• September 09, 2022

Holiday Notice Mid-Autumn Festival Dear customers: We will have Mid-Autumn Festival holiday from Sep.10-Sep.12, 2022. And we will resume normal work on Sep.13. During Holidays, should you have any enquiries, please feel free to email to infor@bichengpcb,com. Thank you. Best regards, Shenzhen Bicheng Electronics Technology Co., Ltd

• September 08, 2022

What about Teflon Radar apply in PCB? Rogers RO3003+Shengyi S1000-2 to produce 77GHz Millimeter wave radar PCB in batches. RO3003 high frequency PCB material Rogers RO3003 high-frequency PCB , ceramic-filled PTFE(Teflon) laminates are an extension of Rogers's 'industry leading RO3003 solutions. RO3003 laminates are based on industry feedback to specially address the next generation needs for mm-wave automotive radar applications. RO3003 laminate's combination of optimized resin and filler content provides a lower insertion loss, ideal for use in ADAS systems like adaptive cruise control, forward collision warning and active brake or lane change assist. Advantage 1: high range resolution and ranging accuracy Compared with the ISM band with only 200MHz bandwidth in 24GHz band, the SRR band in 77GHz band can provide up to 4GHz scanning bandwidth, significantly improving the range resolution and accuracy. Among them, range resolution represents the ability of radar sensor to separate two adjacent objects, and range accuracy represents the accuracy of measuring a single target. Because the range resolution and accuracy are inversely proportional to the scanning bandwidth, the performance of 77GHz radar sensor is better than that of 24GHz radar, which is 20 times higher than that of 24GHz radar. In fact, the range resolution of 77GHz radar is 4cm (the resolution of 24GHz radar is 75cm). High range resolution can better separate objects (such as people standing near cars) and provide dense points to detect objects, so as to improve the environment modeling and object classification, which is very important for the development of advanced driving assistance algorithm and automatic driving function. In addition, the higher the resolution, the smaller the minimum distance of sensor recognition. Therefore, 77-81ghz radar has a significant advantage in applications requiring high accuracy, such as parking aid. The 77GHz broadband has high resolution, which can be used for industrial level sensor, so that the sensor can "measure to the last drop" of liquid level - to minimize the dead zone at the bottom of the water tank, as shown in the figure. Moreover, because the high resolution can improve the minimum measurement distance, when the water tank is full, the sensor can measure the liquid level at the top of the water tank.

• August 31, 2022

Advantages, Disadvantages and Development Trends of FPC Flexible Circuit Boards FPC flexible circuit board is a highly reliable, excellent flexible circuit board made of flexible insulating substrates such as polyimide or polyester film. Sexual printed circuit board. It has the characteristics of high wiring density, light weight, thin thickness and good bendability. Flexible printed circuit boards are also divided into single-sided, double-sided and multi-layer boards. Flexible circuit boards are mainly used in the connection parts of electronic products. The advantage is that all lines are configured. It can improve the softness by eliminating the need for connecting workers of redundant cables. Strengthening the assembly of three-dimensional space in a limited space can effectively reduce the volume of the product. It increases the convenience of carrying and also reduces the weight of the final product. Features of flexible circuit boards: 1. Short assembly time: all lines are configured, eliminating the need to connect redundant cables. 2. Smaller in volume than PCB: It can effectively reduce the volume of the product and increase the convenience of carrying. 3. Lighter weight than rigid PCB: It can reduce the weight of the final product. 4. The thickness is thinner than the PCB: it can improve the softness and strengthen the assembly of three-dimensional space in a limited space. Advantages of flexible circuit boards: Flexible printed circuit boards are printed circuit boards made of flexible insulating substrates and have many advantages that rigid printed circuit boards do not have: 1. It can be bent, wound, and folded freely, and can be arbitrarily arranged according to the spatial layout requirements, and can be moved and stretched arbitrarily in three-dimensional space, so as to achieve the integration of component assembly and wire connection. 2. The use of FPC can greatly reduce the volume and weight of electronic products, which is suitable for the development of electronic products in the direction of high density, miniaturization and high reliability. Therefore, FPC has been widely used in aerospace, military, mobile communications, laptop computers, computer peripherals, PDA, digital cameras and other fields or products. 3. FPC also has the advantages of good heat dissipation and solderability, easy assembly and connection, and low comprehensive cost. The design of soft and hard combination also makes up for the slight deficiency of the flexible substrate in the component carrying capacity to a certain extent. Disadvantages of flexible circuit boards: 1. High one-time initial cost: Since flexible PCBs are designed and manufactured for special applications, the initial circuit design, wiring, and photographic plates require higher costs. Unless there is a special need to apply a flexible PCB, it is usually best not to use it in a small amount of applications. 2. It is difficult to change and repair the flexible PCB: once the flexi...

