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Home Newly Shipped RF PCB Rogers RO4725JXR PCB 2-layer 30.7mil ENIG 35μm Copper Bare Board

Rogers RO4725JXR PCB 2-layer 30.7mil ENIG 35μm Copper Bare Board

The RO4725JXR 2-Layer ENIG PCB is a high-performance, cost-efficient solution for RF and antenna applications.

  • Item NO.:

    BIC-393-v476.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


Rogers RO4725JXR PCB 2-layer 30.7mil ENIG 35μm Copper Bare Board

 

Product Overview

This RO4725JXR 2-Layer PCB is a high-frequency, antenna-grade circuit board designed for superior signal integrity and thermal stability. This 30.7mil (0.78mm) thick PCB features Immersion Gold (ENIG) surface finish, ensuring excellent solderability and corrosion resistance. Manufactured withRogers RO4725JXR hydrocarbon/ceramic laminate, this board is an ideal low-cost alternative to traditional PTFE-based materials while maintaining outstanding electrical performance.

 

 

PCB Construction Details

The following table summarizes the key construction parameters of the RO4725JXR PCB:

 

Parameter

Specification

Base Material

Rogers RO4725JXR

Layer Count

2-layer

Board Dimensions

53mm × 79mm (±0.15mm)

Minimum Trace/Space

4/7 mil

Minimum Hole Size

0.3mm

Blind Vias

No

Finished Board Thickness

0.8mm (30.7 mil)

Finished Cu Weight

1oz (35μm) outer layers

Via Plating Thickness

20 μm

Surface Finish

Immersion Gold (ENIG)

Top/Bottom Silkscreen

No

Top/Bottom Solder Mask

No

Electrical Testing

100% tested prior to shipment

 

 

PCB Stackup

The 2-layer stackup is optimized for high-frequency performance with a symmetrical copper distribution:

 

Layer

Material/Thickness

Copper Layer 1 (Top)

35 μm (1oz)

Core

Rogers RO4725JXR – 0.78mm

Copper Layer 2 (Bottom)

35 μm (1oz)

 

 

PCB Statistics

The Rogers board features a compact design with the following component and connectivity details:

 

Parameter

Count

Components

6

Total Pads

39

Thru-Hole Pads

31

Top SMT Pads

8

Bottom SMT Pads

0

Vias

20

Nets

2

 

RO4725JXR PCB 2-layer 30.7mil ENIG

 

Key Features of RO4725JXR Material


  • Dielectric Constant (Dk): 2.55±0.05 @ 10 GHz/23°C
  • Dissipation Factor (Df): 0.0026 @ 10 GHz, 0.0022 @ 2.5 GHz
  • Thermal Coefficient of Dk: +34 ppm/°C
  • CTE Matched to Copper: X=13.9 ppm/°C, Y=19 ppm/°C, Z=25.6 ppm/°C
  • High Glass Transition Temp (Tg): >280°C
  • Exceptional PIM Performance: -166 dBc


 

Benefits of Using RO4725JXR PCB

✔Low Signal Loss–Optimized for high-frequency RF applications.

✔Cost-Effective Alternative–Cheaper than PTFE-based laminates without sacrificing performance.

✔Thermal Stability–Low CTE and high Tg ensure reliability under thermal stress.

✔Excellent PIM Performance–Ideal for cellular base stations and wireless systems.

✔Compatible with Standard FR-4 Processes–No special handling required.

  

Typical Applications


  • Cellular Base Station Antennas
  • RF and Microwave Circuits
  • 5G and mmWave Communication Systems
  • Satellite Communication Devices
  • High-Frequency Radar Systems


 

Quality & Availability


  • Artwork Format: Gerber RS-274-X
  • Quality Standard: IPC-Class-2
  • Global Availability: Shipped worldwide


 

Conclusion

The RO4725JXR 2-Layer ENIG PCB is a high-performance, cost-efficient solution for RF and antenna applications. With its low-loss dielectric, excellent thermal properties, and superior PIM performance, it is an ideal choice for modern wireless communication systems. Whether for 5G infrastructure, base station antennas, or high-frequency RF designs, this RO4725JXR high frequency PCB delivers reliability, signal integrity, and manufacturing efficiency.

 

For inquiries or custom requirements, please contact our sales team for further assistance.





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Major material Supplier



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