Call Us Now ! Tel : +86 755 27374946
Order Online Now ! Email : info@bichengpcb.com
RO4350B high-frequency circuit materials have been developed to provide high frequency performance comparable to woven PTFE glass substrates, which simplifies fabrication with epoxy/glass laminates.
Item NO.:
BIC-003-v182.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 daysHigh Frequency PCB Rogers 20mil 0.508mm RO4350B Double Sided RF PCB for Splitter
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
The glass fiber reinforced (non-PTFE) hydrocarbon/ceramic laminates used in Rogers Ro4350B high-frequency materials are intended for high volume, high-performance commercial applications. Ro4350b are made to deliver exceptional RF performance and affordable circuit manufacture. The end result is a low-loss material that can be made at reasonable cost utilizing common epoxy/glass (FR4) techniques. As operating frequencies rise to 500 MHz or more, a significant decrease in the range of laminates that are typically accessible to designers occurs.
The properties of the RO4350B PCB make it possible to create filters, coupling networks, and impedance-controlled transmission lines in a repeatable manner. The RO4350B series material can be used in many applications where traditional printed circuit board laminates cannot be used due to higher operating frequencies because of its low dielectric loss. The dielectric constant has one of the lowest temperature coefficients of all printed circuits and is stable across a large frequency range. It is the perfect substrate for broadband applications because of this.
For the creation of mixed dielectric multilayer PCB boards, it is a property required. Even in extreme thermal shock applications, the low CTE of RO4350 laminates on the Z-axis ensures dependable through hole quality. The RO4350 series' material has a TG of more than 280 ° C (536 ° F), which ensures that its expansion properties are steady at all circuit's process temperatures. Printed circuit boards made from RO4350 Series laminates can be created quickly and easily utilizing common FR4 circuit board manufacturing methods. The RO4350 series laminates do not require specialized preparatory procedures such sodium etching, in contrast to high-performance PTFE-based materials. This material can be handled by automated handling systems and washers to create the copper surface. It is a robust, heat-stable laminate..
The current selection of 1080 and 1674 glass fabric variants for RO4350B laminates all adhere to the same standards for laminated electrical performance. RO4350 laminates feature RoHS compliant flame retardant technology for applications requiring UL 94V-0 certification and are specifically made for direct replacement of RO4350B material. These products satisfy IPC-4103/10 single sheets for RO4003C and/11 for RO4350B specifications.
PCB Specifications:
RO4350B Typical Value | |||||
Property | RO4350B | Direction | Units | Condition | Test Method |
Dielectric Constant,εProcess | 3.48±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
Dielectric Constant,εDesign | 3.66 | Z | 8 to 40 GHz | Differential Phase Length Method | |
Dissipation Factortan,δ |
0.0037 0.0031 |
Z |
10
GHz/23℃ 2.5 GHz/23℃ |
IPC-TM-650 2.5.5.5 | |
Thermal Coefficient of ε | +50 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
Volume Resistivity | 1.2 x 1010 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
Surface Resistivity | 5.7 x109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
Tensile Modulus |
16,767(2,432) 14,153(2,053) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
