RO3010 PCB 2-layer 25mil 0.635mm Substrate Rogers 3010 ENIG No Solder Mask Black Silkscreen

RO3010 PCB 2-layer 25mil 0.635mm Substrate Rogers 3010 ENIG No Solder Mask Black Silkscreen

Introducingthe 2-Layer RO3010 PCB—an engineered solution that merges Rogers’advanced ceramic-filled PTFE composite material with precision manufacturing to deliver exceptional electrical stability, mechanical reliability, and cost-effectiveness for high-frequency and wireless applications. With a 0.635mm 25mil RO3010 substrate (finished board thickness 0.8mm), Electroless Nickel Immersion Gold (ENIG) surface finish, and compliance with IPC-Class-2 standards, this Rogers PCB is designed to excel in demanding scenarios from automotive radar to satellite communications. Backed by 100% electrical testing before shipment, it balances performance and affordability, making it ideal for both prototype and volume production.

PCB Construction Details

Below is a comprehensive breakdown of the Rogers 3010 PCB’s construction parameters, ensuring full transparency on manufacturing specs and quality controls:

PCB Stackup

The 2-layer rigid stackup is optimized for signal integrity and structural stability, with precisely calibrated layer thicknesses:

PCB Statistics

Key dimensional and component-related metrics for design validation and assembly planning are summarized below:

Core Material: Rogers RO3010 Advantage

Rogers RO3010 stands out as a ceramic-filled PTFE composite, offering a high dielectric constant (10.2±0.30 at 10 GHz/23°C) with exceptional stability across broad frequency ranges. This material’s low dissipation factor (0.0022 at 10 GHz/23°C) minimizes signal loss, while its ultra-low moisture absorption (0.05%) ensures reliability in harsh environments. Engineered for dimensional stability, RO3010 features a coefficient of thermal expansion (CTE) closely matched to copper (13 ppm/°C X, 11 ppm/°C Y, 16 ppm/°C Z from -55 to 288°C), reducing warpage during manufacturing and operation. With a glass transition temperature (Td) exceeding 500°C and thermal conductivity of 0.95 W/mK, it withstands extreme temperatures (-40°C to +85°C operating range) and high-power applications.

User Benefits

This PCB leverages RO3010’s strengths to deliver tangible value:

1)Superior Electrical Performance: Stable dielectric constant and low loss enable high-frequency operation, simplifying broadband component design.

2)Mechanical Durability: CTE matching to copper and high Td ensure structural integrity in thermal cycling and harsh conditions.

3)Cost-Effectiveness: Competitively priced laminates support volume manufacturing without compromising quality, backed by ISO 9001 certification.

4)Design Flexibility: Compatible with multi-layer designs (beyond this 2-layer configuration) and supports circuit miniaturization for space-constrained applications.

Typical Applications

Engineered for versatility, this RO3010 High Frequency PCB excels in critical applications including:

• Automotive radar systems (ADAS, collision avoidance)
• Global Positioning System (GPS) antennas
• Cellular telecommunications (power amplifiers, base station antennas)
• Wireless communication patch antennas
• Direct Broadcast Satellite (DBS) receivers
• Cable system datalinks
• Remote meter readers
• Power backplanes

Technical Compliance & Availability

• Artwork Format: Accepts Gerber RS-274-X (industry-standard format for seamless design integration)
• Quality Standard: IPC-Class-2 (meets rigorous requirements for commercial electronics)
• Global Availability: Shipped worldwide, with support for both small-batch and large-volume orders.

 This 2-Layer 25mil RO3010 PCB combines advanced material science, precision manufacturing, and industry compliance to deliver a reliable, high-performance solution for today’s most demanding wireless and high-frequency applications. Whether you’re developing automotive radar or satellite communication systems, its balanced blend of performance, durability, and cost-effectiveness makes it a standout choice for engineering teams worldwide.