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The RO3210 2-Layer PCB is a high-performance,high-frequency circuit board optimized for RF, microwave, and wireless applications.
Item NO.:
BIC-390-v473.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
RO3210 PCB 2-layer Rogers 3210 30mil 0.762mm Substrate ENIG 1oz Copper
Product Overview
The RO3210 PCB is a high-performance 2-layer rigid printed circuit board designed for high-frequency applications, offering excellent electrical performance, thermal stability, and mechanical rigidity. This PCB is constructed using Rogers RO3210 material, a ceramic-filled, woven fiberglass-reinforced laminate that ensures superior signal integrity and dimensional stability.
With a 0.8mm finished thickness, 1oz copper weight, and Immersion Gold (ENIG) surface finish, this Rogers 3210 PCB is optimized for RF/microwave applications, automotive radar systems, wireless communications, and satellite technologies. The board features 4/7 mil trace/space design rules, 0.3mm minimum hole size, and 100% electrical testing to ensure reliability.
Below is a detailed breakdown of the PCB construction, stackup, and statistics, followed by an in-depth analysis of the RO3210 30 mil substrate properties, benefits, and applications.
PCB Construction
Parameter |
Specification |
Base Material |
RO3210 (Rogers) |
Layer Count |
2-layer |
Board Dimensions |
16mm x 8mm (±0.15mm) |
Minimum Trace/Space |
4/7 mils |
Minimum Hole Size |
0.3mm |
Blind/Buried Vias |
No |
Finished Thickness |
0.8mm |
Copper Weight (Outer) |
1oz (35µm) |
Via Plating Thickness |
20µm |
Surface Finish |
Immersion Gold (ENIG) |
Top Silkscreen |
White |
Bottom Silkscreen |
No |
Top Solder Mask |
Green |
Bottom Solder Mask |
No |
Electrical Testing |
100% tested |
PCB Stackup (2-Layer Design)
The stackup consists of a 30 mil RO3210 core with 1oz copper layers on both sides.
Layer |
Material/Thickness |
Top Copper |
35µm (1oz) |
Core |
RO3210 (0.762mm / 30mil) |
Bottom Copper |
35µm (1oz) |
PCB Statistics
The Rogers board contains 3 components, 10 pads (6 thru-hole, 4 SMT), and 5 vias, supporting 2 nets for simple yet efficient circuit routing.
Parameter |
Count |
Components |
3 |
Total Pads |
10 |
Thru-Hole Pads |
6 |
Top SMT Pads |
4 |
Bottom SMT Pads |
0 |
Vias |
5 |
Nets |
2 |
Additional PCB Specifications
Introduction to RO3210
RO3210 is a high-frequency laminate from Rogers Corporation, designed for RF/microwave applications. It combines woven fiberglass reinforcement with a ceramic-filled PTFE matrix, providing:
Key Features of RO3210
Property |
Value |
Dielectric Constant (Dk) |
10.2 ±0.5 |
Dissipation Factor (Df) |
0.0027 @ 10GHz |
Coefficient of Thermal Expansion (CTE) |
13/13/34 ppm/°C (x/y/z) |
Decomposition Temperature (Td) |
500°C (TGA) |
Thermal Conductivity |
0.81 W/m·K |
Flammability Rating |
UL 94 V0 |
Benefits of RO3210 PCBs
✔Woven Glass Reinforcement–Enhances rigidity for easier handling.
✔Uniform Electrical & Mechanical Performance–Ideal for multi-layer RF structures.
✔Low CTE (Matched to Copper)–Ensures reliability in SMT assemblies.
✔Excellent Dimensional Stability–Improves manufacturing yield.
✔Smooth Surface Finish–Enables finer line etching tolerances.
Typical Applications
RO3210 high frequency PCBs are widely used in:
Conclusion
The RO3210 2-Layer PCB is a high-performance,high-frequency circuit board optimized for RF, microwave, and wireless applications. With ENIG surface finish, 4/7 mil trace/space, and Rogers RO3210 core material, it delivers superior signal integrity, thermal stability, and mechanical strength.
Whether for automotive radar, 5G infrastructure, or satellite communications, this PCB ensures reliability, precision, and high-speed performance.
For global availability and IPC-Class-2 quality assurance, this board is an excellent choice for demanding RF applications.
Contact us today for pricing, lead times, and custom configurations!
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