RF-60TC PCB 25mil Taconic Substrate High Frequency Board
Introduction:
We're here to introduce an advanced type of PCB that offers improved heat dissipation and remarkably low loss - the RF-60TC high frequency PCB.
The RF-60TC PCB is composed of a PTFE-based substrate with ceramic-filled fiberglass. It serves as an ideal material for high power RF and microwave applications. Designed to enhance dielectric heat dissipation and minimize dielectric losses, this PCB enables lower operating temperatures in high power applications and delivers improved gains and efficiencies in miniaturized antenna applications within the 6.15 DK market segment.
Now, let's delve into the specific properties of the RF-60TC PCB.
Typical Properties of RF-60TC
At a frequency of 10 GHz, the RF-60TC PCB has a dielectric constant (Dk) of 6.15 ± 0.15 and a dielectric loss tangent (Df) of 0.002.
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Property
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Unit
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RF-60TC Value
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Test Method
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Electrical Properties
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Dk @ 10 GHz
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6.15 ± 0.15
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IPC-650 2.5.5.5.1 (Modified)
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Df @ 10 GHz
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0.002
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IPC-650 2.5.5.5.1 (Modified)
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Dielectric Breakdown
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kV
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55
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IPC-650 2.5.6
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Dielectric Strength
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V/mil (V/mm)
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550 (21,654)
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IPC-650 2.5.6.2
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Arc Resistance
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Seconds
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>180
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IPC-650 2.5.1
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Surface Resistivity
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Mohm
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1.0 x 108
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IPC-650 2.5.17.1 (After Humidity)
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Volume Resistivity
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Mohm/cm
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1.0 x 108
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IPC-650 2.5.17.1 (After Humidity)
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Mechanical Properties
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Flexural Strength (MD)
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psi (N/mm2)
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10000 (69)
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IPC-650 2.4.4
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Flexural Strength (CD)
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psi (N/mm2)
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9000 (62)
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IPC-650 2.4.4
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Tensile Strength (MD)
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psi (N/mm2)
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9000 (62)
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IPC-650 2.4.19
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Tensile Strength (CD)
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psi (N/mm2)
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7000 (48)
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IPC-650 2.4.19
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Young’s Modulus (MD)
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kpsi (N/mm2)
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721 (4971)
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ASTM D 3039/IPC-TM-650 2.4.19
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Poisson’s Ratio (MD)
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0.155
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ASTM D 3039/IPC-TM-650 2.4.19
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Dimensional Stability (MD)
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mils/in
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0.01
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IPC-650 2.4.39 Sec. 5.4 (After Bake)
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Dimensional Stability (CD)
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mils/in
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0.69
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IPC-650 2.4.39 Sec. 5.4 (After Bake)
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Dimensional Stability (MD)
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mils/in
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0.06
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IPC-650 2.4.39 Sec. 5.5 (Thermal Stress)
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Dimensional Stability (CD)
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mils/in
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0.8
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IPC-650 2.4.39 Sec. 5.5 (Thermal Stress)
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Thermal Properties
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Thermal Conductivity (Unclad)
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W/M*K
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0.9
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IPC-650 2.4.50
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Thermal Conductivity (CH/CH)
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W/M*K
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1
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IPC-650 2.4.50
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Thermal Conductivity (C1/C1)
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W/M*K
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1.05
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IPC-650 2.4.50
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TCDk
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ppm/°C
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-3.581
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|
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CTE (X, Y axis)
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ppm/°C
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9.9
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IPC-650 2.4.41 (RT- 150°C)
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CTE (Z axis)
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ppm/°C
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40
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IPC-650 2.4.41 (RT- 150°C)
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Physical Properties
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Moisture Absorption
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%
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0.03
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IPC-650 2.6.2.1
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Peel Strength (1 oz. ED)
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lbs/in (N/mm)
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8 (1.43)
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IPC-650 2.4.8
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Density (Specific Gravity)
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g/cm3
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2.84
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IPC-650 2.3.5
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Specific Heat
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J/gK
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0.94
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IPC-650 2.4.50
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Td (2% Wt. Loss)
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°C (°F)
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500 (930)
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IPC - 650 2.4.24.6 / TGA
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Td (5% Wt. Loss)
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°C (°F)
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515 (960)
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IPC - 650 2.4.24.6 / TGA
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Flammability Rating
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V-0
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UL 94
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RF-60TC PCB Capabilities
Our PCBs come in a comprehensive range, including single-layer, double-layer, multi-layer, and hybrid options.
When it comes to Taconic RF-60TC PCB, we offer a wide range of thicknesses. Starting from the thinnest at 5 mils, the options increase in 5-mil increments: 10 mils, 20 mils, 25 mils, 30 mils, 60 mils, and so on.
The finished copper on track lines can be either one ounce or two ounces.
With a single board or multiple designs within a panel, the maximum PCB size we offer is 400mm X 500mm.
We provide various solder mask colors in-house, such as Green, Black, Blue, Red, and Yellow.
Lastly, we offer multiple surface finish options to cater to diverse PCB requirements. These options include HASL, Immersion gold, Immersion silver, Immersion tin, OSP, ENEPIG, Pure gold, and Bare copper.
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PCB material:
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PTFE based, ceramic filled fiberglass
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Designation:
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RF-60TC
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Dielectric constant:
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6.15
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Layer count:
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Single layer, Double layer, Multi-layer, Hybrid PCB
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PCB thickness:
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5mil (0.127mm); 10mil (0.254mm); 20mil (0.508mm), 25mil(0.635mm); 30mil (0.762mm), 60mil (1.524mm)
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Copper weight:
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1oz (35µm), 2oz (70µm)
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PCB size:
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≤400mm X 500mm
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Solder mask:
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Green, Black, Blue, Red, Yellow etc.
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Surface finish:
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HASL, Immersion gold, Immersion silver, Immersion tin, OSP, ENEPIG, Pure gold and Bare copper etc..
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A Sample RF-60TC PCB
Displayed on the screen is an example of a double-sided RF-60TC PCB built on 25-mil Taconic substrates with immersion gold pads, specifically designed for divider applications.
RF-60TC PCBs find applications in various fields, including High Power Amplifiers, Miniaturized Antennas, GPS, Patch, RFID readers, Filters, Couplers, and Satellites, among others.
Conclusion
RF-60TC vs. FR-4: Compared to traditional FR-4 PCBs,Taconic RF-60TC PCBsoffer superior electrical performance, higher thermal conductivity, lower dielectric losses, and improved dimensional stability. These advantages make them more suitable for demanding high-frequency and high-power applications.
The RF-60TC high frequency board is a collection of mechanically supported laminates with high thermal conductivity, providing three to five times the thermal conductivity of FR-4 alternatives.
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Email : info@bichengpcb.com