• August 18, 2022

What's the Key Materials for High-Frequency PCB Circuit Boards The circuit material of a printed circuit board (PCB) is a key building block for RF/microwave circuits - essentially the starting point for these circuits. PCB materials come in many different forms, and the choice of material depends largely on the requirements of the intended application. For example, materials that reliably support high-frequency circuits in commercial wireless products can fail rapidly when exposed to the extremes of a military environment. A basic understanding of PCB material types and their parameters can help match materials to applications. As with many RF/Microwave components, PCB materials are classified and compared by a number of key parameters, including relative permittivity (Dk or εr), dissipation factor (Df), coefficient of thermal expansion (CTE), dielectric thermal coefficient constant ( TCDk) and thermal conductivity. When classifying different PCB materials, many circuit designers start with Dk. The Dk value of a PCB material refers to the capacitance or energy available between a pair of very close conductors fabricated on the material compared to the same pair of conductors in a vacuum. A vacuum creates a reference of 1.0, other dielectric materials provide higher references. For example, commercial PCB materials typically have Dk values in the range of about 2 to 10, depending on how they are measured and how often they are tested. Conductors on materials with higher Dk values can store more energy than conductors on materials with lower Dk values. Printed Circuit Board (PCB) The Dk value of a PCB material affects the size, wavelength, and characteristic impedance of transmission lines fabricated on that material. For example, for a given characteristic impedance and wavelength, the dimensions of a transmission line fabricated on a PCB material with a high Dk value will be much smaller than a transmission line fabricated on a PCB material with a lower Dk value, although other material parameters may vary . Designers facing circuits where loss is a critical performance parameter often prefer to use PCB materials with lower Dk values because these materials have lower losses than materials with higher Dk values. In practice, PCB materials can lose signal power in four ways: dielectric loss, conductor loss, leakage loss, and radiation loss, although both dielectric and conductor losses can be better controlled through the choice of PCB material. For example, the Df parameter provides a way to compare the dielectric loss of different materials, where a lower Df value indicates a material with lower dielectric loss. For a given transmission line impedance (e.g. 50Ω), the transmission line on the low Dk material will be physically wider than the transmission line on the high Dk material, and the conductor loss of the wider transmission line will be smaller. These wider transmission lines also translate into higher manufacturing yields (and savings i...

