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This RO4003C high frequency PCB is a high-performance, cost-effective solution for RF and microwave applications.
Item NO.:
BIC-391-v474.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
RO4003C PCB 2-layer Rogers 4003C Substrate 16mil ENIG 1oz Copper Black Silkscreen
Introduction
The RO4003C 2-layer PCB is a high-frequency, high-performance circuit board designed for RF and microwave applications. With a 16mil (0.406mm) Rogers RO4003C core, 1oz copper weight, and Electroless Nickel Immersion Gold (ENIG) surface finish, this PCB delivers excellent signal integrity, thermal stability, and manufacturability.
Engineered for high-frequency applications, this Rogers RO4003C PCB is ideal for cellular base stations, automotive radar, RF identification tags, and satellite communications. The low-loss dielectric properties of RO4003C Substrate, combined with tight impedance control, make it a cost-effective alternative to traditional PTFE-based microwave laminates while maintaining superior electrical performance.
Below is a detailed breakdown of the PCB’s construction, stackup, statistics, and key benefits.
PCB Construction Details
The following table summarizes the key construction parameters of the RO4003C PCB:
Parameter |
Specification |
Base Material |
Rogers RO4003C |
Layer Count |
Double-sided (2-layer) |
Board Dimensions |
38.8mm x 52.4mm (±0.15mm tolerance) |
Minimum Trace/Space |
5/5 mils |
Minimum Hole Size |
0.2mm |
Blind Vias |
No |
Finished Board Thickness |
0.5mm |
Finished Copper Weight |
1oz (35µm / 1.4 mils) |
Via Plating Thickness |
20µm |
Surface Finish |
Electroless Nickel Immersion Gold (ENIG) |
Top Silkscreen |
Black |
Bottom Silkscreen |
No |
Top Solder Mask |
No |
Bottom Solder Mask |
No |
Electrical Testing |
100% tested prior to shipment |
PCB Stackup
The PCB follows a simple 2-layer stackup with a Rogers 4003C core for optimal RF performance.
Layer |
Material |
Thickness |
Copper Layer 1 (Top) |
1oz Copper (35µm) |
35µm (1.4 mils) |
Core |
Rogers RO4003C |
0.406mm (16mil) |
Copper Layer 2 (Bottom) |
1oz Copper (35µm) |
35µm (1.4 mils) |
PCB Statistics
The Rogers RO4003C High Frequency PCB has a low component count, making it suitable for compact RF designs.
Parameter |
Count |
Components |
6 |
Total Pads |
17 |
Thru-Hole Pads |
11 |
Top SMT Pads |
6 |
Bottom SMT Pads |
0 |
Vias |
9 |
Nets |
2 |
Additional Specifications
Key Features of RO4003C
Benefits of RO4003C PCB
✔Cost-Effective RF Solution–Processes like FR-4 but with superior RF performance.
✔Stable Dk & Low Loss–Ensures consistent signal integrity in high-frequency applications.
✔Excellent Plated Through-Hole Reliability–Low Z-axis CTE prevents via cracking.
✔Moisture Resistant–Low absorption ensures stable performance in humid environments.
✔Ideal for Mixed-Dielectric Multilayer Boards–Compatible with FR-4 in hybrid designs.
Typical Applications
Conclusion
This RO4003C high frequency PCB is a high-performance, cost-effective solution for RF and microwave applications. With ENIG surface finish, tight impedance control, and low-loss dielectric properties, it is ideal for high-frequency, high-reliability designs.
Available worldwide and manufactured to IPC-Class-2 standards, this RO4003C 16mil PCB ensures consistent quality and performance for demanding applications.
For custom requirements or bulk orders, please contact our sales team for further assistance.
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