RO3006 PCB 2-layer 5mil 0.127mm Rogers 3006 with Immersion Silver

RO3006 PCB 2-layer 5mil 0.127mm Rogers 3006 with Immersion Silver

Introduction

The Rogers RO3006 PCB is an exceptional circuit material, specifically designed for commercial microwave and RF applications. Developed with Rogers' RO3006 high-performance ceramic-filled PTFE composites, this PCB offers outstanding electrical and mechanical stability. It features a stable dielectric constant (Dk) over a wide range of temperatures, eliminating the typical step change observed in PTFE glass materials near room temperature.

Features

Rogers 3006 PCB presents a host of impressive features that make it an ideal choice for demanding RF and microwave applications:

2.1 Rogers RO3006 Ceramic-Filled PTFE Composites:

The RO3006 laminate is engineered with ceramic-filled PTFE composites, ensuring exceptional performance and reliability.

2.2 Consistent Dielectric Constant:

The PCB exhibits a dielectric constant of 6.15+/- 0.15 at 10 GHz/23°C, providing reliable signal integrity across a broad frequency range.

2.3 Low Dissipation Factor:

With a dissipation factor of 0.002 at 10 GHz/23°C, the RO3006 PCB minimizes energy loss, enabling high-frequency signal transmission with minimal attenuation.

2.4 High Thermal Resistance:

Designed for harsh environments, the PCB offers excellent thermal stability with a Td> 500°C, ensuring reliable operation even in extreme temperature conditions.

2.5 Efficient Heat Dissipation:

The RO3006 laminate delivers a thermal conductivity of 0.79 W/mK, effectively dissipating heat and preventing hotspots in high-power applications.

2.6 Moisture Resistance:

With a moisture absorption rate of 0.02%, the PCB demonstrates exceptional resistance to moisture-induced performance degradation.

2.7 Stable Coefficient of Thermal Expansion:

The RO3006 PCB maintains its dimensional stability with a coefficient of thermal expansion matching that of copper, reducing the risk of failure due to temperature changes.

Benefits

The RO3006 5mil Rogers substrate PCB offers a range of benefits that set it apart from other circuit materials:

3.1 Versatile Mechanical Properties:

The uniform mechanical properties of the RO3006 PCB make it suitable for multi-layer board designs with various dielectric constants. It can also be integrated with epoxy glass hybrid designs, expanding its versatility.

3.2 Enhanced Reliability:

The low in-plane expansion coefficient provides reliable surface-mounted assemblies, making it an ideal choice for applications sensitive to temperature changes. The PCB ensures excellent dimensional stability, further enhancing its long-term reliability.

3.3 Economical Manufacturing:

The RO3006 PCB is manufactured using a volume manufacturing process, resulting in an economically priced laminate without compromising quality or performance.

PCB Specifications

The RO3006 high frequency circuit board is a 2 layer pcb board with the following construction details:

Product Statistics

The RO3006 Rogers PCB board exhibits the following statistics:

Artwork and Standards

The RO3006 PCB is supplied in Gerber RS-274-X format, complying with the IPC-Class-2 standards.

Applications

The RO3006 PCB finds wide-ranging applications in the following areas:

Automotive Radar Applications

Global Positioning Satellite Antennas

Cellular Telecommunications Systems

Patch Antennas for Wireless Communications

Direct Broadcast Satellites

Datalink on Cable Systems

Remote Meter Readers

Power Backplanes

Availability

The RO3006 RogersPCB is available worldwide, catering to the needs of customers across different regions.

Conclusion

In conclusion, the RO3006 high frequency PCBs tands as a highly advanced and reliable circuit material for RF and microwave applications. With its exceptional electrical stability, mechanical properties, and manufacturing process, it is poised to deliver outstanding performance and reliability in a wide range of demanding applications. Embrace the cutting-edge technology of RO3006 PCB for your next project and experience the power of advanced engineering