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The RO4725JXR 2-Layer ENIG PCB is a high-performance, cost-efficient solution for RF and antenna applications.
Item NO.:
BIC-393-v476.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
Rogers RO4725JXR PCB 2-layer 30.7mil ENIG 35μm Copper Bare Board
Product Overview
This RO4725JXR 2-Layer PCB is a high-frequency, antenna-grade circuit board designed for superior signal integrity and thermal stability. This 30.7mil (0.78mm) thick PCB features Immersion Gold (ENIG) surface finish, ensuring excellent solderability and corrosion resistance. Manufactured withRogers RO4725JXR hydrocarbon/ceramic laminate, this board is an ideal low-cost alternative to traditional PTFE-based materials while maintaining outstanding electrical performance.
PCB Construction Details
The following table summarizes the key construction parameters of the RO4725JXR PCB:
Parameter |
Specification |
Base Material |
Rogers RO4725JXR |
Layer Count |
2-layer |
Board Dimensions |
53mm × 79mm (±0.15mm) |
Minimum Trace/Space |
4/7 mil |
Minimum Hole Size |
0.3mm |
Blind Vias |
No |
Finished Board Thickness |
0.8mm (30.7 mil) |
Finished Cu Weight |
1oz (35μm) outer layers |
Via Plating Thickness |
20 μm |
Surface Finish |
Immersion Gold (ENIG) |
Top/Bottom Silkscreen |
No |
Top/Bottom Solder Mask |
No |
Electrical Testing |
100% tested prior to shipment |
PCB Stackup
The 2-layer stackup is optimized for high-frequency performance with a symmetrical copper distribution:
Layer |
Material/Thickness |
Copper Layer 1 (Top) |
35 μm (1oz) |
Core |
Rogers RO4725JXR – 0.78mm |
Copper Layer 2 (Bottom) |
35 μm (1oz) |
PCB Statistics
The Rogers board features a compact design with the following component and connectivity details:
Parameter |
Count |
Components |
6 |
Total Pads |
39 |
Thru-Hole Pads |
31 |
Top SMT Pads |
8 |
Bottom SMT Pads |
0 |
Vias |
20 |
Nets |
2 |
Key Features of RO4725JXR Material
Benefits of Using RO4725JXR PCB
✔Low Signal Loss–Optimized for high-frequency RF applications.
✔Cost-Effective Alternative–Cheaper than PTFE-based laminates without sacrificing performance.
✔Thermal Stability–Low CTE and high Tg ensure reliability under thermal stress.
✔Excellent PIM Performance–Ideal for cellular base stations and wireless systems.
✔Compatible with Standard FR-4 Processes–No special handling required.
Typical Applications
Quality & Availability
Conclusion
The RO4725JXR 2-Layer ENIG PCB is a high-performance, cost-efficient solution for RF and antenna applications. With its low-loss dielectric, excellent thermal properties, and superior PIM performance, it is an ideal choice for modern wireless communication systems. Whether for 5G infrastructure, base station antennas, or high-frequency RF designs, this RO4725JXR high frequency PCB delivers reliability, signal integrity, and manufacturing efficiency.
For inquiries or custom requirements, please contact our sales team for further assistance.
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