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The RF-35PCB represents the pinnacle of Taconic's expertise in ceramic fill technology and coated PTFE fiberglass. Crafted from woven glass reinforcement, the 60mil RF-35 PCB is tailored for low-cost, high-volume commercial microwave and radio frequency applications.
Item NO.:
BIC-263-v329.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
RF-35 PCB 60mil 1.524mm Taconic laminates 2-layer High Frequency Circuit Board
In the realm of high-volume commercial microwave and radio frequency applications, the RF-35 PCB emerges as a pinnacle of innovation and efficiency. Developed as part of Taconic ORCER family, the Taconic RF-35 leverages organic-ceramic technology and woven glass reinforcement to deliver exceptional performance and reliability. Let's delve deeper into the features, benefits, construction details, and applications of the RF-35 PCB to understand why it stands out as a preferred choice for discerning engineers and manufacturers worldwide.
1. Introduction to RF-35 PCB
The RF-35 PCB represents the pinnacle of Taconic's expertise in ceramic fill technology and coated PTFE fiberglass. Crafted from woven glass reinforcement, the 60mil RF-35 PCB is tailored for low-cost, high-volume commercial microwave and radio frequency applications. Its exceptional peel strength, especially with 1/2 ounce and 1 ounce copper, sets it apart from standard epoxy materials, making it an ideal choice for scenarios requiring rework. Additionally, its ultra-low moisture absorption rate and minimal dissipation factor ensure minimal phase shift with frequency variations.
2. Features of RF-35 PCB
Dielectric Constant at 1.9GHz: 3.5
Dissipation Factor at 1.9GHz: 0.0018
Dielectric Breakdown: 41 kV
CTE:
X-axis: 19 ppm/°C
Y-axis: 24 ppm/°C
Z-axis: 64 ppm/°C
Flammability: UL-94 V0
3. Benefits of RF-35 PCB
Cost-Effective Solution: Ideal for high-volume production.
Exceptional Peel Strength: Facilitates rework processes.
Ultra-Low Dissipation Factor: Minimizes signal loss.
Low Moisture Absorption: Ensures stable performance.
Enhanced Surface Smoothness: Promotes signal integrity.
4. PCB Stackup and Construction Details
Stackup:2 layer circuit board rigid PCB
Copper Layer 1: 35μm
RF-35 Core: 60mil (1.524 mm)
Copper Layer 2: 35μm
Construction Details |
Value |
Board Dimensions |
45.9mm x 30.5mm = 1PCS, +/- 0.15mm |
Minimum Trace/Space |
5/5 mils |
Minimum Hole Size |
0.3mm |
Blind Vias |
No |
Finished Board Thickness |
1.6mm |
Finished Cu Weight |
1oz (1.4 mils) outer layers |
Via Plating Thickness |
25 μm |
Surface Finish |
HASL |
Top Silkscreen |
White |
Bottom Silkscreen |
No |
Top Solder Mask |
No |
Bottom Solder Mask |
No |
Electrical Test |
100% prior to shipment |
5. PCB Statistics
PCB Statistics |
Value |
Components |
16 |
Total Pads |
35 |
Thru Hole Pads |
21 |
Top SMT Pads |
14 |
Bottom SMT Pads |
0 |
Vias |
19 |
Nets |
2 |
6. Additional Information
Type of Artwork Supplied: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide
7. Applications of RF-35 PCB
The RF-35 Taconic PCB materials finds optimal utility in a range of applications, including:
Power Amplifiers: Ensuring efficient power distribution.
Filters and Couplers: Facilitating signal filtration and distribution.
Passive Components: Supporting various passive circuit elements.
In essence, the RF-35 Taconic PCB embodies a fusion of cutting-edge technology and cost-effectiveness, making it the go-to choice for high-performance commercial microwave and RF applications. With its exceptional characteristics and versatile applications, the RF-35 Taconic laminates PCB is set to revolutionize connectivity solutions across industries worldwide.
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