F4BTM350 High Frequency PCB Board DK3.5 1.5mm PTFE Plate with 3oz Copper and Immersion Silver
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
PCB Specifications Overview
Thisis a double-sided printed circuit board (PCB)built on F4BTM350 high frequency substrates with a compact size of 67mm x 85 mm and Top surface mount components. The layer stackup includes a robust combination of 3oz copper and F4BTM350 dielectric material, providing excellent electrical conductivity and thermal management. The PCB is finished with immersion silver, enhancing solderability and surface protection, while a green solder mask is applied to the top side for aesthetic appeal and durability. Below are the detailed specifications for this PCB design:
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PCB SIZE
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67mm x 85 mm =1up
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BOARD TYPE
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Double sided PCB
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Number of Layers
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2 layers
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Surface Mount Components
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YES
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Through Hole Components
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NO
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LAYER STACKUP
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copper ------- 105 um(2 oz+plate) TOP layer
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F4BTM350 - 1.524mm
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copper ------- 105 um(2 oz + plate) BOT Layer
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TECHNOLOGY
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Minimum Trace and Space:
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7.9 mil / 5.9 mil
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Minimum / Maximum Holes:
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0.4 mm / 0.4 mm
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Number of Different Holes:
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1
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Number of Drill Holes:
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1
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Number of Milled Slots:
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0
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Number of Internal Cutouts:
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0
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Impedance Control:
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no
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Number of Gold finger:
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0
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BOARD MATERIAL
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Glass Epoxy:
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F4BTM350 DK3.5
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Final foil external:
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3 oz
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Final foil internal:
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N/A
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Final height of PCB:
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1.6 mm
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PLATING AND COATING
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Surface Finish
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Immersion Silver
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Solder Mask Apply To:
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Top side
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Solder Mask Color:
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Green
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Solder Mask Type:
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N/A
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CONTOUR/CUTTING
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Routing
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MARKING
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Side of Component Legend
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N/A
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Colour of Component Legend
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N/A
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Manufacturer Name or Logo:
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N/A
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VIA
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Plated through hole(PTH), minimum size 0.4mm.
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FLAMIBILITY RATING
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UL 94-V0 Approval MIN.
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DIMENSION TOLERANCE
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Outline dimension:
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0.0059"
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Board plating:
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0.0029"
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Drill tolerance:
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0.002"
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TEST
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100% Electrical Test prior shipment
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TYPE OF ARTWORK TO BE SUPPLIED
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email file, Gerber RS-274-X, PCBDOC etc
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SERVICE AREA
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Worldwide, Globally.
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F4BTM High Frequency Laminates
F4BTM series high frequency laminates are made of glass fiber cloth, nano-ceramic filling and polytetrafluoroethylene resin after scientific preparation and strict process pressing.
This F4BTM series of products is based on the F4BM dielectric layer, and the materials are added with high-dielectric and low-loss nanoscale ceramics, thus obtaining higher dielectric constant, better heat resistance, lower coefficient of thermal expansion, higher insulation resistance, better thermal conductivity, while maintaining the characteristics of low loss.
F4BTM Features
DK 2.98-3.5 optional
Adding ceramic improves performance
Excellent PIM indicators
Rich thickness ranging 0.254mm to 12mm
Diversified size 460mm x 610mm to 914mm x 1220mm
Cost saving
Commercialization for mass production
High cost performance
Anti radiation
Low exhaust
Optional copper foil
ED copper of 0.5oz, 1oz, 1.5oz, 2oz
DataSheet (F4BTM)
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Product Technical Parameters
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Product Models & Data Sheet
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Product Features
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Test Conditions
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Unit
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F4BTM298
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F4BTM300
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F4BTM320
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F4BTM350
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Dielectric Constant (Typical)
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10GHz
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/
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2.98
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3.0
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3.2
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3.5
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Dielectric Constant Tolerance
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/
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/
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±0.06
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±0.06
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±0.06
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±0.07
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Loss Tangent (Typical)
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10GHz
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/
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0.0018
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0.0018
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0.0020
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0.0025
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20GHz
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/
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0.0023
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0.0023
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0.0026
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0.0035
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Dielectric Constant Temperature Coefficient
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-55 º~150ºC
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PPM/℃
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-78
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-75
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-75
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-60
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Peel Strength
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1 OZ F4BTM
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N/mm
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>1.6
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>1.6
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>1.6
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>1.6
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1 OZ F4BTME
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N/mm
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>1.4
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>1.4
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>1.4
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>1.4
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Volume Resistivity
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Standard Condition
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MΩ.cm
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≥1×10^7
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≥1×10^7
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≥1×10^7
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≥1×10^7
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Surface Resistivity
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Standard Condition
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MΩ
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≥1×10^6
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≥1×10^6
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≥1×10^6
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≥1×10^6
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Electrical Strength (Z direction)
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5KW，500V/s
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KV/mm
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>26
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>30
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>32
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>32
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Breakdown Voltage (XY direction)
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5KW，500V/s
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KV
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>34
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>35
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>40
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>40
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Coefficientof Thermal Expansion
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XY direction
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-55 º~288ºC
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ppm/ºC
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15，16
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15，16
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13，15
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10，12
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Z direction
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-55 º~288ºC
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ppm/ºC
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78
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72
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58
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51
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Thermal Stress
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260℃, 10s，3 times
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No delamination
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No delamination
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No delamination
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No delamination
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Water Absorption
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20±2℃, 24 hours
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%
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≤0.05
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≤0.05
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≤0.05
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≤0.05
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Density
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Room Temperature
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g/cm3
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2.25
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2.25
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2.20
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2.20
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Long-Term Operating Temperature
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High-Low Temperature Chamber
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℃
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-55～+260
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-55～+260
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-55～+260
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-55～+260
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Thermal Conductivity
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Z direction
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W/(M.K)
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0.42
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0.42
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0.50
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0.54
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PIM
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Only applicable to F4BTME
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dBc
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≤-160
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≤-160
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≤-160
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≤-160
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Flammability
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/
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UL-94
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V-0
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V-0
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V-0
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V-0
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Material Composition
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/
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PTFE, Fiberglass Cloth, nano-ceramics
F4BTM paired with ED copper foil, F4BTME paired with reverse-treated (RTF) copper foil.
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