Tensile Strength |
203(29.5) 130(18.9) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
Flexural Strength |
255 (37) |
MPa (kpsi) |
IPC-TM-650 2.4.4 | ||
Dimensional Stability | <0.5 | X,Y |
mm/m (mil/inch) |
after etch+E2/150℃ | IPC-TM-650 2.4.39A |
Coefficient of Thermal Expansion |
10 12 32 |
X Y Z |
ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
Tg | >280 | ℃TMA | A | IPC-TM-650 2.4.24.3 | |
Td | 390 | ℃TGA | ASTM D 3850 | ||
Thermal Conductivity | 0.69 | W/M/oK | 80℃ | ASTM C518 | |
Moisture Absorption | 0.06 | % |
48hrs
immersion 0.060" sample Temperature 50℃ |
ASTM D 570 | |
Density | 1.86 | gm/cm3 | 23℃ | ASTM D 792 | |
Copper Peel Stength |
0.88 (5.0) |
N/mm (pli) |
after
solder float 1 oz. EDC Foil |
IPC-TM-650 2.4.8 | |
Flammability | (3)V-0 | UL 94 | |||
Lead-free Process Compatible | Yes |
Typical applications are as follows:
Automotive Radar and Sensors
Cellular Base Station Antennas
Direct Broadcast Satellites
Low Noise Block
Power amplifiers
RFID
Data sheet of Rogers 4350B (RO4350B ):
PCB SIZE | 26 x 83mm=1PCS |
BOARD TYPE | |
Number of Layers | Double sided PCB, 2 Layer PCB |
Surface Mount Components | YES |
Through Hole Components | no |
LAYER STACKUP | copper ------- 35um(1oz)+plate TOP layer |
RO4350B 20mil (0.508mm) | |
copper ------- 35um(1oz)+plate BOT Layer | |
TECHNOLOGY | |
Minimum Trace and Space: | 5.98mil/6.18mil |
Minimum / Maximum Holes: | 0.3/3.2mm |
Number of Different Holes: | 5 |
Number of Drill Holes: | 431 |
Number of Milled Slots: | 0 |
Number of Internal Cutouts: | no |
Impedance Control | no |
BOARD MATERIAL | |
Glass Epoxy: | RO4350B 20mil (0.508mm), Tg 288℃ |
Final foil external: | 1.5oz |
Final foil internal: | 0oz |
Final height of PCB: | 0.6mm ±0.1 |
PLATING AND COATING | |
Surface Finish | Immersion Gold (81.1%) 2µ" over 100µ" nickel |
Solder Mask Apply To: | Top and Bottom, 12micron Minimum |
Solder Mask Color: | Green, LP-4G G-05, Nanya supplied |
Solder Mask Type: | LPSM |
CONTOUR/CUTTING | Routing |
MARKING | |
Side of Component Legend | TOP |
Colour of Component Legend | White, S-380W, Taiyo Supplied. |
Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
VIA | Plated Through Hole(PTH) |
FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE | |
Outline dimension: | 0.0059" (0.15mm) |
Board plating: | 0.0030" (0.076mm) |
Drill tolerance: | 0.002" (0.05mm) |
TEST | 100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA | Worldwide, Globally. |
BICHENG PCB WORKSHOP:
BICHENG MAIN COURIERS:
Previous:
2 Layer RO4003C LoPro High Frequency PCB Rogers 16.7mil Low Profile CopperNext:
Rogers 3003 PCB Substrate RO3003 High Frequency PCB 10mil 20mil 30mil 60mil Thick Coating Immersion Gold Silver TinIf you have questions or suggestions,please leave us a message,we will reply you as soon as we can!
Categories
New Products
Rogers RO4003C PCB 4-layer 0.7mm Thick RO4450F Bondply Multilayer ENIG High Frequency Laminates
Rogers RO3203 PCB 30mil 2-layer Immersion Silver High Frequency Circuit Materials
Rogers RO3035 PCB 20mil Laminate 2-layer High Frequency Circuit Board
RF-35 PCB 60mil 1.524mm Taconic laminates 2-layer High Frequency Circuit Board
F4BTME298 PCB 60mil 1.524 mm 2-layer F4BTME Series High Frequency Circuit Boards
TLX-0 PCB 5mil RF Microwave Taconic Substrates 2-layer High Frequency Laminate
Rogers RO4725JXR PCB 0.78 mm 30.7mil Double Sided High Frequency Laminate
IsoClad 933 PCB Rogers 15mil 2-layer High Frequency Circuit Board
© Copyright: 2024 Shenzhen Bicheng Electronics Technology Co., Ltd.. All Rights Reserved.
IPv6 network supported