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The 4-Layer RO3003 PCB is a state-of-the-art solution for high-frequency applications, combining the superior properties of Rogers RO3003 laminates with advanced manufacturing techniques.
Item NO.:
BIC-316-v392.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
RO3003 PCB 4-layer 1.6mm Thick Rogers 3003 Multilayer Circuit Board
In the ever-evolving world of high-frequency electronics, the demand for reliable, high-performance printed circuit boards (PCBs) is at an all-time high. The RO3003 4-Layer PCB is a cutting-edge solution designed to meet the rigorous demands of modern RF and microwave applications. Engineered with Rogers RO3003 high-frequency laminates, this multilayer PCB board is ideal for industries such as automotive radar, 5G wireless infrastructure, and advanced driver assistance systems (ADAS). With its exceptional dielectric stability, low loss, and robust mechanical properties, the RO3003 4-Layer PCB is a game-changer for high-frequency designs.
What is RO3003 Material?
Rogers RO3003 is a ceramic-filled PTFE (Polytetrafluoroethylene) composite specifically designed for commercial microwave and RF applications. Unlike traditional PTFE glass materials, Rogers3003 offers unparalleled stability in dielectric constant (Dk) across a wide range of temperatures and frequencies. This eliminates the step change in Dk that typically occurs near room temperature, making it a superior choice for high-frequency applications. Its unique properties make it ideal for use in automotive radar (77 GHz), 5G mmWave infrastructure, and other advanced wireless communication systems.
Key Features
1.Exceptional Dielectric Properties
2.Thermal Stability
Thermal Decomposition Temperature (Td): > 500°C
Thermal Conductivity: 0.5 W/mK
Coefficient of Thermal Expansion (CTE):
3.Low Moisture Absorption
Moisture Absorption: 0.04%
This makes the RO3003 multilayer board highly resistant to environmental factors, ensuring long-term reliability.
Benefits of RO3003 4-Layer PCB
1.Low Dielectric Loss for High-Frequency Applications
The RO3003 PCB’s low dissipation factor ensures minimal signal loss, making it suitable for applications up to 77 GHz, such as automotive radar and 5G mmWave systems.
2.Stable Dielectric Constant Across Temperatures and Frequencies
The consistent Dk value ensures reliable performance in critical applications like bandpass filters, microstrip patch antennas, and voltage-controlled oscillators.
3.Excellent Mechanical Properties
The PCB’s uniform mechanical properties make it ideal for multi-layer board designs and hybrid constructions with epoxy glass materials.
4.Low In-Plane CTE for Enhanced Reliability
The CTE closely matches that of copper, ensuring reliable surface-mounted assemblies and excellent dimensional stability in temperature-sensitive applications.
5.Cost-Effective Volume Manufacturing
The Rogers RO3003 PCB is designed for economical production, making it a cost-effective solution for high-frequency PCB manufacturing.
PCB Stackup: 4-layer rigid PCB
Layer |
Material/Description |
Thickness |
Copper Layer 1 |
Copper |
35 μm |
Substrate Layer 1 |
Rogers RO3003 Substrate |
5 mil (0.127 mm) |
Copper Layer 2 |
Copper |
35 μm |
Prepreg Layer |
Prepreg |
4 mil (0.102 mm) |
Copper Layer 3 |
Copper |
35 μm |
Substrate Layer 2 |
Rogers RO3003 Substrate |
50 mil (1.27 mm) |
Copper Layer 4 |
Copper |
35 μm |
PCB Construction Details
Parameter |
Value |
Board Dimensions |
110.9 mm x 110.9 mm = 1 PCS |
Minimum Trace/Space |
4/5 mils |
Minimum Hole Size |
0.25 mm |
Blind Vias |
No |
Finished Board Thickness |
1.64 mm |
Finished Cu Weight |
1 oz (1.4 mils) outer layers |
Via Plating Thickness |
20 μm |
Surface Finish |
Immersion Silver |
Top Silkscreen |
No |
Bottom Silkscreen |
No |
Top Solder Mask |
No |
Bottom Solder Mask |
No |
Electrical Test |
100% tested prior to shipment |
PCB Statistic
Parameter |
Value |
Components |
37 |
Total Pads |
19300.00% |
Thru Hole Pads |
135 |
Top SMT Pads |
58 |
Bottom SMT Pads |
0 |
Vias |
79 |
Nets |
2 |
Applications
The RO3003 High Frequency PCB is versatile and suitable for a wide range of high-frequency applications, including:
- Automotive radar applications
- Global positioning satellite antennas
- Cellular telecommunications systems - power amplifiers and antennas
- Patch antenna for wireless communications
- Direct broadcast satellites
- Datalink on cable systems
- Remote meter readers
- Power backplanes
Global Availability
Available worldwide, this Rogers PCB is accessible to manufacturers and designers across the globe, ensuring seamless integration into your projects.
Conclusion
The 4-Layer RO3003 PCB is a state-of-the-art solution for high-frequency applications, combining the superior properties of Rogers RO3003 laminates with advanced manufacturing techniques. Whether you’re designing automotive radar systems, 5G infrastructure, or advanced wireless communication devices, this PCB delivers unmatched performance, reliability, and cost-effectiveness. With its global availability and compliance with industry standards, the RO3003 4-Layer PCB is the ultimate choice for your high-frequency design needs.
Upgrade your designs with the RO3003 PCB –where innovation meets reliability.
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