F4BME220 High Frequency PCB PTFE DK2.2 Dual Layer Cheap RF PWB for Couplers
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Brief Introduction
This F4BME220 PCB features a size of 100 x 100 mm and is designed as a double-sided board with two layers. It supports surface mount components while excluding through-hole components. The layer stackup consists of a top layer made of 35 µm (1 oz) copperstartingwith0.5ozplating, paired with a robust F4BME220 core material of 1.0 mm thickness, and a matching 35 µm (1 oz) copper bottom layer. The surface finish is OSP (Organic Solderability Preservative), ensuring reliable soldering performance. Notably, this PCB does not have a solder mask applied.
Here are the details in table below.
PCB Specifications
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PCB SIZE
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100 x 100mm=1PCS
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BOARD TYPE
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Double sided PCB
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Number of Layers
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2 layers
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Surface Mount Components
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YES
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Through Hole Components
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NO
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LAYER STACKUP
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copper ------- 35um(0.5 oz +plate) TOP layer
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F4BME220 1.0mm
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copper ------- 35um(0.5 oz + plate) BOT Layer
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TECHNOLOGY
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Minimum Trace and Space:
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10 mil / 10 mil
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Minimum / Maximum Holes:
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0.4 mm / 0.4 mm
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Number of Different Holes:
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1
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Number of Drill Holes:
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1
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Number of Milled Slots:
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0
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Number of Internal Cutouts:
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0
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Impedance Control:
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no
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Number of Gold finger:
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0
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BOARD MATERIAL
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Glass Epoxy:
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F4BME220 DK 2.2
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Final foil external:
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1oz
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Final foil internal:
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N/A
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Final height of PCB:
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1.1 mm ±10%
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PLATING AND COATING
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Surface Finish
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OSP
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Solder Mask Apply To:
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no
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Solder Mask Color:
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no
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Solder Mask Type:
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no
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CONTOUR/CUTTING
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Routing
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MARKING
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Side of Component Legend
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NO
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Colour of Component Legend
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NO
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Manufacturer Name or Logo:
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Marked on the board in a conductor and leged FREE AREA
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VIA
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Non-Plated through hole(PTH), minimum size 0.4mm.
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FLAMIBILITY RATING
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UL 94-V0 Approval MIN.
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DIMENSION TOLERANCE
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|
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Outline dimension:
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0.0059"
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Board plating:
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0.0029"
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Drill tolerance:
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0.002"
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TEST
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100% Electrical Test prior shipment
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TYPE OF ARTWORK TO BE SUPPLIED
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email file, Gerber RS-274-X, PCBDOC etc
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SERVICE AREA
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Worldwide, Globally.
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F4BME High Frequency Laminates
F4BME series laminates are made by scientifically formulating and strictly pressing a combination of fiberglass cloth, polytetrafluoroethylene resin, and polytetrafluoroethylene film. Its electrical performance is improved compared to F4B, mainly due to a wider range of dielectric constants, lower dielectric loss, increased insulation resistance, and improved stability. It can replace similar foreign products.
Features
◆ DK2.17～3.0 is optional, and DK can be customized
◆ Low loss
◆ F4BME with RTF copper foil has excellent PIM index
◆ Diversified size and cost saving
◆ Irradiation resistance and low exhaust
◆ Commercialization, mass production and high cost performance
Typical Applications
◆ Microwave, RF, radar
◆ Phase shifter, passive components
◆ Power divider, coupler and combiner
◆ Feed network, phased array antenna
◆ Satellite communication, base station antenna
Our PCB Capability(F4BME)
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PCB Capability (F4BME)
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PCB Material:
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PTFE glass fiber cloth copper clad laminates
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Designation (F4BME )
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F4BME
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DK (10GHz)
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DF (10 GHz)
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F4BME217
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2.17±0.04
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0.0010
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F4BME220
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2.20±0.04
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0.0010
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F4BME233
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2.33±0.04
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0.0011
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F4BME245
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2.45±0.05
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0.0012
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F4BME255
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2.55±0.05
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0.0013
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F4BME265
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2.65±0.05
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0.0013
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F4BME275
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2.75±0.05
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0.0015
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F4BME294
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2.94±0.06
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0.0016
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F4BME300
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3.00±0.06
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0.0017
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Layer count:
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Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB
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Copper weight:
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0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
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Dielectric thickness (or overall thickness)
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0.127mm (dielectric), 0.2mm, 0.25mm, 0.5mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.5mm, 1.524mm, 1.575mm, 2.0mm, 2.5mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm
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PCB size:
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≤400mm X 500mm
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Solder mask:
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Green, Black, Blue, Yellow, Red etc.
