• November 03, 2022

What Makes the HDI PCB Different? The advantages of HDI PCBs over ordinary PCBs are listed below, demonstrating how they differ from other kinds of PCBs. 1. Enhanced Thermal Efficiency Due to the use of copper foil rather than aluminum foil in FR4s, HDI PCBs have higher thermal performance. In comparison to aluminum, copper is a far superior heat conductor and can dissipate heat much more effectively. Less power is wasted as a result, which is crucial when working with high-power circuits like motor drivers or power supplies. 2. Improved Signal Integrity Because signal traces from multiple layers can be routed closer together on the same plane, HDI pcb boards are able to retain signal integrity over longer distances than conventional single-layer boards. Additionally, due to capacitance effects, signal traces on one layer can be routed over other traces on another without degrading the quality of the signal. 3. Increasing Reliability By enhancing the insulation between conductors and circuits, lowering crosstalk, and preventing short circuits between signals moving on neighboring planes, HDI pcb boards improve system dependability. Additionally, they improve mechanical strength by lowering stress concentrations brought on by densely packed components in high numbers. 4. Greater Density Compared to conventional single-layer boards, HDI pcb boards support more electrical connections per unit space. The usage of several layers in the stackup and blind vias as layer interconnects are mostly to blame for this. 5. More Compact Size HDI PCBs are more compact than conventional PCBs because of the enhanced trace density. As a result, they take up less space on one board, making them perfect for portable gadgets like laptops, tablets, and smartphones. Additionally, because of their reduced size, they are simpler to manufacture on a single assembly line without the need for special tools for each product's various sizes. 6. Mechanical Power Standard PCBs cannot sustain the amount of stress that HDI PCBs. This is a result of their construction, which consists of several sheets of thin plastic linked together with an epoxy adhesive. Depending on the kind of resin used in construction, each layer's strength varies. 7. Lower Price HDI pcb boards can be less expensive than other kinds of multilayer boards and other kinds of boards produced from copper-clad laminate because they are easier to make and less expensive to create than single-sided boards (CCL). Both low-volume production runs and high-volume production runs are compatible with them. HDI PCBs for a Variety of Applications Where reliability is crucial, HDI PCBs are frequently utilized in avionics, military, and aerospace applications. A typical airplane requires hundreds of microcircuits, sensors, and other electronic parts, all of which must be wired together. The conventional method calls for all of these wires to be soldered directly on top of one another, which frequently results in a number of iss...

• October 18, 2022

American PCB manufacturer Calumet Electronics plans to build an advanced packaging substrate manufacturing plant in China The US PCB manufacturer Calumet Electronics said in an external statement that the company is working hard to fill a key gap in the production capacity of packaging substrates in the United States. "Calumet will be one of the first, if not the first, to bring scalable IC substrate capacity to the U.S.," said Todd Brassard, the company's chief operating officer. "We've been developing this capability for about three years. We have partnered with some Defense and commercial OEMs have collaborated to complete the first substrate sample fabrication. We have received in-demand requests for our substrates in excess of 1.5 million units per year before we even started production.” The United States currently lags behind Asian suppliers significantly in the field of IC packaging substrates, especially the FCBGA and FCCSP substrates used for advanced packaging are almost completely dependent on Asian manufacturers such as Xinxing, ASE, Ibiden, etc., and low-volume customized substrates involving national defense and other needs are often Lead times are several years. According to Brassard, Calumet is one of the few PCB companies in the United States that can produce high-density interconnect (HDI) circuit boards, and it is also one of the few manufacturers with ABF substrate research and development capabilities. Customers in the fields of satellite communications, medical equipment and other fields provide customized development services.

