Kappa 438PCB 60mil Rogers Material High Frequency Board Immersion Gold
Introduction
In this discussion, we will explore the benefits of Rogers Kappa 438 PCBs, which serve as an excellent alternative to FR-4 materials for wireless circuit designers. These PCBs offer improved performance, consistency, and reliability while remaining cost-effective and user-friendly.
The Kappa 438 laminates are composed of a hydrocarbon ceramic system reinforced with glass, providing a low-loss material. They can be manufactured using standard epoxy/glass (FR-4) processes, simplifying the fabrication of circuits.
Kappa 438 laminates meet the UL 94 V-0 flame retardancy rating and are compatible with lead-free solder processes.
Now let's proceed to the data sheet.
Kappa 438 Typical Properties
The dielectric constant of the material is 4.38 at 2.5 GHz, with a dissipation factor of 0.005 at 10 GHz and 23°C.
Over a temperature range of -50°C to 150°C, the thermal coefficient of the dielectric constant is -21 ppm/°C at 10 GHz.
Kappa 438 exhibits a volume resistivity of 2.9 x 10^9 MΩ•cm and a surface resistivity of 6.2 x 10^7 MΩ.
More typical properties as follows:
|
Property
|
Kappa 438
|
Direction
|
Units
|
Condition
|
Test Method
|
|
Dielectric Constant, er Design
|
4.38
|
Z
|
-
|
2.5 GHz
|
Differential Phase Length Method
|
|
Dissipation Factor tan
|
0.005
|
Z
|
-
|
10 GHz/23°C
|
IPC-TM-650 2.5.5.5
|
|
Thermal Coefficient of Dielectric Constant
|
-21
|
-
|
ppm/°C
|
10 GHz (-50 to 150°C)
|
Modified IPC-TM-650 2.5.5.5
|
|
Volume Resistivity
|
2.9 x 109
|
-
|
MΩ•cm
|
COND A
|
IPC-TM-650 2.5.17.1
|
|
Surface Resistivity
|
6.2 x 107
|
-
|
MΩ
|
COND A
|
IPC-TM-650 2.5.17.1
|
|
Electrical Strength
|
675
|
Z
|
V/mil
|
-
|
IPC-TM-650 2.5.6.2
|
|
Tensile Strength
|
16 12
|
MD CMD
|
kpsi
|
-
|
ASTM D3039/D3039-14
|
|
Flexural Strength
|
25 19
|
MD CMD
|
kpsi
|
-
|
IPC-TM-650 2.4.4
|
|
Dimensional Stability
|
-0.48 -0.59
|
MD CMD
|
mm/m
|
-
|
IPC-TM-650 2.4.39a
|
|
Coefficient of Thermal Expansion
|
13
|
X
|
ppm/°C
|
-55 to 288°C
|
IPC-TM-650 2.4.41
|
|
16
|
Y
|
|
42
|
Z
|
|
Thermal Conductivity
|
0.64
|
Z
|
W/(m.K)
|
80°C
|
ASTM D5470
|
|
Time to Delamination (T288)
|
>60
|
-
|
minutes
|
288°C
|
IPC-TM-650 2.4.24.1
|
|
Tg
|
>280
|
-
|
°C TMA
|
-
|
IPC-TM-650 2.4.24.3
|
|
Td
|
414
|
-
|
°C
|
-
|
IPC-TM-650 2.3.40
|
|
Moisture Absorption
|
0.07
|
-
|
%
|
24/23
|
IPC-TM-650 2.6.2.1
|
|
Young’s Modulus
|
2264 2098
|
MD CMD
|
kpsi
|
-
|
ASTM D3039/D3039-14
|
|
Flex Modulus
|
2337 2123
|
MD CMD
|
kpsi
|
-
|
IPC-TM-650 2.4.4
|
|
Bow
|
0.03
|
-
|
%
|
-
|
IPC-TM-650 2.4.22C
|
|
Twist
|
0.08
|
-
|
%
|
-
|
IPC-TM-650 2.4.22C
|
|
Copper Peel Strength After Thermal Stress
|
5.8
|
-
|
lbs/in
|
1 oz (35 µm) foil
|
IPC-TM-650 2.4.8
|
|
Flammability
|
V-0
|
-
|
-
|
-
|
UL 94
|
|
Specific Gravity
|
1.99
|
-
|
g/cm3
|
-
|
ASTM D792
|
|
Lead-Free Process Compatible
|
Yes
|
-
|
-
|
-
|
|
Our Kappa 438 PCB Capability
|
PCB material:
|
Glass Reinforced Hydrocarbon Ceramic Substrates
|
|
Designation:
|
Kappa 438
|
|
Dielectric constant:
|
4.38
|
|
Layer count:
|
Double layer, Multi-layer, Hybrid PCB
|
|
Copper weight:
|
1oz (35µm), 2oz (70 µm)
|
|
PCB thickness:
|
20mil (0.508mm), 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm)
|
|
PCB size:
|
≤400mm X 500mm
|
|
Solder mask:
|
Green, Black, Blue, Yellow, Red etc.
|
|
Surface finish:
|
Immersion gold, HASL, Immersion silver, Immersion tin, Pure gold, OSP, ENEPIG, Bare copper, etc..
|
A Sample of Kappa 438 PCB
Displayed on the follow is a 60mil Kappa 438 high frequency PCB with immersion gold coating, specifically designed for carrier-grade WiFi applications.
Kappa 438 PCBs offer versatility and can be utilized in a wide range of applications. They are particularly well-suited for Licensed Assisted Access (LAA) and are ideal for Small Cell and Distributed Antenna Systems (DAS), providing high-performance and reliable connectivity for Vehicle-to-Vehicle (V2V) and Vehicle-to-Infrastructure (V2I) communications.
Moreover, Rogers Kappa 438 60mil PCBs are an excellent choice for Internet of Things (IoT) applications, making them ideal for use in Smart Home devices and Wireless Meters, enabling efficient and secure wireless communication.
Conclusion
By employing Kappa 438 60mil laminates, wireless circuit designers can achieve significant advancements beyond the limitations of FR-4 materials. These laminates strike an optimal balance between price, performance, and reliability, and can be fabricated using standard epoxy/glass (FR-4) processes. Additionally, they are compatible with conventional bondplies and lead-free solder processes.
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