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Multilayer high frequency PCBs are made from all high frequency material inclusive of prepreg adhesive.
Item NO.:
BIC-064-v196.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
4 Layer High Frequency PCB On 6.6 Mil RO4350B and 10 Mil RO4350B for Radar System
(Printed circuit boards are custom-made products, the picture and parameters shown are just for reference)
Multilayer high frequency PCBs are made from all high frequency material inclusive of prepreg adhesive. For example, a 4-layer Rogers RO4350B PCB is a compound of 2 cores RO4350B substrates. As is known to all, there’re 8 cores in RO4350B family, i.e. 4mil (0.101mm) to 60mil (1.524mm).
RO4350B: |
|
4mil |
0.101mm |
6.6mil |
0.168mm |
10mil |
0.254mm |
13.3mil |
0.338mm |
16.6mil |
0.422mm |
20mil |
0.508mm |
30mil |
0.762mm |
60mil |
1.524mm |
So it’s very interesting that stack-up of 4 layers can be done in many different ways.
Today we talked is a 4-layer RO4350B high frequency PCB built on 6.6mil and 10mil RO4350B substrate for the application of radar system. This RF board has a thickness of 0.82mm with a minimum 4mil track and 5mil gap. This is a pure high frequency multilayer PCB with RO4450B as dielectric prepreg. Other specifications are white silkscreen over green solder mask, immersion gold plated on pads. Entire board is supplied 1 up per panel. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 50 panels are packed for shipment. Here’s detail of stack-up:
Features and benefits
1) Excellent high frequency performance due to low dielectric tolerance and loss;
2) Good high temperature and low temperature resistance(-192℃-260℃);
3) Eligible products rate of first production: >95%
4) Delivery on time: >98%
5) Customer complaint rate: <1%
Applications
Modular oscilloscope,Vario-coupler, Tower-mounted booster, Power amplifier
Splitter, Acoustic detection sensors, RF Switches, Trunk amplifier
Parameter and data sheet
PCB SIZE | 85 x 100mm=1PCS |
BOARD TYPE | Multilayer PCB |
Number of Layers | 4 Layers |
Surface Mount Components | YES |
Through Hole Components | No |
LAYER STACKUP | Copper ------- 35um(1 oz)+plate TOP layer |
Dielectric RO4350B 0.168mm (6.6 mil) | |
Copper ------- 35um(1oz) | |
Dielectric RO4350F 0.203mm (8 mil) | |
Copper ------ 35um (1oz) | |
Dielectric RO4450B 0.254mm ( 10 mil) | |
Copper ------35um (1oz) + plate Bottom Layer | |
TECHNOLOGY | |
Minimum Trace and Space: | 4 mil / 5 mil |
Minimum / Maximum Holes: | 0.25 mm / 2.0 mm |
Number of Different Holes: | 5 |
Number of Drill Holes: | 175 |
Number of Milled Slots: | 0 |
Number of Internal Cutouts: | 3 |
Impedance Control: | no |
Number of Gold finger: | 0 |
BOARD MATERIAL | |
Glass Epoxy: | RO4350B Tg280℃, er<3.48, Rogers Corp. |
Final foil external: | 1.5 oz |
Final foil internal: | 1 oz |
Final height of PCB: | 0.82 mm ±0.1mm |
PLATING AND COATING | |
Surface Finish | Immersion gold |
Solder Mask Apply To: | N/A |
Solder Mask Color: | N/A |
Solder Mask Type: | N/A |
CONTOUR/CUTTING | Routing |
MARKING | |
Side of Component Legend | N/A |
Colour of Component Legend | N/A |
Manufacturer Name or Logo: | N/A |
VIA | Plated through hole(PTH), minimum size 0.25mm. |
FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE | |
Outline dimension: | 0.0059" |
Board plating: | 0.0029" |
Drill tolerance: | 0.002" |
TEST | 100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA | Worldwide, Globally. |
BICHENG PCB WORKSHOP:
BICHENG PCB EQUIPMENT:
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Hybrid RF and High Frequency 4-Layer Circuit Boards Built On 16mil RO4003C+FR4 With Immersion TinIf you have questions or suggestions,please leave us a message,we will reply you as soon as we can!
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