• September 30, 2022

Holiday Notice for People's Republic of China National Day Dear customers: We will have National Day holiday from Oct.01-Oct.07, 2022. And we will resume normal work on Oct.08. During Holidays, should you have any enquiries, please feel free to email to infor@bichengpcb,com. Thank you. Best regards, Shenzhen Bicheng Electronics Technology Co., Ltd

• September 22, 2022

What is the difference between Rogers PCB and ordinary PCB? Compared with ordinary PCB, Rogers is more suitable for making high-frequency PCB, and the board has better stability and higher precision. Rogers board has the following 4 series: RO4000 PCB board: Hydrocarbon-filled ceramic laminate with excellent cost performance. High-reliability TMM: rich dielectric constant, DK from 3.27-12.85, extremely low change with temperature, excellent mechanical properties, can resist creep flow and cold flow. High thermal conductivity 92ML: Epoxy resin + high thermal conductivity ceramic powder filled high thermal conductivity and high withstand voltage electronic material, UL MOT150 ℃, the absolute value of the same medium thickness withstand higher, 8mil> 4500VAC High-reliability RT / Duroid 5000/6000: PTFE filled ceramic or random glass fiber laminates with strict batch consistency and extremely stable electrical performance. Focus on high reliability and high stability applications. Rogers products are mainly used in: Mobile communication RF power amplifier circuit & antenna, microwave millimeter wave antenna, LNB for satellite broadcasting, microwave communication, millimeter-wave radar and optical communication, high-performance high-speed digital circuit multilayer PCB, high power and high thermal conductivity, automotive electronics, power supply, etc.

• September 16, 2022

What is a flexible PCB material? The Flex PCB board usually consists of the following five parts. 1.Insulating Substrate The insulating substrate is a flexible insulating film. As the insulating carrier of the circuit board, selecting a flexible dielectric film requires a comprehensive review of the material's heat resistance, shape-forming properties, thickness, mechanical properties, and electrical properties. Now flex PCB is commonly used PI: Polyimide, Kapton. PET: PolyeSTer, Mylar. PTFE: Polytetrafluoroethylene Generally, the thickness of the film is selected in the range of O.0127 to O.127 mm (0.5 to 5 mil). 2.Adhesive Sheet The function of the adhesive sheet is to bond the film and the metal foil, or the adhesive film and the film (the cover film). Different types of adhesive sheets can be used for different film substrates, such as polyester adhesive sheets and polyimide adhesive sheets. Polyimide substrate adhesive sheets are divided into epoxy and acrylic. The choice of bonding sheet mainly examines the fluidity of the material and its thermal expansion coefficient. There is also polyimide copper-clad sheets without adhesive sheets, which have better chemical resistance and electrical properties. Due to the low glass transition temperature of the acrylic adhesive sheet, a large amount of contamination generated during the drilling process is not easy to remove, which affects the quality of metalized holes and other unsatisfactory materials. Therefore, the interlayer adhesion of multilayer flexible circuits The common polyimide material of the sheet, because it is matched with the polyimide substrate, have the same CTE (coefficient of thermal expansion), which overcomes the problem of dimensional instability in multilayer flexible circuits, and other properties are satisfactory. 3.Copper Foil The copper foil is a conductive layer covered on an insulating base material, and a conductive circuit is formed after selective etching. Most of such copper foils are rolled copper foil (Rolled Copper Foil) or electrolytic copper foil (Electrodeposited Copper Foil). The ductility and bending resistance of rolled copper foil are better than that of electrolytic copper foil. According to coating online understanding, the elongation of rolled copper foil is 20% to 45%, and the elongation of electrolytic copper foil is 4% to 40%. The thickness of the copper foil is most commonly 35um (1oz), there are 18um (O.5oz) thin or 70um (2oz) thick, and even 105um (30z). Electrolytic copper foil is formed by electroplating. The crystal state of the copper particles is vertical needle shape, which is easy to form vertical line edges during etching, which is beneficial to the production of precision circuits. But when the bending radius is less than 5mm or the dynamic bending, the needle-like structure is prone to fracture. Therefore, most of the flexible circuit substrates are rolled copper foil, whose copper particles have a horizont...

• September 09, 2022

Holiday Notice Mid-Autumn Festival Dear customers: We will have Mid-Autumn Festival holiday from Sep.10-Sep.12, 2022. And we will resume normal work on Sep.13. During Holidays, should you have any enquiries, please feel free to email to infor@bichengpcb,com. Thank you. Best regards, Shenzhen Bicheng Electronics Technology Co., Ltd