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Home Rogers PCB Board 2 Layer RO4003C LoPro High Frequency PCB Rogers 16.7mil Low Profile Copper

2 Layer RO4003C LoPro High Frequency PCB Rogers 16.7mil Low Profile Copper

The new Rogers RO4000 LoPro laminates provide improved electrical performance and higher yields for printed circuit boards (PCBs).

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RO4003C LoPro High Frequency PCB Rogers 16.7mil Low Profile Copper for Routers and Servers

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

A flexible and effective solution to improve the electrical performance of your circuit boards is with Rogers' RO4000 LoPro laminates. These laminates offer good electrical performance while being compatible with lead-free PCB production techniques. You can design and create circuit boards with larger circuit densities and faster production thanks to the high-quality materials. These materials also have a low dissipation factor, which is important for antenna designs.

The Rogers-exclusive RO4000 LoPro laminates are made with this technique. Due to the foil's reverse processing, there is less conductor loss. This enhances signal integrity and reduces insertion loss. These laminates are a viable option for high-frequency applications due to their inexpensive cost and superior high-frequency performance. Epoxy/glass (FR-4) processes make up the hydrocarbon ceramic laminates of the RO4000 series. Additionally, they don't need any additional preparation. They become a viable option for numerous applications as a result.

Features and Benefits:

RO4003C materials are reinforced hydrocarbon/ceramic laminates with very low profile reverse treated foil.

1. Lower insertion loss

2. Low PIM

3. Increased signal integrity

4. High circuit density

Low Z-axis coefficient of thermal expansion

1. Multi-layer board capability

2. Design flexibility

Lead-free process compatible

1.High temperature processing

2.Meets environmental concerns

CAF resistant

Our PCB Capability (RO4003C LoPro)

Our PCB Capability (RO4003C LoPro) 
PCB Material: Hydrocarbon Ceramic Laminates
Designation: RO4003C LoPro
Dielectric constant: 3.38±0.05
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 12.7mil (0.323mm), 16.7mil (0.424mm), 20.7mil(0.526mm), 32.7mil (0.831mm), 60.7mil(1.542mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin etc..

Some Typical Applications:

1.Digital applications such as servers, routers, and high speed back planes

2.Cellular base station antennas and power amplifiers

3.LNB’s for direct broadcast satellites

4.RF Identification Tags

Typical Properties of RO4003C LoPro

RO4003C LoPro
Property  Typical Value Direction Units Condition Test Method
Dielectric Constant, Process  3.38 ± 0.05 z -- 10 GHz/23°C IPC-TM-650                   Clamped Stripline
Dielectric Constant, Design  3.5 z -- 8 to 40 GHz Differential Phase Length Method
Dissipation Factor tan,d 0.0027 0.0021 z -- 10 GHz/23°C 2.5 GHz/23°C IPC-TM-650
Thermal Coeffifi cient ofer 40 z ppm/°C -50°C to 150°C IPC-TM-650
Volume Resistivity 1.7 X 1010 MΩ•cm COND A IPC-TM-650
Surface Resistivity 4.2 X 109 COND A IPC-TM-650
Electrical Strength 31.2(780) z KV/mm(V/mil) 0.51mm(0.020”) IPC-TM-650
Tensile Modulus 26889(3900) Y MPa(kpsi) RT ASTM D638
Tensile Strength 141(20.4) Y MPa(kpsi) RT ASTM D638
Flexural Strength 276(40) MPa(kpsi) IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m(mils/inch) after etch +E2/150°C IPC-TM-650 2.4.39A
Coeffifi cient of Thermal Expansion 11 x ppm/°C -55 to 288°C IPC-TM-650 2.1.41
14 y
46 z
Tg >280 °C TMA A IPC-TM-650
Td 425 °C TGA ASTM D3850
Thermal Conductivity 0.64 W/m/°K 80°C ASTM C518
Moisture Absorption 0.06 % 48 hrs immersion 0.060” sample Temperature 50°C ASTM D570
Density 1.79 gm/cm3 23°C ASTM D792
Copper Peel Strength 1.05(6.0) N/mm(pli) after solder float 1 oz. TC Foil IPC-TM-650 2.4.8
Flammability N/A UL 94
Lead-Free Process Compatible Yes




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