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Home Newly Shipped RF PCB RO3003G2 High Frequency PCB Built on 10mil 0.254mm Substrates with Immersion Gold

RO3003G2 High Frequency PCB Built on 10mil 0.254mm Substrates with Immersion Gold

RO3003G2 PCB is a 2-layer rigid PCB with a stackup consisting of a 10 mil (0.254mm) thick RO3003G2 dielectric material.






  • Item NO.:

    BIC-224-v275.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


RO3003G2 High Frequency PCB Built on 10mil 0.254mm substrates with Immersion Gold

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Brief Introduction

This PCB is a 2-layer rigid PCB with a stackup consisting of a 10 mil 0.254mm thick RO3003G2 dielectric material and features a finished copper weight of 35um on both sides.

 

The RO3003G2 high frequency PCB measures 170mm x 90mm with a tolerance of +/- 0.15mm and the minimum trace width and spacing are 4 mils (0.1mm). The overall thickness of the finished board is 0.3mm. The via plating thickness is 20um, and the surface finish is immersion gold. The top silkscreen is white, while there is no silkscreen on the bottom side. The top solder mask is green, and there is no solder mask on the bottom side.

 

The 10mil RO3003G2 substrate PCB consists of 25 components and a total of 93 pads. Among these, 62 pads are dedicated to through-hole components, while 31 pads are surface-mount technology (SMT) pads located on the top side. The bottom side does not have any SMT pads. Additionally, there are 98 vias and 6 nets (connections) on the PCB. Each PCB undergoes a 100% electrical test to ensure full functionality before shipment.

 

PCB Specifications

PCB SIZE 170 x 90mm=1up
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 18um(0.5 oz)+plate TOP layer
RO3003G2 0.254mm
copper ------- 18um(0.5oz) + plate  BOT Layer
TECHNOLOGY
Minimum Trace and Space: 4 mil / 4 mil
Minimum / Maximum Holes: 0.3 mm / 1.5 mm
Number of Different Holes: 12
Number of Drill Holes: 62
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL
Ceramic-filled PTFE RO3003G2
Final foil external:  1.0 oz
Final foil internal:  N/A
Final height of PCB:  0.3 mm ±0.1
PLATING AND COATING
Surface Finish Immersion gold, 36%
Solder Mask Apply To:  Top Side
Solder Mask Color:  Green
Solder Mask Type: Photo-Sensitive-Solder Mask
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend Top Side
Colour of Component Legend White
Manufacturer Name or Logo:  N/A
VIA Plated through hole(PTH), minimum size 0.3mm.
FLAMIBILITY RATING 94 V0
DIMENSION TOLERANCE
Outline dimension:   0.0059"
Board plating: 0.0029"
Drill tolerance:  0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

10mil RO3003G2 PCB

 

TypicalApplications

1. Adaptive cruise control

2. Forward collision warning

3. Active brake assist

4. Lane change assist

5. Traffic jam pilot

6. Parking pilot

7. Blind spot detection

 

Available RFPCB Material

RO4350B, RO4003C, RO4725JXR, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO4830, RO4835, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/duroid 6006, RT/Duroid 6010.2LM, RT/duroid 6035HTC; RT/duroid 5880LZ, RT/duroid 6202; TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Kappa 438; AD250C, AD255C, AD300D, AD350A, AD450, AD600, AD1000, TC350; TC600; DiClad 880, DiClad 870, DiClad 527; IsoClad 917, IsoClad 933; CLTE-XT, CLTE-AT, CLTE-MW;  CuClad 217, CuClad 233, CuClad 250.    

TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2,RF-30, RF-35, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5, TLY-5Z; CER-10; TSM-DS3

F4BM217, F4BM220, F4BM233, F4BM245, F4BM255, F4BM265, F4BM275, F4BM294, F4BM300;

F4BME217, F4BME220, F4BME233, F4BME245, F4BME255, F4BME265, F4BME275, F4BME294, F4BME300;

F4BTM298, F4BTM300, F4BTM320, F4BTM350;

F4BTME298, F4BTME300, F4BTME320, F4BTME350;

TP300, TP440, TP600, TP615, TP960, TP1020, TP1100, TP1600, TP2000, TP2200, TP2500;

TF300, TF440, TF600, TF960, TF1020, TF1600;

F4BTMS220, F4BTMS233, F4BTMS255, F4BTMS265, F4BTMS294, F4BTMS300, F4BTMS350, F4BTMS430, F4BTMS450, F4BTMS615, F4BTMS1000;

TFA294, TFA300, TFA615, TFA1020;

WL-CT300, WL-CT330, WL-CT330Z, WL-CT338, WL-CT350, WL-CT440, WL-CT615.                                                                         

Dielectric constant ranges DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2

 

Our PCBS ervices

PCB prototypes

Mass volume production

Single sided PCB

Double sided PCB

Multilayer PCB up to 32 layers

Heavycopper PCB

Hybrid PCB

Impedancecontrolled PCB

Via in pad PCB

Ball grid array (BGA) PCB

Blind via PCB

Resin-filled via

Copper-filled via

Edge plated boards

Countersink holes, half hole, press-fit hole

Quick turn-around (QTA) Delivery

No Minimum Order Quantity (MOQ)

Door to Door shipment service

 

CAPABILITY

2500-3000types each month.

 

SERVICE AREA

North America, Oceania, Southeast Asia, Eastern Europe, Africa, Latin America, Western & Southern Europe, Northern Europe, Central & South Asian, Middle East.

 


 University Collaboration




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