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Home Taconic PCB Board TLX-0 TLX-9 TLX-8 TLX-7 TLX-6 Taconic High Frequency PCB HASL Immersion Gold Silver Tin OSP

TLX-0 TLX-9 TLX-8 TLX-7 TLX-6 Taconic High Frequency PCB HASL Immersion Gold Silver Tin OSP

The TLX from Taconic is a PCB Laminates with Dk 2.55, Frequency 1.9 to 10 GHz.




  • Item NO.:

    BIC-089-v172.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


TLX-0, TLX-9, TLX-8, TLX-7 and TLX-6 Taconic High Frequency PCB with HASL, Immersion Gold, Silver, Tin and OSP

(PCB's are custom-made products, the picture and parameters shown are just for reference)


TLX is a series PTFE fiberglass laminates launched by Taconic Company. It offers reliability in a wide range of RF applications. This material is versatile due to its 2.45 - 2.65 DK range. It is suitable for low layer count microwave PCBs.


TLX-8 RF PCB


Let's firstly see the advantages that we benefit from.

1. Dimensionally stable:

It can experience high level of vibration, such as space launch.


2. Excellent thermal properties:

It can experience high temperature exposure, such as working in engine modules.


3. Low and stable dielectric constant and tightly controlled DK.

    Ranging 2.45 to 2.65 at tolerance +/-0.04


4. Low moisture absorption 

    Undergoing extreme severe environments, such as working at sea

5. Flame retardant grade, UL 94 VO

6. Low DF


TLX features


TLX material is ideal for use in the application of following list due to its wide DK range and available thickness and copper cladding.

1. Radar systems,

2. Mobile communications,

3. Microwave test equipment,

4. Microwave transmission devices,

5. Antennas,

6. Mixers, splitters, filters and combiners


TLX Applications


There’re TLX-0, TLX-9, TLX-8, TLX-7 and TLX-6 in TLX family. Often it’s used in single layer board, double layer board etc. Surface finish is mainly with bare copper, hot air level and immersion gold.


Our PCB Capability (TLX)


PCB Material:

PTFE Fiberglass

TLX Family (Dielectric constant ±0.04)

TLX-0 (DK=2.45)

TLX-9 (DK=2.50)

TLX-8 (DK=2.55)

TLX-7 (DK=2.60)

TLX-6 (DK=2.65)

Layer count:

1 Layer, 2 Layer, 4 Layer.

Copper weight:

0.5oz, 1oz, 2oz

PCB thickness:

0.5mm, 0.8mm, 1.0mm,

1.5mm, 3.2mm

PCB Size:

≤400mm X 500mm

Surface finish:

Bare copper, HASL, ENIG, Immersion tin etc.



The basic colour of TLX high frequency PCB is brown and black.


We specialize in providing you with prototype, small batches and mass production service.

If you have any requirements on this kind of PCB, please feel free to contact us.

Thank you for your reading.


Appendix: Data Sheet of TLX-8

TLX-8 TYPICAL VALUES
Property Test Method Unit Value Unit Value
DK @10 GHz IPC-650 2.5.5.3 2.55 2.55
Df @1.9 GHz IPC-650 2.5.5.5.1 0.0012 0.0012
Df @10 GHz IPC-650 2.5.5.5.1 0.0017 0.0017
Dielectric Breakdown IPC-650 2.5.6 kV >45 kV >45
Moisture Absorption IPC-650 2.6.2.1 % 0.02 % 0.02
Flexural Strength(MD) ASTM D 709 psi 28,900 N/mm2
Flexural Strength(CD) ASTM D 709 psi 20,600 N/mm2
Tensile Strength(MD) ASTM D 902 psi 35,600 N/mm2
Tensile Strength(CD) ASTM D 902 psi 27,500 N/mm2
Elongation at Break(MD) ASTM D 902 % 3.94 % 3.94
Elongation at Break(CD) ASTM D 902 % 3.92 % 3.92
Young's Modulus(MD) ASTM D 902 kpsi 980 N/mm2
Young's Modulus(CD) ASTM D 902 kpsi 1,200 N/mm2
Young's Modulus(MD) ASTM D 3039 kpsi 1,630 N/mm2
Poisson's Ratio ASTM D 3039 0.135 N/mm
Peel Stength(1 oz.ed) IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) Ibs./linear inch 15 N/mm
Peel Stength(1 oz.RTF) IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) Ibs./linear inch 17 N/mm
Peel Stength(½ oz.ed) IPC-650 2.4.8.3(Elevated Temp.) Ibs./linear inch 14 N/mm
Peel Stength(½ oz.ed) IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) Ibs./linear inch 11 N/mm
Peel Stength(1 oz.rolled) IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) Ibs./linear inch 13 N/mm 2.1
Thermal Conductivity ASTM F433/ASTM 1530-06 W/M*K 0.19 W/M*K 0.19
Dimensional Stability(MD) IPC-650 2.4.39 Sec.5.5(After Bake.) mils/in. 0.06 mm/M
Dimensional Stability(CD) IPC-650 2.4.39 Sec.5.4(After Bake.) mils/in. 0.08 mm/M
Dimensional Stability(MD) IPC-650 2.4.39 Sec.5.5(Thermal Stress.) mils/in. 0.09 mm/M
Dimensional Stability(CD) IPC-650 2.4.39 Sec.5.5(Thermal Stress.) mils/in. 0.1 mm/M
Surface Resistivity IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.) Mohm 6.605 x 108 Mohm 6.605 x 108
Surface Resistivity IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.) Mohm 3.550 x 106 Mohm 3.550 x 106
Volume Resistivity IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.) Mohm/cm 1.110 x 1010 Mohm/cm 1.110 x 1010
Volume Resistivity IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.) Mohm/cm 1.046 x 1010 Mohm/cm 1.046 x 1010
CTE(X axis)(25-260℃) IPC-650 2.4.41/ASTM D 3386 ppm/℃ 21 ppm/℃ 21
CTE(Y axis)(25-260℃) IPC-650 2.4.41/ASTM D 3386 ppm/℃ 23 ppm/℃ 23
CTE(Z axis)(25-260℃) IPC-650 2.4.41/ASTM D 3386 ppm/℃ 215 ppm/℃ 215
Density(Specific Gravity) ASTM D 792 g/cm3 2.25 g/cm3 2.25
Td(2% Weight Loss) IPC-650 2.4.24.6(TGA) 535
Td(5% Weight Loss) IPC-650 2.4.24.6(TGA) 553
Flammability Rating UL-94 V-0 V-0



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