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Home Rogers PCB Board Rogers 3003 PCB Substrate RO3003 High Frequency PCB 10mil 20mil 30mil 60mil Thick Coating Immersion Gold Silver Tin

Rogers 3003 PCB Substrate RO3003 High Frequency PCB 10mil 20mil 30mil 60mil Thick Coating Immersion Gold Silver Tin

RO3003 high frequency circuit laminates are ceramic-filled PTFE composites intended for using in commercial microwave and RF applications. 

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Rogers 3003 PCB RO3003 High Frequency PCB 10mil, 20mil, 30mil and 60mil Thick Coating Immersion Gold, Silver and Tin

(PCB's are custom-made products, the picture and parameters shown are just for reference)

RO3003 high frequency circuit laminates are ceramic-filled PTFE composites intended for using in commercial microwave and RF applications. Its obvious characteristic is that the electrical performance is exceptional and the mechanical property is stable and consistent. This allows our designers to develop multi-layer board design feeling free and free, without encountering warpage or reliability problems.

Another high-frequency PCB is the Rogers 3003. Its components are PTFE compounds designed for use in a materialistic microwave with an RF operation.

Suitable for use in RF and microwave applications, Rogers 3003 is a high-frequency, ceramic-filled PTFE laminate. The RO3000 series includes this laminate. It has consistent mechanical properties as a result, regardless of the required dielectric constant.

Let’s see some more features and applications.

Features of RO3003

1.low dielectric loss, DF=0.001, it can be used in applications up to 77 GHz.

2.Stable dielectric constant versus temperature and frequency, it’s ideal material for band pass filters, microstrip patch antennas, and voltage controlled oscillators.

3.excellent mechanical properties versus temperature, it’s reliable stripline and multi-layer board constructions.

4.Uniform mechanical properties, it’s suitable for use with epoxy glass multi-layer board hybrid designs.

5.low in-plane expansion coefficient matches to copper, it allows for more reliable surface mounted assemblies; ideal for applications sensitive to temperature change and exhibit excellent dimensional stability.

Our PCB Capability (RO3003)

PCB Material:

Ceramic-filled PTFE composite



Dielectric constant:

3.0 ±0.04 (process)

3.0 (design)

Layer count:

1 Layer, 2 Layer, Multilayer, Hybrid PCB

Copper weight:

0.5oz (17 µm), 1oz (35µm), 2oz (70µm)

PCB thickness:

10mil (0.254mm), 20mil (0.508mm)

30mil (0.762mm), 60mil (1.524mm)

PCB size:

≤400mm X 500mm

Solder mask:

Green, Black, Blue, Yellow, Red etc.

Surface finish:

Bare copper, HASL, ENIG, OSP etc..

Rogers 3003 high frequency PCBs are available with double sided, multi-layer and hybrid construction, copper ranges from 0.5oz to 2oz, thickness from 0.3mm to 1.6mm, maximum size 400 by 500mm, surface finish with bare copper, hot air leveling, immersion gold etc.

Typical applicatoins of RO3003

Typical Applications

1. Automotive radar applications

2. GPS Antennas

3. Power amplifiers and antennas

4. Patch antennas for wireless communications

5. Direct broadcast satellite

The basic colour of RO3003 PCB is white.

The manufacturing process of RO3003 high frequency PCB is similar to standard PTFE PCB, so it’s suitable for volume manufacturing process winning advantageous market.

Should you have any questions, please feel free to contact us.

Appendix: Data Sheet of RO3003

 RO3003 Typical Value
Property RO3003 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.0±0.04 Z 10 GHz/23℃ IPC-TM-650 Clamped Stripline
Dielectric Constant,εDesign 3 Z 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.001 Z 10 GHz/23℃ IPC-TM-650
Thermal Coefficient of ε -3 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650
Dimensional Stability 0.06
mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 107 MΩ.cm COND A IPC
Surface Resistivity 107 COND A IPC
Tensile Modulus 930
MPa 23℃ ASTM D 638
Moisture Absorption 0.04 % D48/50 IPC-TM-650
Specific Heat 0.9 j/g/k Calculated
Thermal Conductivity 0.5 W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)
ppm/℃ 23℃/50% RH IPC-TM-650
Td 500 ℃TGA ASTM D 3850
Density 2.1 gm/cm3 23℃ ASTM D 792
Copper Peel Stength 12.7 Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0 UL 94
Lead-free Process Compatible Yes




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