVR meet satellite and avionics vacuum environment reliability standards, with UL-94 V-0 flame retardant safety rating.

2.5 Official TLY-5 Target Application Mapping

The substrate’s electrical and mechanical performance profile targets exclusive high-frequency millimeter-wave vertical markets, fully aligned with the use case of the 7.5mil EPIG PCB:

• Automotive 77GHz radar sensors
• Satellite & cellular millimeter-wave communication antennas
• RF power amplifiers
• LNB, LNA, LNC low-noise receiver front-end modules
• Manned/unmanned aerospace avionics hardware
• Ka-band, E-band, W-band high-frequency filter, coupler and phased array antenna systems

Conclusion for TLY-5 CCL Substrate Module

AGC TLY-5 woven fiberglass PTFE copper clad laminate is a premium high-frequency substrate engineered to resolve core limitations of conventional chopped-fiber PTFE materials, with validated ultra-low loss tangent, precise dielectric constant control, superior dimensional stability and aerospace-grade environmental reliability. The 7.5mil thin core variant selected for the paired EPIG PCB strikes an optimal balance between ultra-thin form factor, consistent RF impedance and manufacturability for mass automotive radar production. Standardized test metrics, wide available thickness and panel sizing, laser processing compatibility and low outgassing certification make TLY-5 a versatile single-core dielectric solution covering commercial millimeter-wave, automotive and aerospace RF hardware. Its measurable production yield advantage and stable electrical performance across 10–77GHz frequency bands position it as a differentiated substrate choice vs. competing PTFE composite laminates for high-volume precision RF PCB designs.