
Call Us Now !
Tel : +86 755 27374946
Order Online Now !
Email : info@bichengpcb.com
The F4BTMS1000 High Frequency Circuit Board is a state-of-the-art solution for high-performance applications in aerospace, RF, and microwave industries.
Item NO.:
BIC-311-v387.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
F4BTMS1000 PCB 4-layer 12.9mm Thick DK10.2 Multilayer High Frequency Circuit Board
The F4BTMS1000 PCB is a cutting-edge, high-reliability4 layer PCB designed to meet the demanding requirements of advanced aerospace, RF, and microwave applications. As part of the F4BTMS series PCB, this PCB represents a significant technological leap in material formulation and manufacturing processes, offering unparalleled performance and reliability. Whether you're developing aerospace equipment, radar systems, or satellite communication devices, the F4BTMS1000 Multilayer PCB is engineered to deliver exceptional electrical, thermal, and mechanical properties.
Key Features of the F4BTMS1000 PCB
1.Advanced Material Composition
The F4BTMS1000DK10.2PCB is constructed using a unique material formulation enriched with a high percentage of ceramics and reinforced with ultra-thin, ultra-fine glass fiber cloth. This innovative combination minimizes the negative effects of glass fiber on electromagnetic wave propagation, resulting in:
2.Exceptional Electrical Performance
These properties make the F4BTMS1000 wholesale multilayer PCB ideal for high-frequency applications, ensuring minimal signal loss and superior signal integrity.
3.Thermal and Mechanical Stability
These characteristics ensure the F4B substrate PCB can withstand extreme temperatures and harsh environmental conditions, making it suitable for aerospace and military applications.
PCB Stackup
The F4BTMS1000 PCB features a 4-layer PCB stackup optimized for high-frequency performance and thermal management:
Layer |
Material/Description |
Thickness |
Copper Layer 1 |
Copper |
35 μm |
Core 1 |
F4BTMS1000 Core |
6.35 mm (250 mil) |
Copper Layer 2 |
Copper |
35 μm |
Prepreg |
RO4450F Prepreg |
0.102 mm (4 mil) |
Copper Layer 3 |
Copper |
35 μm |
Core 2 |
F4BTMS1000 Core |
6.35 mm (250 mil) |
Copper Layer 4 |
Copper |
35 μm |
PCB Construction details
Parameter |
Details |
Board Dimensions |
145mm x 145mm = 1PCS, ±0.15mm |
Minimum Trace/Space |
5/7 mils |
Minimum Hole Size |
1.2mm |
Blind Vias |
No |
Finished Board Thickness |
12.9mm |
Finished Cu Weight |
Inner Layer/Outer Layer: 1oz (1.4 mils) |
Via Plating Thickness |
20 μm |
Surface Finish |
HASL (Hot Air Solder Leveling) |
Top Silkscreen |
No |
Bottom Silkscreen |
No |
Top Solder Mask |
No |
Bottom Solder Mask |
No |
Electrical Testing |
100% tested prior to shipment |
PCB Statistic
Parameter |
Count |
Components |
19 |
Total Pads |
77 |
Thru Hole Pads |
35 |
Top SMT Pads |
42 |
Bottom SMT Pads |
0 |
Vias |
32 |
Nets |
2 |
Applications of the F4BTMS1000 PCB
The F4BTMS1000 PCB is designed for use in high-reliability applications, including:
- Aerospace equipment, space and cabin equipment
- Microwave, RF
- Radar, military radar
- Feed networks
- Phase-sensitive antennas, phased array antennas
- Satellite communications, and more.
Why Choose the F4BTMS1000 PCB?
1.Technological Breakthrough:
The F4BTMS series material incorporates advanced material science, including nano-ceramics and ultra-fine glass fiber cloth, to deliver superior performance.
2.Global Availability:
The F4BTMS1000 PCB is available worldwide, ensuring timely delivery for your projects.
3.Cost-Effective Alternative:
This PCB is a reliable replacement for similar foreign products, offering comparable or better performance at a competitive price.
4.Proven Reliability:
With IPC-Class-2 quality standards and 100% electrical testing, the F4BTMS1000 PCB guarantees high reliability and performance.
Conclusion
The F4BTMS1000 High Frequency Circuit Board is a state-of-the-art solution for high-performance applications in aerospace, RF, and microwave industries. With its advanced material composition, exceptional electrical and thermal properties, and robust construction, this PCB is engineered to meet the most demanding requirements. Whether you're designing cutting-edge radar systems, satellite communication devices, or aerospace equipment, the F4BTMS1000 substrate PCB delivers unmatched reliability and performance.
For more information or to place an order, contact us today and experience the next generation of high-performance PCBs.
Previous:
10 OZ Heavy Copper TU-865 High TG Material Double Sided PCB with ENIGNext:
Isola FR408HR TG190 4-Layer Multilayer High TG PCB Via in Pad 1.6mm ENIGIf you have questions or suggestions,please leave us a message,we will reply you as soon as we can!
Categories
New Products
Wangling F4BM220 PCB 2-layer 6.0mm Thick ENIG F4BM Series High Frequency Laminates
RO3006 PCB 2-layer 10mil 0.254mm Rogers 3006 ENIG High Frequency Circuit Board
RO3210 PCB 4-layer 1.22mm Thick Rogers 3210 Laminate ENIG Multilayer Board
RO3010 PCB 4-layer 2.6mm Thick Rogers 3010 Immersion Tin Blind Vias
RO4003C PCB 3-layer 1.8mm Thick Rogers 4003C ENIG Blind Via Multilayer Board
Wangling TP1020 PCB 2-Layer 6.0mm Thick DK10.2 ENIG High Frequency Board
Rogers RT/duroid 5880 RO4450F 3-layer PCB 3.3mm Immersion Gold Finish Multilayer Board
RO4830 Plus PCB 2-layer 5mil 0.127mm Rogers 4830 High Frequency Material ENIG
© Copyright: 2025 Shenzhen Bicheng Electronics Technology Co., Ltd.. All Rights Reserved.
IPv6 network supported