Shenzhen Bicheng
Electronics Technology Co., Ltd

# Call Us Now ! Tel : +86 755 27374946

# Order Online Now ! Email : info@bichengpcb.com

Hybrid PCB
Hybrid PCB
Products
Home Rogers PCB Board 2 Layer RO4003C LoPro High Frequency PCB Rogers 16.7mil Low Profile Copper

2 Layer RO4003C LoPro High Frequency PCB Rogers 16.7mil Low Profile Copper

The new Rogers RO4000 LoPro laminates provide improved electrical performance and higher yields for printed circuit boards (PCBs). 

  • Item NO.:

    BIC-130-v181.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


RO4003C LoPro High Frequency PCB Rogers 16.7mil Low Profile Copper for Routers and Servers

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


A flexible and effective solution to improve the electrical performance of your circuit boards is with Rogers' RO4000 LoPro laminates. These laminates offer good electrical performance while being compatible with lead-free PCB production techniques. You can design and create circuit boards with larger circuit densities and faster production thanks to the high-quality materials. These materials also have a low dissipation factor, which is important for antenna designs.


The Rogers-exclusive RO4000 LoPro laminates are made with this technique. Due to the foil's reverse processing, there is less conductor loss. This enhances signal integrity and reduces insertion loss. These laminates are a viable option for high-frequency applications due to their inexpensive cost and superior high-frequency performance. Epoxy/glass (FR-4) processes make up the hydrocarbon ceramic laminates of the RO4000 series. Additionally, they don't need any additional preparation. They become a viable option for numerous applications as a result.


2L 16.7mil RO4003C LoPro PCB


Features and Benefits:

RO4003C materials are reinforced hydrocarbon/ceramic laminates with very low profile reverse treated foil.

1. Lower insertion loss

2. Low PIM

3. Increased signal integrity

4. High circuit density


Low Z-axis coefficient of thermal expansion

1. Multi-layer board capability

2. Design flexibility


Lead-free process compatible

1.High temperature processing

2.Meets environmental concerns


CAF resistant


2L 16.7mil RO4003C LoPro PCB


Our PCB Capability (RO4003C LoPro)

Our PCB Capability (RO4003C LoPro) 
PCB Material: Hydrocarbon Ceramic Laminates
Designation: RO4003C LoPro
Dielectric constant: 3.38±0.05
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 12.7mil (0.323mm), 16.7mil (0.424mm), 20.7mil(0.526mm), 32.7mil (0.831mm), 60.7mil(1.542mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin etc..


Some Typical Applications:

1.Digital applications such as servers, routers, and high speed back planes

2.Cellular base station antennas and power amplifiers

3.LNB’s for direct broadcast satellites

4.RF Identification Tags


Typical Properties of RO4003C LoPro

RO4003C LoPro
Property  Typical Value Direction Units Condition Test Method
Dielectric Constant, Process  3.38 ± 0.05 z -- 10 GHz/23°C IPC-TM-650                 2.5.5.5            Clamped Stripline
Dielectric Constant, Design  3.5 z -- 8 to 40 GHz Differential Phase Length Method
Dissipation Factor tan,d 0.0027 0.0021 z -- 10 GHz/23°C 2.5 GHz/23°C IPC-TM-650     2.5.5.5
Thermal Coeffifi cient ofer 40 z ppm/°C -50°C to 150°C IPC-TM-650 2.5.5.5
Volume Resistivity 1.7 X 1010 MΩ•cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 4.2 X 109 COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) z KV/mm(V/mil) 0.51mm(0.020”) IPC-TM-650 2.5.6.2
Tensile Modulus 26889(3900) Y MPa(kpsi) RT ASTM D638
Tensile Strength 141(20.4) Y MPa(kpsi) RT ASTM D638
Flexural Strength 276(40) MPa(kpsi) IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m(mils/inch) after etch +E2/150°C IPC-TM-650 2.4.39A
Coeffifi cient of Thermal Expansion 11 x ppm/°C -55 to 288°C IPC-TM-650 2.1.41
14 y
46 z
Tg >280 °C TMA A IPC-TM-650 2.4.24.3
Td 425 °C TGA ASTM D3850
Thermal Conductivity 0.64 W/m/°K 80°C ASTM C518
Moisture Absorption 0.06 % 48 hrs immersion 0.060” sample Temperature 50°C ASTM D570
Density 1.79 gm/cm3 23°C ASTM D792
Copper Peel Strength 1.05(6.0) N/mm(pli) after solder float 1 oz. TC Foil IPC-TM-650 2.4.8
Flammability N/A UL 94
Lead-Free Process Compatible Yes



BICHENG PCB WORKSHOP:




BICHENG PCB CERTIFICATE:



BICHENG MAIN COURIERS:


Leave A Message

If you have questions or suggestions,please leave us a message,we will reply you as soon as we can!

Related Products
RT/Duroid 5880 High Frequency PCB
RT/Duroid 5880 20mil 0.508mm Rogers High Frequency PCB

This is a type of double sided RF PCB built on RT/duroid 5880 for the application of Radar Systems.

2 layer  60mil  RO4003C RF PCB
Rogers 4003 60mil 1.524mm RO4003C High Frequency RF PCB

RO4003C PCBs are hydrocarbon ceramic filled laminates, not PTFE which are designed to offer superior high frequency performance.

RO3003 PCB 10mil
Rogers RO3003 High Frequency PCB 2 Layer 10mil DK3.0 DF 0.001 PCB

Rogers RO3003 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. It was designed to offer exceptional electrical and mechanical stability at competitive prices.

RO3010 PCB 10mil
Rogers RO3010 High Frequency 2-Layer 10mil Printed Circuit Board PCB

RO3010 laminates are competitively priced products with exceptional mechanical and electrical stability. This stability simplifies the design of broadband components and allows the materials to be used in a wide range of applications over a very broad range of frequencies.

25mil RO3210 PCB
Rogers RF PCB RO3210 25mil 0.635mm DK10.2 Immersion Gold

These RO3210 materials are engineered to offer exceptional electrical performance and mechanical stability. RO3210 laminates combine the surface smoothness of a non-woven PTFE laminate.

RT/duroid 6035HTC
Rogers 6035 Double Sided 20mil Core With Immersion Gold PCB

RT/duroid 6035HTC laminates are an exceptional choice for high power applications.

TC350 RF PCB
TC350 Rogers RF PCB 30mil Double Sided Corel With Immersion Gold

TC350 is designed to provide enhanced heat-transfer through “Best-In-Class” thermal conductivity, while reducing dielectric loss and insertion loss. Lower losses result in higher Amplifier and Antenna Gains/Efficiencies.

Rogers RO3035 High Frequency PCB
Rogers RO3035 High Frequency 2-Layer 10mil Circuit Board DK3.5 DF 0.0015

RO3035 materials exhibit a coefficient of thermal expansion(CTE) in the X and Y axis of 17 ppm/℃. This expansion coefficient is matched to that of copper, which allows the material to exhibit excellent dimensional stability.

© Copyright: 2022 Shenzhen Bicheng Electronics Technology Co., Ltd.. All Rights Reserved.

IPv6 network supported

IPv6 network supported

top

Leave A Message

Leave A Message

    If you have questions or suggestions,please leave us a message,we will reply you as soon as we can!

  • #
  • #
  • #