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Home Newly Shipped RF PCB F4BTMS1000 PCB 4-layer 12.9mm Thick DK10.2 Multilayer High Frequency Circuit Board

F4BTMS1000 PCB 4-layer 12.9mm Thick DK10.2 Multilayer High Frequency Circuit Board

The F4BTMS1000 High Frequency Circuit Board is a state-of-the-art solution for high-performance applications in aerospace, RF, and microwave industries.

  • Item NO.:

    BIC-311-v387.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


F4BTMS1000 PCB 4-layer 12.9mm Thick DK10.2 Multilayer High Frequency Circuit Board

 

The F4BTMS1000 PCB is a cutting-edge, high-reliability4 layer PCB designed to meet the demanding requirements of advanced aerospace, RF, and microwave applications. As part of the F4BTMS series PCB, this PCB represents a significant technological leap in material formulation and manufacturing processes, offering unparalleled performance and reliability. Whether you're developing aerospace equipment, radar systems, or satellite communication devices, the F4BTMS1000 Multilayer PCB is engineered to deliver exceptional electrical, thermal, and mechanical properties.

 

Key Features of the F4BTMS1000 PCB

 

1.Advanced Material Composition

The F4BTMS1000DK10.2PCB is constructed using a unique material formulation enriched with a high percentage of ceramics and reinforced with ultra-thin, ultra-fine glass fiber cloth. This innovative combination minimizes the negative effects of glass fiber on electromagnetic wave propagation, resulting in:


  • Low dielectric loss
  • Enhanced dimensional stability
  • Reduced X/Y/Z anisotropy
  • Improved thermal conductivity
  • Stable dielectric temperature characteristics


 

2.Exceptional Electrical Performance


  • Dielectric Constant (Dk): 10.2 at 10GHz
  • Dissipation Factor (Df): 0.0020 at 10GHz, 0.0023 at 20GHz
  • Low Thermal Coefficient of Dk: -320 ppm/°C (-55°C to 150°C)


 

These properties make the F4BTMS1000 wholesale multilayer PCB ideal for high-frequency applications, ensuring minimal signal loss and superior signal integrity.

 

3.Thermal and Mechanical Stability


  • Coefficient of Thermal Expansion (CTE):
         X-axis: 16 ppm/°C
         Y-axis: 18 ppm/°C
         Z-axis: 32 ppm/°C (-55°C to 288°C)
  • Thermal Conductivity: 0.81 W/mk
  • Moisture Absorption: 0.03%


 

These characteristics ensure the F4B substrate PCB can withstand extreme temperatures and harsh environmental conditions, making it suitable for aerospace and military applications.


F4BTMS1000 PCB 4-layer

 

 

PCB Stackup

The F4BTMS1000 PCB features a 4-layer PCB stackup optimized for high-frequency performance and thermal management:

 

Layer

Material/Description

Thickness

Copper Layer 1

Copper

35 μm

Core 1

F4BTMS1000 Core

6.35 mm (250 mil)

Copper Layer 2

Copper

35 μm

Prepreg

RO4450F Prepreg

0.102 mm (4 mil)

Copper Layer 3

Copper

35 μm

Core 2

F4BTMS1000 Core

6.35 mm (250 mil)

Copper Layer 4

Copper

35 μm

 

 

PCB Construction details

 

Parameter

Details

Board Dimensions

145mm x 145mm = 1PCS, ±0.15mm

Minimum Trace/Space

5/7 mils

Minimum Hole Size

1.2mm

Blind Vias

No

Finished Board Thickness

12.9mm

Finished Cu Weight

Inner Layer/Outer Layer: 1oz (1.4 mils)

Via Plating Thickness

20 μm

Surface Finish

HASL (Hot Air Solder Leveling)

Top Silkscreen

No

Bottom Silkscreen

No

Top Solder Mask

No

Bottom Solder Mask

No

Electrical Testing

100% tested prior to shipment

 

 

PCB Statistic

 

Parameter

Count

Components

19

Total Pads

77

Thru Hole Pads

35

Top SMT Pads

42

Bottom SMT Pads

0

Vias

32

Nets

2

 

 

Applications of the F4BTMS1000 PCB

The F4BTMS1000 PCB is designed for use in high-reliability applications, including:

 

- Aerospace equipment, space and cabin equipment

- Microwave, RF

- Radar, military radar

- Feed networks

- Phase-sensitive antennas, phased array antennas

- Satellite communications, and more.

 

 

Why Choose the F4BTMS1000 PCB?

 

1.Technological Breakthrough:

The F4BTMS series material incorporates advanced material science, including nano-ceramics and ultra-fine glass fiber cloth, to deliver superior performance.

 

2.Global Availability:

The F4BTMS1000 PCB is available worldwide, ensuring timely delivery for your projects.

 

3.Cost-Effective Alternative:

This PCB is a reliable replacement for similar foreign products, offering comparable or better performance at a competitive price.

 

4.Proven Reliability: 

With IPC-Class-2 quality standards and 100% electrical testing, the F4BTMS1000 PCB guarantees high reliability and performance.

 

 

Conclusion

The F4BTMS1000 High Frequency Circuit Board is a state-of-the-art solution for high-performance applications in aerospace, RF, and microwave industries. With its advanced material composition, exceptional electrical and thermal properties, and robust construction, this PCB is engineered to meet the most demanding requirements. Whether you're designing cutting-edge radar systems, satellite communication devices, or aerospace equipment, the F4BTMS1000 substrate PCB delivers unmatched reliability and performance.

 

For more information or to place an order, contact us today and experience the next generation of high-performance PCBs.





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