• August 05, 2022

PCB accelerates upward breakthrough, high-end products are shining According to Prismark's forecast, the PCB industry is expected to grow at a growth rate of 8.6% in 2021, and will grow at a compound annual growth rate of 5.8% between 2020 and 2025. By 2025, the global PCB industry output value will reach 86.33 billion US dollars. With the continuous development of science and technology, new technologies and new applications such as 5G communication, cloud computing, big data, artificial intelligence, Internet of Things, and electric vehicles continue to emerge, and the demand for PCBs is also increasing. It is worth noting that although my country is a big manufacturing country and there are many PCB companies, the product homogeneity is relatively serious, and it is excessively concentrated on low-end PCBs with cost advantages, traditional products such as single-layer/double-layer boards and multi-layer boards. In terms of high-end PCBs, the proportion of high-end PCBs is still relatively low, especially in terms of packaging substrates, high-end HDI boards, and multi-layer boards. At present, the market demand for high-end PCB boards has exploded rapidly, but the output of production capacity has increased slowly, resulting in a large gap between market demand and supply. With the continuous improvement and gradual optimization of China's PCB manufacturing technology, the market share of traditional single/double-sided PCB and multi-layer PCB has gradually declined, while the market share of high-tech and high-value-added PCB boards has continued to rise. Faced with the constant iteration and update of market demand, many PCB companies have begun to move towards the high-end PCB field with higher technical thresholds and greater capital investment. Although some technologies or production capacity are lagging behind, the market competition in the PCB industry is still fierce. The supply of high-end PCB market is still dominated by foreign manufacturers. Due to the imperfect supporting facilities around domestic PCBs, some key PCB-specific materials, high-end equipment and engineering software are dependent on imports. With the step-by-step breakthrough of domestic manufacturing technology, the relevant supply chain will also achieve good growth. Domestic PCB enterprises will gradually grow up, develop independent innovation technologies and equipment, and respond to the rapidly changing needs of the market. When the domestic PCB industry is booming, domestic PCB manufacturers have vigorously increased their high-end board business. On the one hand, they have the opportunity to escape from the low-end PCB Red Sea market, and on the other hand, they also have the opportunity to grow together with the domestic high-end industry. , to achieve a double breakthrough in technology and performance. With the market, high-end PCB products have higher requirements in terms of high-speed pcb material application, processing density and design layers. Th...

• July 15, 2022

The Technical Development of PCB Circuit Board In recent years, the focus of the printed circuit board market has shifted from computers to communications, and in the past two years, it has shifted to mobile terminals such as smartphones and tablet computers. Therefore, HDI boards for mobile terminals are the main point of PCB growth. Mobile terminals represented by smart phones drive HDI boards to be higher density and thinner. PCBs are all developing towards high-density thin lines, especially HDI boards. In the past, the definition of HDI board was that the line width/line spacing was 0.1 mm/0.1 mm and below, but now the industry basically achieves 60µm, and the advanced one is 40µm. PCB circuit pattern formation, traditionally is a chemical etching process (subtraction method) after photoimaging on a copper foil substrate. This method has many processes, difficult to control and high cost. The current fine circuit fabrication tends to be semi-additive or improved semi-fabrication. The bonding force between the conductor and the insulating substrate, the customary practice is to increase the surface roughness to increase the surface area and improve the bonding force, such as strengthening the decontamination treatment to roughen the surface of the resin layer, and use high-profile copper foil or oxidation to treat the copper surface. For thin wires, this physical method is not enough to ensure the bonding force. Therefore, the electroless copper-plated high-adhesion copper foil on the smooth resin surface was developed. For example, "molecular bonding technology" is to chemically treat the surface of the resin substrate to form a functional group that can be closely combined with the copper layer. In addition, there is the transfer of dry film imaging patterns during the production of fine lines, and the surface treatment of copper foil is one of the key factors for success. Use the best combination of surface cleaners and microetchants to provide a clean surface with sufficient area to promote dry film adhesion. Use chemical cleaning to remove the anti-discoloration treatment layer on the surface of the copper foil, as well as to remove dirt and oxides. Select an appropriate chemical cleaner according to the type of copper foil, followed by micro-etching the surface of the copper foil. In order to combine the imaging dry film with the copper layer, the solder mask pattern and the thin circuit reliably, the method of non-physical roughening of the surface should also be adopted. Semi-Additive Laminated Substrates At present, the hot spot of the semi-additive method is to use insulating dielectric film laminates. SAP is more advantageous than MSAP in terms of fine circuit realization and production cost. The thermal curing resin for SAP lamination is formed by electroplating copper after laser drilling to form via holes and circuit patterns. At present, the international HDI laminate materials use epoxy resin with different curing agents to ad...