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The RO3003G2 2-layer PCB is a high-performance solution for millimeter-wave and automotive radar applications.
Item NO.:
BIC-389-v472.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
RogersRO3003G2 PCB 2-layer 5mil0.127mm ENIG Custom High Frequency Board
Product Overview
The RO3003G2 PCB is a high-performance, 2-layer printed circuit board designed for millimeter-wave automotive radar and advanced driver-assistance systems (ADAS). Manufactured using Rogers RO3003G2 laminate—a ceramic-filled PTFE material—this PCB delivers ultra-low insertion loss, stable dielectric constant, and superior thermal stability, making it ideal for next-generation automotive safety applications.
With a 5mil (0.127mm) core thickness, 1oz copper weight, and immersion gold surface finish, this RO3003G2 material PCB ensures reliable performance in high-frequency environments. The board is manufactured to IPC-Class-2 standards, undergoes 100% electrical testing, and is available for worldwide shipping.
PCB Construction Details
Below is a summary of the key structural specifications of the RO3003G2 5 mil PCB, followed by a detailed breakdown in table format.
Parameter |
Specification |
Base Material |
Rogers RO3003G2 |
Layer Count |
2-layer |
Board Dimensions |
95mm x 95mm (±0.15mm) |
Minimum Trace/Space |
14/14 mils |
Minimum Hole Size |
0.2mm |
Blind Vias |
No |
Finished Board Thickness |
0.2mm |
Finished Copper Weight |
1oz (35μm) outer layers |
Via Plating Thickness |
20μm |
Surface Finish |
Immersion Gold (ENIG) |
Top Silkscreen |
No |
Bottom Silkscreen |
No |
Top Solder Mask |
No |
Bottom Solder Mask |
No |
Electrical Testing |
100% tested prior to shipment |
PCB Stackup (2-Layer Rigid PCB)
The 2-layer stackup is optimized for high-frequency signal integrity with a thin, low-loss Rogers RO3003G2 core.
Layer |
Material/Thickness |
Copper Layer 1 (Top) |
35μm (1oz) |
Core |
Rogers RO3003G2 (0.127mm/5mil) |
Copper Layer 2 (Bottom) |
35μm (1oz) |
PCB Statistics
This Rogers circuit board is designed for compact, high-frequency applications with minimal component count but high routing density.
Parameter |
Count |
Components |
8 |
Total Pads |
31 |
Thru-Hole Pads |
17 |
Top SMT Pads |
14 |
Bottom SMT Pads |
0 |
Vias |
42 |
Nets |
2 |
Key Features of RO3003G2 Material
Rogers RO3003G2 is ahigh-frequency laminate engineered for millimeter-wave automotive radar (77GHz) and 5G applications. Its optimized resin and filler system ensure low insertion loss, stable dielectric constant, and excellent thermal performance.
Material Properties
Benefits of RO3003G2 PCB
✔Best-in-class insertion loss for high-frequency applications
✔Minimized Dk variation for consistent signal integrity
✔Supports fine-pitch vias for high-density designs
✔Thermally stable for automotive and RF applications
Typical Applications
This RO3003G2 high frequency PCB is ideal for automotive radar systems and ADAS functionalities, including:
Quality & Manufacturing Standards
Conclusion
Our RO3003G2 2-layer PCB is a high-performance solution for millimeter-wave and automotive radar applications. With its low-loss dielectric properties, precise manufacturing tolerances, and immersion gold finish, it ensures reliable signal transmission in demanding environments. Whether for ADAS, 5G, or RF systems, this PCB delivers exceptional electrical and thermal performance.
For further inquiries or customization options, please contact our sales team.
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