
Call Us Now !
Tel : +86 755 27374946
Order Online Now !
Email : info@bichengpcb.com
The development of RO3003G2 laminates is based on industry feedback, with a special focus on addressing the next generation needs for millimeter wave automotive radar applications.
Item NO.:
BIC-223-v274.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
RO3003G2 High Frequency PCB
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Material Introduction
The high-frequency, ceramic-filled PTFE laminates of Rogers RO3003G2 are an extension of Rogers' industry-leading RO3003 solutions.The development of Rogers RO3003G2 laminates is based on industry feedback, with a special focus on addressing the next generation needs for millimeter wave automotive radar applications.
The incorporation of an optimized resin and filler content, along with the utilization of Very Low Profile ED copper provides a reduced insertion loss. This characteristic makes RO3003G2 substrates well-suited for implementation in Advanced Driver Assistance Systems (ADAS) such as adaptive cruise control, forward collision warning, active braking, and lane change assist.
Features
1. The dielectric constant of 3.00 at 10 GHz and 3.07 at 77 GHz.
2. Very Low Profile (VLP) ED copper.
3. Homogeneous construction incorporating VLP ED copper and reduced dielectric porosity.
4. Enhanced filler system.
Benefits
1. Best-in-class performance for insertion loss.
2. Minimize variation in dielectric constant in the finished PCB.
3. Enable the trend towards using smaller diameter vias; Enhanced filler system using small rounded particles
4. Global manufacturing footprint.
Our PCB Capability (RO3003G2 laminates)
PCB Capability (RO3003G2) | |
PCB Material: | Ceramic-filled PTFE Laminates |
Designation: | RO3003G2 |
Dielectric constant: | 3 |
Dissipation factor | 0.0011 |
Layer count: | Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB |
Copper weight: | 1oz (35µm), 2oz (70µm) |
Dielectric thickness | 5mil (0.127mm), 10mil (0.254mm) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold etc.. |
Typical Applications
1. Adaptive cruise control
2. Forward collision warning
3. Active brake assist
4. Lane change assist
5. Traffic jam pilot
6. Parking pilot
7. Blind spot detection
RO3003G2’s Data Sheet
PROPERTY | RO3003G2 | Direction | Unit | condition | Test Method |
Dielectric Constant, er Process | 3.00 ± 0.04 | Z | - | 10 GHz 23°C |
IPC-TM-650 2.5.5.5 Clamped Stripline |
Dielectric Constant, er Design | 3.07 | Z | - | 77 GHZ |
Differential Phase Length Method |
Dissipation Factor, tan d | 0.0011 | Z | - | 10 GHz 23°C |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of er | -35 | Z | ppm/°C |
10 GHz -50 to 150°C |
IPC-TM-650 2.5.5.5 |
Dimensional Stability |
-0.16 -0.14 |
X Y |
mm/m | Method C | IPC TM-650 2.2.4 |
Volume Resistivity | 1.4 x 10^9 | - | MΩ•cm | COND A | IPC 2.5.17.1 |
Surface Resistivity | 2.6 x 10⁸ | - | MΩ | COND A | IPC 2.5.17.1 |
Tensile Modulus |
378 396 |
X Y |
ksi | 23°C | ASTM D638 |
Moisture Absorption | 0.06 | - | % | D48/50 |
IPC-TM-650 2.6.2.1 |
Specific Heat |
0.73 0.83 |
Z | J/g/K |
0°C 50°C |
ASTM E1269-11 |
Thermal Conductivity | 0.43 | Z | W/m/K | 50°C | ASTM D5470 |
Coefficient of Thermal Expansion |
16 17 18 |
X Y Z |
ppm/°C | 23°C/50% RH | IPC-TM-650 2.4.41 |
Td | 500 | - | °CTGA | - | ASTM D3850 |
Density | 2.15 | - | gm/cm3 | 23°C | ASTM D792 |
Copper Peel Strength | 12.0 | - | lb/in |
1/2 oz. EDC After Solder Float |
IPC-TM-2.4.8 |
Flammability | V-0 | - | - | - | UL 94 |
Lead Free Process Compatible | YES | - | - | - | - |
Previous:
DiClad 527 High Frequency PCB Built on 20mil 0.508mm Substrates with Double Sided Copper and Immersion GoldNext:
RO3003G2 High Frequency PCB Built on 10mil 0.254mm Substrates with Immersion GoldIf you have questions or suggestions,please leave us a message,we will reply you as soon as we can!
Categories
New Products
Wangling F4BTMS255 PCB 2-layer 60mil 1.524mm Thick F4BTMS Series Substrates Immersion Gold
Copper Coin Embedded PCB 6-Layer M6 and IT180 High Tg FR-4 Hybrid Circuit Board
Taconic TSM-DS3 PCB 2-layer 30mil 0.762mm ENIG Green Solder Mask White Silkscreen
TP600 PCB 2-Layer 5.08mm Thick ENIG DK6.0 TP Series High Frequency laminate
Rogers TMM6 PCB 2 layers 15mil 0.381mm Immersion Silver No Solder Mask Silkscreen
RT/duroid 5880 PCB 2-layer 40mil Thick Rogers 5880 Immersion Gold Custom Board
RO4350B PCB 6-layer Rogers 4350B 1.6mm ENIG Blind Via Multilayer Board
RO4003C PCB 4-layer Rogers 4003C Multi-layer ENIG Countersunk Holes and Filled Resin
© Copyright: 2025 Shenzhen Bicheng Electronics Technology Co., Ltd.. All Rights Reserved.
IPv6 network supported