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Home Newly Shipped RF PCB F4BM265 High Frequency PCB DK 2.65 PTFE RF Circuit Board with 3oz Copper Coating Immersion Gold

F4BM265 High Frequency PCB DK 2.65 PTFE RF Circuit Board with 3oz Copper Coating Immersion Gold

F4BM series laminates are made by scientifically formulating and strictly pressing a combination of fiberglass cloth, polytetrafluoroethylene resin, and polytetrafluoroethylene film.

  • Item NO.:

    BIC-098-v364.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


F4BM265 High Frequency PCB DK 2.65 PTFE RF Circuit Board with 3oz Copper Coating Immersion Gold

(PCB's are custom-made products, the picture and parameters shown are just for reference)

 

Hello everybody,

Today we talk about a type of F4BM high frequency circuit board.

 

F4BM series laminates are made by scientifically formulating and strictly pressing a combination of fiberglass cloth, polytetrafluoroethylene resin, and polytetrafluoroethylene film. Its electrical performance is improved compared to F4B, mainly due to a wider range of dielectric constants, lower dielectric loss, increased insulation resistance, and improved stability. It can replace similar foreign products.

 

PCB Specifications

Layer count:

Double sided

Designator

F4BM265 (DK 2.65)

Dimension:

210 x 115mm/1up

Finished thickness

1.6mm ±10%

Finished Copper weight:

3oz

SMOBC:

No

Surface finish:

Immersion gold

 

The main specifications of this board is double sided board, substrate is F4BM265 with DK value at 2.65, 210mm long by 115mm wide, 1.6mm finished thick, finished copper 3oz, no solder mask no silkscreen, and surface finish is immersion gold.

 

Let’s see the stack up.


F4BM265 PCB stackup


Top layer and bottom layer are 3oz copper finished. F4BM265 dielectric material is in the middle of 2 layers copper, showing dielectric constant at 2.65

 

 F4BM265 dielectric material

 

From the photo of this high frequency board, the track is thicker than normal boards; surface finish is immersion gold and no solder mask and silkscreen.

 

OurPCB Capability (F4BM)

PCB Capability (F4BTM) 
PCB Material: PTFE / glass fiber cloth / Nano-ceramic filler
Designation                        (F4BTM ) F4BTM DK (10GHz) DF (10 GHz)
F4BTM298 2.98±0.06 0.0018 
F4BTM300 3.0±0.06 0.0018 
F4BTM320 3.2±0.06 0.0020 
F4BTM350 3.5±0.07 0.0025 
Layer count: Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness               (or overall thickness) 0.25mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.016mm, 1.27mm, 1.524mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..

 

The dielectric constant of F4BM material is wide, ranging 2.17 to 3.0. Board thickness ranges 0.13mm to12.0mm. We can provide you with prototype service, small batches and mass production service.

 

Should you have any questions, please feel free to contact us.

Thank you for your reading.

 

Appendix: Data Sheet(F4BM)

Product Technical Parameters Product Models & Data Sheet
Product Features Test Conditions Unit F4BTM298 F4BTM300 F4BTM320 F4BTM350
Dielectric Constant (Typical) 10GHz / 2.98  3.0  3.2  3.5 
Dielectric Constant Tolerance / / ±0.06 ±0.06 ±0.06 ±0.07
Loss Tangent (Typical) 10GHz / 0.0018  0.0018  0.0020  0.0025 
20GHz / 0.0023  0.0023  0.0026  0.0035 
Dielectric Constant Temperature Coefficient -55 º~150ºC PPM/℃ -78  -75  -75  -60 
Peel Strength 1 OZ F4BTM N/mm >1.6 >1.6 >1.6 >1.6
1 OZ F4BTME N/mm >1.4 >1.4 >1.4 >1.4
Volume Resistivity Standard Condition MΩ.cm ≥1×10^7 ≥1×10^7 ≥1×10^7 ≥1×10^7
Surface Resistivity  Standard Condition ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6
Electrical Strength (Z direction) 5KW,500V/s KV/mm >26 >30 >32 >32
Breakdown Voltage (XY direction) 5KW,500V/s KV >34 >35 >40 >40
Coefficientof Thermal Expansion   XY direction -55 º~288ºC ppm/ºC 15,16 15,16 13,15 10,12
Z direction -55 º~288ºC ppm/ºC 78  72  58  51 
Thermal Stress 260℃, 10s,3 times No delamination No delamination No delamination No delamination
Water Absorption 20±2℃, 24 hours % ≤0.05 ≤0.05 ≤0.05 ≤0.05
Density Room Temperature g/cm3 2.25  2.25  2.20  2.20 
Long-Term Operating Temperature High-Low Temperature Chamber -55~+260 -55~+260 -55~+260 -55~+260
Thermal Conductivity Z direction W/(M.K) 0.42  0.42  0.50  0.54 
PIM Only applicable to F4BTME dBc ≤-160 ≤-160 ≤-160 ≤-160
Flammability / UL-94 V-0 V-0 V-0 V-0
Material Composition / / PTFE, Fiberglass Cloth, nano-ceramics
F4BTM paired with ED copper foil, F4BTME paired with reverse-treated (RTF) copper foil.





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