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Surface finish:
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Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..
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Data Sheets (F4BME)
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Product Technical Parameters
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Product Model & Data Sheet
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Product Features
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Test Conditions
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Unit
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F4BME217
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F4BME220
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F4BME233
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F4BME245
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F4BME255
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F4BME265
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F4BME275
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F4BME294
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F4BME300
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Dielectric Constant (Typical)
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10GHz
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/
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2.17
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2.2
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2.33
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2.45
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2.55
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2.65
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2.75
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2.94
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3.0
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Dielectric Constant Tolerance
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/
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/
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±0.04
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±0.04
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±0.04
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±0.05
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±0.05
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±0.05
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±0.05
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±0.06
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±0.06
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Loss Tangent (Typical)
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10GHz
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/
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0.001
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0.001
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0.0011
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0.0012
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0.0013
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0.0013
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0.0015
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0.0016
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0.0017
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20GHz
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/
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0.0014
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0.0014
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0.0015
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0.0017
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0.0018
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0.0019
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0.0021
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0.0023
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0.0025
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Dielectric Constant Temperature Coefficient
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-55ºC～150ºC
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PPM/℃
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-150
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-142
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-130
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-120
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-110
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-100
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-92
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-85
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-80
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Peel Strength
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1 OZ F4BM
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N/mm
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>1.8
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>1.8
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>1.8
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>1.8
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>1.8
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>1.8
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>1.8
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>1.8
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>1.8
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1 OZ F4BME
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N/mm
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>1.6
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>1.6
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>1.6
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>1.6
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>1.6
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>1.6
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>1.6
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>1.6
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>1.6
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Volume Resistivity
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Standard Condition
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MΩ.cm
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≥6×10^6
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≥6×10^6
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≥6×10^6
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≥6×10^6
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≥6×10^6
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≥6×10^6
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≥6×10^6
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≥6×10^6
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≥6×10^6
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Surface Resistivity
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Standard Condition
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MΩ
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≥1×10^6
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≥1×10^6
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≥1×10^6
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≥1×10^6
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≥1×10^6
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≥1×10^6
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≥1×10^6
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≥1×10^6
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≥1×10^6
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Electrical Strength (Z direction)
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5KW，500V/s
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KV/mm
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>23
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>23
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>23
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>25
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>25
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>25
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>28
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>30
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>30
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Breakdown Voltage (XY direction)
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5KW，500V/s
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KV
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>30
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>30
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>32
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>32
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>34
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>34
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>35
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>36
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>36
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Coefficientof Thermal Expansion
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XY direction
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-55 º~288ºC
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ppm/ºC
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25, 34
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25, 34
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22, 30
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20, 25
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16, 21
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14, 17
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14, 16
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12, 15
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12, 15
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Z direction
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-55 º~288ºC
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ppm/ºC
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240
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240
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205
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187
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173
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142
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112
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98
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95
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Thermal Stress
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260℃, 10s，3 times
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No delamination
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No delamination
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No delamination
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No delamination
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No delamination
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No delamination
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No delamination
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No delamination
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No delamination
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Water Absorption
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20±2℃, 24 hours
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%
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≤0.08
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≤0.08
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≤0.08
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≤0.08
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≤0.08
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≤0.08
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≤0.08
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≤0.08
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≤0.08
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Density
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Room Temperature
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g/cm3
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2.17
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2.18
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2.20
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2.22
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2.25
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2.25
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2.28
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2.29
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2.29
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Long-Term Operating Temperature
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High-Low Temperature Chamber
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℃
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-55～+260
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-55～+260
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-55～+260
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-55～+260
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-55～+260
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-55～+260
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-55～+260
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-55～+260
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-55～+260
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Thermal Conductivity
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Z direction
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W/(M.K)
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0.24
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0.24
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0.28
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0.30
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0.33
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0.36
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0.38
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0.41
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0.42
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PIM
|
Only applicable to F4BME
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dBc
|
≤-159
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≤-159
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≤-159
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≤-159
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≤-159
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≤-159
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≤-159
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≤-159
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≤-159
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Flammability
|
/
|
UL-94
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V-0
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V-0
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V-0
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V-0
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V-0
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V-0
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V-0
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V-0
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V-0
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Material Composition
|
/
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/
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PTFE, Fiberglass Cloth
F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil.
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