Rogers 3003 PCB RO3003 High Frequency PCB 10mil,
20mil, 30mil and 60mil Thick Coating Immersion Gold, Silver and Tin
(PCB's are custom-made products, the picture
and parameters shown are just for reference)
RO3003 high frequency circuit laminates are
ceramic-filled PTFE composites intended for using in commercial microwave and
RF applications. Its obvious characteristic is that the electrical performance
is exceptional and the mechanical property is stable and consistent. This
allows our designers to develop multi-layer board design feeling free and free,
without encountering warpage or reliability problems.
Another high-frequency PCB is the Rogers 3003.
Its components are PTFE compounds designed for use in a materialistic microwave
with an RF operation.
Suitable for use in RF and microwave
applications, Rogers 3003 is a high-frequency, ceramic-filled PTFE laminate.
The RO3000 series includes this laminate. It has consistent mechanical
properties as a result, regardless of the required dielectric constant.
Let’s see some
more features and applications.
1.low dielectric loss, DF=0.001, it can be used
in applications up to 77 GHz.
2.Stable dielectric constant versus temperature
and frequency, it’s ideal material for band pass filters, microstrip patch
antennas, and voltage controlled oscillators.
3.excellent mechanical properties versus
temperature, it’s reliable stripline and multi-layer board constructions.
4.Uniform mechanical properties, it’s suitable
for use with epoxy glass multi-layer board hybrid designs.
5.low in-plane expansion coefficient matches to
copper, it allows for more reliable surface mounted assemblies; ideal for
applications sensitive to temperature change and exhibit excellent dimensional
stability.
Our PCB Capability (RO3003)
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PCB Material:
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Ceramic-filled
PTFE composite
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Designator:
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RO3003
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Dielectric constant:
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3.0 ±0.04 (process)
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3.0 (design)
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Layer count:
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1 Layer, 2
Layer, Multilayer, Hybrid PCB
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Copper weight:
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0.5oz (17 µm),
1oz (35µm), 2oz (70µm)
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PCB thickness:
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10mil (0.254mm),
20mil (0.508mm)
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30mil (0.762mm),
60mil (1.524mm)
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PCB size:
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≤400mm X 500mm
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Solder mask:
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Green, Black,
Blue, Yellow, Red etc.
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Surface finish:
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Bare copper,
HASL, ENIG, OSP etc..
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|
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Rogers 3003 high
frequency PCBs are available with double sided, multi-layer and hybrid
construction, copper ranges from 0.5oz to 2oz, thickness from 0.3mm to 1.6mm,
maximum size 400 by 500mm, surface finish with bare copper, hot air leveling,
immersion gold etc.
Typical
Applications
1. Automotive
radar applications
2. GPS Antennas
3. Power
amplifiers and antennas
4. Patch antennas
for wireless communications
5. Direct
broadcast satellite
The basic colour of RO3003 PCB is white.
The manufacturing process of RO3003 high
frequency PCB is similar to standard PTFE PCB, so it’s suitable for volume
manufacturing process winning advantageous market.
Should you have any questions, please feel free
to contact us.
Appendix: Data Sheet of RO3003
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RO3003 Typical Value
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Property
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RO3003
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Direction
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Units
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Condition
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Test Method
|
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Dielectric Constant,εProcess
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3.0±0.04
|
Z
|
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10 GHz/23℃
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IPC-TM-650 2.5.5.5 Clamped Stripline
|
|
Dielectric
Constant,εDesign
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3
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Z
|
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8GHz to 40 GHz
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Differential Phase
Length Method
|
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Dissipation
Factor,tanδ
|
0.001
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Z
|
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10
GHz/23℃
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IPC-TM-650 2.5.5.5
|
|
Thermal
Coefficient of ε
|
-3
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Z
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ppm/℃
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10 GHz -50℃to 150℃
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IPC-TM-650 2.5.5.5
|
|
Dimensional
Stability
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0.06
0.07
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X
Y
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mm/m
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COND A
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IPC-TM-650 2.2.4
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Volume
Resistivity
|
107
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MΩ.cm
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COND A
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IPC 2.5.17.1
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Surface
Resistivity
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107
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MΩ
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COND A
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IPC 2.5.17.1
|
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Tensile
Modulus
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930
823
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X
Y
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MPa
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23℃
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ASTM D 638
|
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Moisture
Absorption
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0.04
|
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%
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D48/50
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IPC-TM-650 2.6.2.1
|
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Specific Heat
|
0.9
|
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j/g/k
|
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Calculated
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Thermal
Conductivity
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0.5
|
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W/M/K
|
50℃
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ASTM D 5470
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Coefficient of Thermal Expansion
(-55 to 288℃)
|
17
16
25
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X
Y
Z
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ppm/℃
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23℃/50% RH
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IPC-TM-650 2.4.4.1
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Td
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500
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℃TGA
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ASTM D 3850
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Density
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2.1
|
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gm/cm3
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23℃
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ASTM D 792
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Copper Peel
Stength
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12.7
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Ib/in.
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1oz,EDC After Solder
Float
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IPC-TM 2.4.8
|
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Flammability
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V-0
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|
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UL 94
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Lead-free
Process Compatible
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Yes
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|
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