RO3010 PCB 3-layer 2.7mm Rogers 3010 High Frequency Laminate with Immersion Tin

RO3010 PCB 3-layer 2.7mm Rogers 3010 High Frequency Laminate with Immersion Tin

Introduction to RO3010

Rogers RO3010 is a cutting-edge circuit material that combines ceramic-filled PTFE composites with exceptional stability and a higher dielectric constant. These competitively priced laminates offer outstanding mechanical and electrical properties, making them ideal for a wide range of applications across various frequencies. RO3010 is specifically designed to simplify the design of broadband components and enable circuit miniaturization.

Features

2.1 Precise Dielectric Constant:

RO3010 exhibits a dielectric constant of 10.2+/- .30 at 10 GHz and 23°C, ensuring reliable signal transmission and minimal loss.

2.2 Low Dissipation Factor:

With a dissipation factor of 0.0022 at 10 GHz and 23°C, RO3010 minimizes signal distortion and provides excellent electrical performance.

2.3 Thermal Stability:

RO3010 offers a low coefficient of thermal expansion (13 ppm/°C in the X-axis, 11 ppm/°C in the Y-axis, and 16 ppm/°C in the Z-axis), ensuring dimensional stability even under extreme temperature variations.

2.4 Wide Operating Temperature Range:

RO3010 can operate flawlessly in temperatures ranging from -40℃to +85℃, making it suitable for diverse environmental conditions.

2.5 High Thermal Conductivity:

With a thermal conductivity of 0.95 W/mK, RO3010 efficiently dissipates heat, contributing to optimal thermal management.

2.6 Minimal Moisture Absorption:

RO3010 3 layer high frequency PCB has a moisture absorption rate of only 0.05%, reducing the risk of performance degradation caused by humidity.

2.7 High-Temperature Durability:

The material exhibits a thermal decomposition temperature (Td) exceeding 500°C, ensuring its reliability under demanding conditions.

Key Benefits

3.1 Dimensional Stability:

RO3010 offers excellent dimensional stability, with its expansion coefficient matched to copper, allowing for reliable and precise circuit design.

3.2 Cost-Effective Solution:

These laminates are economically priced, making them suitable for volume manufacturing processes without compromising performance.

3.3 Compatible with Multilayer Designs:

RO3010 is highly compatible with multilayer board designs, enhancing design flexibility and enabling complex circuitry.

PCB Stackup

The RO3010 High Frequency PCB features a 3-layer rigid construction consisting of:

Top copper layer: 35μm

RO3010 Core: 50mil (1.27mm)

Second copper layer: 35μm

Prepreg layer: 0.1mm

RO3010 Core: 50mil (1.27mm)

Bottom copper layer: 35μm

PCB Construction Details

PCB Statistics

Artwork Specifications

The artwork supplied for this Rogers 3010 PCB is in Gerber RS-274-X format, ensuring compatibility with industry-standard manufacturing processes.

Quality Standard

The RO3010 2.7mm PCB adheres to the IPC-Class-2 quality standard, ensuring reliability and consistency.

Global Availability

This high frequency PCB is available worldwide, enabling customers to leverage its exceptional features and benefits regardless of their geographic location.

Applications

Automotive Radar Applications

Global Positioning Satellite Antennas

Cellular Telecommunications Systems

Patch Antenna for Wireless Communications

Direct Broadcast Satellites

Datalink on Cable Systems

Remote Meter Readers

Power Backplanes

In summary, the RO3010 3 layer PCB offers exceptional electrical properties, dimensional stability, and reliability for high-frequency applications. Its advanced features, cost-effectiveness, and compatibility with various designs make it a preferred choice for a wide range of industries and worldwide.