
Call Us Now !
Tel : +86 755 27374946
Order Online Now !
Email : info@bichengpcb.com
F4BM series laminates are made by scientifically formulating and strictly pressing a combination of fiberglass cloth, polytetrafluoroethylene resin, and polytetrafluoroethylene film.
Item NO.:
BIC-098-v364.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
F4BM265 High Frequency PCB DK 2.65 PTFE RF Circuit Board with 3oz Copper Coating Immersion Gold
(PCB's are custom-made products, the picture and parameters shown are just for reference)
Hello everybody,
Today we talk about a type of F4BM high frequency circuit board.
F4BM series laminates are made by scientifically formulating and strictly pressing a combination of fiberglass cloth, polytetrafluoroethylene resin, and polytetrafluoroethylene film. Its electrical performance is improved compared to F4B, mainly due to a wider range of dielectric constants, lower dielectric loss, increased insulation resistance, and improved stability. It can replace similar foreign products.
PCB Specifications
Layer count: |
Double sided |
Designator |
F4BM265 (DK 2.65) |
Dimension: |
210 x 115mm/1up |
Finished thickness |
1.6mm ±10% |
Finished Copper weight: |
3oz |
SMOBC: |
No |
Surface finish: |
Immersion gold |
The main specifications of this board is double sided board, substrate is F4BM265 with DK value at 2.65, 210mm long by 115mm wide, 1.6mm finished thick, finished copper 3oz, no solder mask no silkscreen, and surface finish is immersion gold.
Let’s see the stack up.
Top layer and bottom layer are 3oz copper finished. F4BM265 dielectric material is in the middle of 2 layers copper, showing dielectric constant at 2.65
From the photo of this high frequency board, the track is thicker than normal boards; surface finish is immersion gold and no solder mask and silkscreen.
OurPCB Capability (F4BM)
PCB Capability (F4BTM) | |||
PCB Material: | PTFE / glass fiber cloth / Nano-ceramic filler | ||
Designation (F4BTM ) | F4BTM | DK (10GHz) | DF (10 GHz) |
F4BTM298 | 2.98±0.06 | 0.0018 | |
F4BTM300 | 3.0±0.06 | 0.0018 | |
F4BTM320 | 3.2±0.06 | 0.0020 | |
F4BTM350 | 3.5±0.07 | 0.0025 | |
Layer count: | Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB | ||
Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) | ||
Dielectric thickness (or overall thickness) | 0.25mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.016mm, 1.27mm, 1.524mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm | ||
PCB size: | ≤400mm X 500mm | ||
Solder mask: | Green, Black, Blue, Yellow, Red etc. | ||
Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc.. |
The dielectric constant of F4BM material is wide, ranging 2.17 to 3.0. Board thickness ranges 0.13mm to12.0mm. We can provide you with prototype service, small batches and mass production service.
Should you have any questions, please feel free to contact us.
Thank you for your reading.
Appendix: Data Sheet(F4BM)
Product Technical Parameters | Product Models & Data Sheet | ||||||
Product Features | Test Conditions | Unit | F4BTM298 | F4BTM300 | F4BTM320 | F4BTM350 | |
Dielectric Constant (Typical) | 10GHz | / | 2.98 | 3.0 | 3.2 | 3.5 | |
Dielectric Constant Tolerance | / | / | ±0.06 | ±0.06 | ±0.06 | ±0.07 | |
Loss Tangent (Typical) | 10GHz | / | 0.0018 | 0.0018 | 0.0020 | 0.0025 | |
20GHz | / | 0.0023 | 0.0023 | 0.0026 | 0.0035 | ||
Dielectric Constant Temperature Coefficient | -55 º~150ºC | PPM/℃ | -78 | -75 | -75 | -60 | |
Peel Strength | 1 OZ F4BTM | N/mm | >1.6 | >1.6 | >1.6 | >1.6 | |
1 OZ F4BTME | N/mm | >1.4 | >1.4 | >1.4 | >1.4 | ||
Volume Resistivity | Standard Condition | MΩ.cm | ≥1×10^7 | ≥1×10^7 | ≥1×10^7 | ≥1×10^7 | |
Surface Resistivity | Standard Condition | MΩ | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | |
Electrical Strength (Z direction) | 5KW,500V/s | KV/mm | >26 | >30 | >32 | >32 | |
Breakdown Voltage (XY direction) | 5KW,500V/s | KV | >34 | >35 | >40 | >40 | |
Coefficientof Thermal Expansion | XY direction | -55 º~288ºC | ppm/ºC | 15,16 | 15,16 | 13,15 | 10,12 |
Z direction | -55 º~288ºC | ppm/ºC | 78 | 72 | 58 | 51 | |
Thermal Stress | 260℃, 10s,3 times | No delamination | No delamination | No delamination | No delamination | ||
Water Absorption | 20±2℃, 24 hours | % | ≤0.05 | ≤0.05 | ≤0.05 | ≤0.05 | |
Density | Room Temperature | g/cm3 | 2.25 | 2.25 | 2.20 | 2.20 | |
Long-Term Operating Temperature | High-Low Temperature Chamber | ℃ | -55~+260 | -55~+260 | -55~+260 | -55~+260 | |
Thermal Conductivity | Z direction | W/(M.K) | 0.42 | 0.42 | 0.50 | 0.54 | |
PIM | Only applicable to F4BTME | dBc | ≤-160 | ≤-160 | ≤-160 | ≤-160 | |
Flammability | / | UL-94 | V-0 | V-0 | V-0 | V-0 | |
Material Composition | / | / |
PTFE, Fiberglass Cloth, nano-ceramics F4BTM paired with ED copper foil, F4BTME paired with reverse-treated (RTF) copper foil. |
Previous:
F4BTME300 High Frequency PCB PTFE RF PCB Built on 3.0mm thick with Immersion SilverNext:
F4BTMS615 PCB 2-layer DK6.15 5.08mm Thick F4BTMS Series High Frequency LaminatesIf you have questions or suggestions,please leave us a message,we will reply you as soon as we can!
Categories
New Products
Wangling F4BM220 PCB 2-layer 6.0mm Thick ENIG F4BM Series High Frequency Laminates
RO3006 PCB 2-layer 10mil 0.254mm Rogers 3006 ENIG High Frequency Circuit Board
RO3210 PCB 4-layer 1.22mm Thick Rogers 3210 Laminate ENIG Multilayer Board
RO3010 PCB 4-layer 2.6mm Thick Rogers 3010 Immersion Tin Blind Vias
RO4003C PCB 3-layer 1.8mm Thick Rogers 4003C ENIG Blind Via Multilayer Board
Wangling TP1020 PCB 2-Layer 6.0mm Thick DK10.2 ENIG High Frequency Board
Rogers RT/duroid 5880 RO4450F 3-layer PCB 3.3mm Immersion Gold Finish Multilayer Board
RO4830 Plus PCB 2-layer 5mil 0.127mm Rogers 4830 High Frequency Material ENIG
© Copyright: 2025 Shenzhen Bicheng Electronics Technology Co., Ltd.. All Rights Reserved.
IPv6 network supported