HDI PCB 8-layer 1.5mm TU-883 material Multilayer Board High TG With Blind Via Buried Via Impedance Control

Our 8-layer HDI High Tg PCB with TU-883 material is the ultimate solution for high-performance, high-reliability applications.

Item NO.:
BIC-314-v390.0
Order(MOQ):
1-10
Payment:
T/T
Price Range:1 - 50/$99
Price Range:1 - 50/$2.9
Product Origin:
China
Shipping Port:
Shenzhen
Lead Time:
7-10 days

Product Detail

HDI PCB 8-layer 1.5mm TU-883 material Multilayer Board High TG With Blind Via Buried Via Impedance Control

Overview

Introducing our state-of-the-art 8-layer HDI PCB crafted with TU-883 material, a cutting-edge solution designed for high-speed, low-loss, and high-frequency applications. This RF PCB is engineered to meet the rigorous demands of modern electronics, offering unparalleled performance, reliability, and precision. Whether you're developing advanced telecommunications equipment, high-performance computing systems, or RF/wireless applications, this High-Density Interconnect (HDI) PCB is the ideal choice for your next-generation designs.

Key Specifications

Category	Specification
Board Type	8 layers
Material Type	TU883
Solder Mask	Both sides, Blue
Silkscreen Print	Top side, White
Surface Finish	ENEPIG
Total Board Thickness	1.45mm +/- 10%
Board Size	97.3mm x 67.7mm = 1 PCS
Minimum Hole Size	0.25mm
Solder Mask Thickness	10µm
Minimum Dielectric Thickness	100µm
Minimum Trace Line Width	150µm
Minimum Spacing	160µm
Blind Via	Yes, L1-L2, L7-L8
Buried Via	Yes, L2-L7
Back Drilled Via	Yes, L1-L6
Impedance Controlled
- 100 Ohm Differential Pairs	Top layer, 4mil trace / 5mil gap, reference layer 2
- 90 Ohm Differential Pairs	Bottom layer, 4mil trace / 7mil gap, reference layer 7
- 50 Ohm Single-Ended Signals	Layer 6, 5mil trace / 6mil gap, reference layers 5 and 7
Counterholes	Applied on top layer, 90-degree, 0.5mm deep
Edge Plating	Applied on designated area

Features

1.Low Loss Characteristics:

Dielectric constant (Dk) of 3.39 @ 10GHz and dissipation factor (Df) of 0.0045 @ 10GHz ensure minimal signal loss, making it ideal for high-frequency applications.

2.High Thermal Stability:

With a Tg (TMA) of 170°C, TU-883 offers excellent thermal stability, ensuring reliability in high-temperature environments.

3.Halogen-Free and Lead-Free:

Compliant with environmental regulations, this material is compatible with lead-free reflow processes.

4.Anti-CAF Capability:

Enhanced resistance to conductive anodic filament (CAF) formation ensures long-term reliability.

5.Moisture Resistance:

Superior moisture resistance prevents degradation in humid conditions.

PCB Stack-Up

The 8 layer stack-up PCB is optimized for high-speed signal transmission and thermal management:

Layer	Material	Thickness (um)	Specification
Top Layer	Copper	45	18um base + 17um plating
Layer 2	TUC-TU883P Prepreg	89	IPC-4101/24
Layer 3	Copper	35
Layer 4	S1000-2MB Prepreg	160	IPC-4101/24
Layer 5	Copper	35
Layer 6	FR-4 TU883 Core	254	IPC-4101/24
Layer 7	Copper	35
Layer 8	S1000-2MB Prepreg	160	IPC-4101/24
Bottom Layer	Copper	35	18um base + 17um plating

HDI PCB 8-layer

The stack-up includes TU-883 core and S1000-2MB prepreg layers, ensuring a balanced and reliable structure.

PCB Statistic

Category	Quantity
Components	49
Total Pads	98
Thru Hole Pads	46
Top SMT Pads	38
Bottom SMT Pads	14
Vias	63
Nets	6

Applications

This wholesale HDI PCB is ideal for a wide range of high-performance applications, including:

- Radio frequency

- Backplane, High performance computing

- Line cards, Storage

- Servers, Telecom, Base station

- Office Routers

Quality and Compliance

Quality Standard: IPC-Class-2

Artwork Format: Gerber RS-274-X

Availability: Worldwide

Conclusion

Our 8-layer HDI High Tg PCB with TU-883 material is the ultimate solution for high-performance, high-reliability applications. With its advanced features, robust construction, and compliance with industry standards, this High-speed PCB is designed to meet the demands of modern electronics. Whether you're working on RF modules, telecom infrastructure, or high-performance computing, this HDI PCB delivers unmatched quality and performance.

BICHENG PCB CERTIFICATE:

Top 10 Sales of Rogers PCB

Major material Supplier

Hot Tags :

8-layer HDI PCB High-Density Interconnect (HDI) PCB TU-883 material RF PCB 8 layer stack-up PCB wholesale HDI PCB HDI High Tg PCB

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Subject : HDI PCB 8-layer 1.5mm TU-883 material Multilayer Board High TG With Blind Via Buried Via Impedance Control

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