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Home Newly Shipped RF PCB RO3003 PCB 4-layer 1.6mm Thick Rogers 3003 Multilayer Circuit Board

RO3003 PCB 4-layer 1.6mm Thick Rogers 3003 Multilayer Circuit Board

The 4-Layer RO3003 PCB is a state-of-the-art solution for high-frequency applications, combining the superior properties of Rogers RO3003 laminates with advanced manufacturing techniques.

  • Item NO.:

    BIC-316-v392.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


RO3003 PCB 4-layer 1.6mm Thick Rogers 3003 Multilayer Circuit Board

 

In the ever-evolving world of high-frequency electronics, the demand for reliable, high-performance printed circuit boards (PCBs) is at an all-time high. The RO3003 4-Layer PCB is a cutting-edge solution designed to meet the rigorous demands of modern RF and microwave applications. Engineered with Rogers RO3003 high-frequency laminates, this multilayer PCB board is ideal for industries such as automotive radar, 5G wireless infrastructure, and advanced driver assistance systems (ADAS). With its exceptional dielectric stability, low loss, and robust mechanical properties, the RO3003 4-Layer PCB is a game-changer for high-frequency designs.

 

What is RO3003 Material?

Rogers RO3003 is a ceramic-filled PTFE (Polytetrafluoroethylene) composite specifically designed for commercial microwave and RF applications. Unlike traditional PTFE glass materials, Rogers3003 offers unparalleled stability in dielectric constant (Dk) across a wide range of temperatures and frequencies. This eliminates the step change in Dk that typically occurs near room temperature, making it a superior choice for high-frequency applications. Its unique properties make it ideal for use in automotive radar (77 GHz), 5G mmWave infrastructure, and other advanced wireless communication systems.

 

Key Features

 

1.Exceptional Dielectric Properties


  • Dielectric Constant (Dk): 3.00±0.04 at 10 GHz/23°C
  • Dissipation Factor (Df): 0.001 at 10 GHz/23°C
  • These properties ensure minimal signal loss and superior signal integrity, even at frequencies up to 77 GHz.


 

2.Thermal Stability

Thermal Decomposition Temperature (Td): > 500°C

Thermal Conductivity: 0.5 W/mK

Coefficient of Thermal Expansion (CTE):


  • X-axis: 17 ppm/°C
  • Y-axis: 16 ppm/°C
  • Z-axis: 25 ppm/°C
  • The low CTE ensures excellent dimensional stability, reducing the risk of warping or delamination during temperature fluctuations.


 

3.Low Moisture Absorption

Moisture Absorption: 0.04%

This makes the RO3003 multilayer board highly resistant to environmental factors, ensuring long-term reliability.

 

RO3003 PCB 4-layer

 

Benefits of RO3003 4-Layer PCB

 

1.Low Dielectric Loss for High-Frequency Applications

The RO3003 PCB’s low dissipation factor ensures minimal signal loss, making it suitable for applications up to 77 GHz, such as automotive radar and 5G mmWave systems.

 

2.Stable Dielectric Constant Across Temperatures and Frequencies

The consistent Dk value ensures reliable performance in critical applications like bandpass filters, microstrip patch antennas, and voltage-controlled oscillators.

 

3.Excellent Mechanical Properties

The PCB’s uniform mechanical properties make it ideal for multi-layer board designs and hybrid constructions with epoxy glass materials.

 

4.Low In-Plane CTE for Enhanced Reliability

The CTE closely matches that of copper, ensuring reliable surface-mounted assemblies and excellent dimensional stability in temperature-sensitive applications.

 

5.Cost-Effective Volume Manufacturing

The Rogers RO3003 PCB is designed for economical production, making it a cost-effective solution for high-frequency PCB manufacturing.

 

PCB Stackup:  4-layer rigid PCB

 

Layer

Material/Description

Thickness

Copper Layer 1

Copper

35 μm

Substrate Layer 1

Rogers RO3003 Substrate

5 mil (0.127 mm)

Copper Layer 2

Copper

35 μm

Prepreg Layer

Prepreg

4 mil (0.102 mm)

Copper Layer 3

Copper

35 μm

Substrate Layer 2

Rogers RO3003 Substrate

50 mil (1.27 mm)

Copper Layer 4

Copper

35 μm

  

PCB Construction Details

 

Parameter

Value

Board Dimensions

110.9 mm x 110.9 mm = 1 PCS

Minimum Trace/Space

4/5 mils

Minimum Hole Size

0.25 mm

Blind Vias

No

Finished Board Thickness

1.64 mm

Finished Cu Weight

1 oz (1.4 mils) outer layers

Via Plating Thickness

20 μm

Surface Finish

Immersion Silver

Top Silkscreen

No

Bottom Silkscreen

No

Top Solder Mask

No

Bottom Solder Mask

No

Electrical Test

100% tested prior to shipment

 

 

PCB Statistic

 

Parameter

Value

Components

37

Total Pads

19300.00%

Thru Hole Pads

135

Top SMT Pads

58

Bottom SMT Pads

0

Vias

79

Nets

2

 

Applications

The RO3003 High Frequency PCB is versatile and suitable for a wide range of high-frequency applications, including:

 

- Automotive radar applications

- Global positioning satellite antennas

- Cellular telecommunications systems - power amplifiers and antennas

- Patch antenna for wireless communications

- Direct broadcast satellites

- Datalink on cable systems

- Remote meter readers

- Power backplanes

 

Global Availability

Available worldwide, this Rogers PCB is accessible to manufacturers and designers across the globe, ensuring seamless integration into your projects.

 

Conclusion

The 4-Layer RO3003 PCB is a state-of-the-art solution for high-frequency applications, combining the superior properties of Rogers RO3003 laminates with advanced manufacturing techniques. Whether you’re designing automotive radar systems, 5G infrastructure, or advanced wireless communication devices, this PCB delivers unmatched performance, reliability, and cost-effectiveness. With its global availability and compliance with industry standards, the RO3003 4-Layer PCB is the ultimate choice for your high-frequency design needs.

 

Upgrade your designs with the RO3003 PCB –where innovation meets reliability.





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