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F4BTME298 high frequency PCB stands as a testament to the relentless pursuit of excellence in the field of connectivity solutions.
Item NO.:
BIC-262-v328.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
F4BTME298 PCB 60mil 1.524 mm 2-layer F4BTME Series High Frequency Circuit Boards
The F4BTME298 PCB, a pinnacle in modern PCB technology, is a product of unparalleled precision and innovation. Designed to meet the exacting demands of high-frequency applications, this PCB offers a host of features and capabilities that set it apart in the realm of connectivity solutions.
1. Introduction to F4BTME Series
The F4BTME series laminates represents a fusion of cutting-edge materials and advanced manufacturing techniques. By combining glass fiber cloth, nano-ceramic fillers, and polytetrafluoroethylene (PTFE) resin, these laminates deliver a superior performance that surpasses conventional PCB substrates.
At the core of the F4BTME series lies the F4BM dielectric layer, which is enriched with high dielectric constant nano-ceramics. This integration imbues the laminates with enhanced dielectric properties, exceptional heat resistance, reduced thermal expansion, improved insulation, and superior thermal conductivity—all while maintaining minimal signal loss characteristics.
Moreover, the 60mil F4BTME laminates are meticulously paired with reverse-treated RTF copper foil, ensuring outstanding performance in terms of PIM (Passive Intermodulation), precise line control, and minimized conductor loss.
2. Features of F4BTME298 PCB
Dielectric Constant: 2.98 +/- 0.06 at 10GHz
Dissipation Factor: 0.0018 at 10GHz, 0.0023 at 20GHz
Coefficient of Thermal Expansion (CTE):
x-axis: 15 ppm/°C
y-axis: 16 ppm/°C
z-axis: 78 ppm/°C
Temperature Range: -55°C to 288°C
Low Thermal Coefficient of Dk: -78 ppm/°C, -55°C to 150°C
PIM Value: <-160 dbc
Moisture Absorption: 0.05%
3. PCB Stackup and Construction Details
Stackup:2 layer circuit board
Copper Layer 1: 35μm
F4BTME298 Core: 1.524 mm (60mil)
Copper Layer 2: 35μm
|
Parameter |
Value |
|
Board Dimensions |
51.51mm x 111.92 mm = 1PCS, +/- 0.15mm |
|
Minimum Trace/Space |
6/5 mils |
|
Minimum Hole Size |
0.3mm |
|
Blind Vias |
No |
|
Finished Board Thickness |
1.6mm |
|
Finished Cu Weight |
1oz (1.4 mils) outer layers |
|
Via Plating Thickness |
20 μm |
|
Surface Finish |
Immersion Gold |
|
Top Silkscreen |
White |
|
Bottom Silkscreen |
No |
|
Top Solder Mask |
Green |
|
Bottom Solder Mask |
No |
|
Electrical Test |
100% prior to shipment |
4. PCB Statistics
|
Statistics |
Value |
|
Components |
29 |
|
Total Pads |
75 |
|
Thru Hole Pads |
52 |
|
Top SMT Pads |
23 |
|
Bottom SMT Pads |
0 |
|
Vias |
41 |
|
Nets |
3 |
5. Additional Information
Type of Artwork Supplied: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide
6. Typical Applications
The versatility and reliability of the F4BTME298 wholesale high frequency PCB make it an ideal choice for a wide range of applications, including:
Aerospace equipment, space, and cabin equipment
Microwave and RF devices
Radar systems, especially military radar
Feed networks
Phase-sensitive antennas and phased array antennas
Satellite communications, and more.
In conclusion, the F4BTME298 high frequency PCB stands as a testament to the relentless pursuit of excellence in the field of connectivity solutions. With its unmatched performance characteristics and broad applicability, this PCB is poised to drive innovation and empower the next generation of high-performance electronic devices.
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RF-35 PCB 60mil 1.524mm Taconic laminates 2-layer High Frequency Circuit BoardNext:
TLX-0 PCB 5mil RF Microwave Taconic Substrates 2-layer High Frequency LaminateIf you have questions or suggestions,please leave us a message,we will reply you as soon as we can!
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