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Home Rogers PCB Board High Frequency PCB Rogers 20mil 0.508mm RO4350B Double Sided RF PCB

High Frequency PCB Rogers 20mil 0.508mm RO4350B Double Sided RF PCB

RO4350B high-frequency circuit materials have been developed to provide high frequency performance comparable to woven PTFE glass substrates, which simplifies fabrication with epoxy/glass laminates. 

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High Frequency PCB Rogers 20mil 0.508mm RO4350B Double Sided RF PCB for Splitter

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

The glass fiber reinforced (non-PTFE) hydrocarbon/ceramic laminates used in Rogers Ro4350B high-frequency materials are intended for high volume, high-performance commercial applications. Ro4350b are made to deliver exceptional RF performance and affordable circuit manufacture. The end result is a low-loss material that can be made at reasonable cost utilizing common epoxy/glass (FR4) techniques. As operating frequencies rise to 500 MHz or more, a significant decrease in the range of laminates that are typically accessible to designers occurs. 

The properties of the RO4350B PCB make it possible to create filters, coupling networks, and impedance-controlled transmission lines in a repeatable manner. The RO4350B series material can be used in many applications where traditional printed circuit board laminates cannot be used due to higher operating frequencies because of its low dielectric loss. The dielectric constant has one of the lowest temperature coefficients of all printed circuits and is stable across a large frequency range. It is the perfect substrate for broadband applications because of this. 

2L 20mil Rogers RO4350B PCB

For the creation of mixed dielectric multilayer PCB boards, it is a property required. Even in extreme thermal shock applications, the low CTE of RO4350 laminates on the Z-axis ensures dependable through hole quality. The RO4350 series' material has a TG of more than 280 ° C (536 ° F), which ensures that its expansion properties are steady at all circuit's process temperatures. Printed circuit boards made from RO4350 Series laminates can be created quickly and easily utilizing common FR4 circuit board manufacturing methods. The RO4350 series laminates do not require specialized preparatory procedures such sodium etching, in contrast to high-performance PTFE-based materials. This material can be handled by automated handling systems and washers to create the copper surface. It is a robust, heat-stable laminate..

The current selection of 1080 and 1674 glass fabric variants for RO4350B laminates all adhere to the same standards for laminated electrical performance. RO4350 laminates feature RoHS compliant flame retardant technology for applications requiring UL 94V-0 certification and are specifically made for direct replacement of RO4350B material. These products satisfy IPC-4103/10 single sheets for RO4003C and/11 for RO4350B specifications.

PCB Specifications:

RO4350B Typical Value
Property RO4350B Direction Units Condition Test Method
Dielectric Constant,εProcess 3.48±0.05 Z 10 GHz/23℃ IPC-TM-650 Clamped Stripline
Dielectric Constant,εDesign 3.66 Z 8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0037
Z 10 GHz/23℃
2.5 GHz/23℃
Thermal Coefficient of ε +50 Z ppm/℃ -50℃to 150℃ IPC-TM-650
Volume Resistivity 1.2 x 1010 MΩ.cm COND A IPC-TM-650
Surface Resistivity 5.7 x109 COND A IPC-TM-650
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650
Tensile Modulus 16,767(2,432)
MPa(ksi) RT ASTM D 638
Tensile Strength 203(29.5)
MPa(ksi) RT ASTM D 638
Flexural Strength 255
IPC-TM-650 2.4.4
Dimensional Stability <0.5 X,Y mm/m
after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 10
ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280 ℃TMA A IPC-TM-650
Td 390 ℃TGA ASTM D 3850
Thermal Conductivity 0.69 W/M/oK 80℃ ASTM C518
Moisture Absorption 0.06 % 48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density 1.86 gm/cm3 23℃ ASTM D 792
Copper Peel Stength 0.88
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability (3)V-0 UL 94
Lead-free Process Compatible Yes

Typical applications are as follows:

Automotive Radar and Sensors

Cellular Base Station Antennas

Direct Broadcast Satellites

Low Noise Block

Power amplifiers


20 mil RO4350B PCB

Data sheet of Rogers 4350B (RO4350B ):

PCB SIZE 26 x 83mm=1PCS
Number of Layers Double sided PCB, 2 Layer PCB
Surface Mount Components YES
Through Hole Components no
LAYER STACKUP copper ------- 35um(1oz)+plate TOP layer
RO4350B 20mil (0.508mm)
copper ------- 35um(1oz)+plate BOT Layer
Minimum Trace and Space: 5.98mil/6.18mil
Minimum / Maximum Holes: 0.3/3.2mm
Number of Different Holes: 5
Number of Drill Holes: 431
Number of Milled Slots: 0
Number of Internal Cutouts: no
Impedance Control no
Glass Epoxy:  RO4350B 20mil (0.508mm), Tg 288℃
Final foil external:  1.5oz
Final foil internal:  0oz
Final height of PCB:  0.6mm ±0.1
Surface Finish Immersion Gold (81.1%) 2µ" over 100µ" nickel
Solder Mask Apply To:  Top and Bottom, 12micron Minimum
Solder Mask Color:  Green, LP-4G G-05, Nanya supplied
Solder Mask Type: LPSM
Side of Component Legend TOP
Colour of Component Legend White, S-380W, Taiyo Supplied.
Manufacturer Name or Logo:  Marked on the board in a conductor and leged FREE AREA
VIA Plated Through Hole(PTH)
Outline dimension:   0.0059" (0.15mm)
Board plating: 0.0030" (0.076mm)
Drill tolerance:  0.002" (0.05mm)
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.




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