RO3035 PCB 2-layer Rogers 3035 5mil 0.127mm Thick Circuit Board Immersion Gold

RO3035 PCB 2-layer Rogers 3035 5mil 0.127mm Thick Circuit BoardImmersion Gold

Introduction

We are proud to introduce our newly shipped RO3035 PCB, a high-performance circuit board that brings cutting-edge technology and exceptional reliability to a wide range of applications. This 2-layer rigid PCB, constructed with Rogers RO3035 material, offers outstanding electrical properties, mechanical stability, and thermal performance. With its advanced features and versatile nature, the Rogers RO3035 PCB is engineered to meet the demands of the most challenging designs in the fields of 5G, millimeter wave sub 6GHz, and massive MiMo applications.

PCBconstruction details

PCB Stack-up

PCB Statistic

Features

The Rogers 3035 material used in this PCB offers a set of exceptional features that make it a top choice for high-frequency applications. Let's take a closer look at its key characteristics:

1.Dielectric Constant:

TheRO3035 material provides a stable dielectric constant of 3.5 +/- 0.05 at 10 GHz/23°C. This consistent dielectric constant ensures reliable and accurate signal propagation, making it suitable for high-frequency designs.

2.Dissipation Factor:

The PCB exhibits a low dissipation factor of 0.0015 at 10 GHz/23°C. This low loss tangent allows for efficient energy transfer and minimizes signal loss, enabling high-performance applications.

3.Temperature Resistance:

With a Td (Decomposition Temperature) of over 500°C, the RO3035 PCB excels in high-temperature environments, ensuring the reliability and longevity of the board under demanding conditions.

4.Thermal Conductivity:

The PCB material has a thermal conductivity of 0.5 W/mK, enabling efficient heat dissipation. This feature is essential for power amplifiers and applications that deal with heat-sensitive components.

5.Moisture Absorption:

The RO3035 material has a low moisture absorption rate of 0.04%, guaranteeing the stability of its electrical and mechanical properties in humid conditions.

6.Coefficient of Thermal Expansion:

The PCB has a low coefficient of thermal expansion, ensuring excellent dimensional stability across a wide temperature range (-55 to 288°C). This characteristic minimizes the potential for failures caused by thermal stress and enhances the reliability of the board.

Benefits

The RO3035 5mil PCB offers numerous benefits that set it apart from conventional circuit boards. Let's explore how these advantages can be leveraged in various applications:

1.High-Frequency Performance:

The RO3035 PCB is designed to operate in frequencies up to 30-40 GHz, making it an ideal choice for demanding applications such as automotive radar, cellular telecommunications systems, and satellite communication.

2.Mechanical Stability:

The uniform mechanical properties of the RO3035 material allow for the design of multi-layer boards without compromising on warping or reliability. This characteristic makes it suitable for applications that require a range of dielectric constants, such as power amplifiers and hybrid board designs.

3.Temperature Sensitivity:

The low in-plane expansion coefficient of the RO3035 material reduces the risk of surface-mounted component failures caused by temperature changes. This property makes the PCB an excellent choice for applications sensitive to temperature variations, such as GPS antennas and wireless communications systems.

4.Volume Manufacturing:

The RO3035 PCB follows a volume manufacturing process, making it cost-effective without compromising on quality. This feature ensures that the PCB meets the demands of high-volume production while maintaining consistent performance and reliability.

Some Typical Applications

- Automotive radar applications

- Global positioning satellite antennas

- Cellular telecommunications systems - power amplifiers and antennas

- Patch antenna for wireless communications

- Direct broadcast satellites

- Datalink on cable systems

- Remote meter readers

- Power backplanes

Availability and Standards

Our RO3035 high frequency PCB is available worldwide, providing access to this advanced technology for engineers and designers across the globe. The board conforms to the IPC-Class-2 standard, ensuring high-quality manufacturing and meeting the industry's requirements for reliable performance.

Conclusion

The RO3035 substrate PCB offers exceptional high-frequency performance, mechanical stability, and thermal reliability, making it the perfect choice for advanced applications in 5G, millimeter wave sub 6GHz, and massive MiMo technologies. With its outstanding dielectric properties, temperature resistance, and volume manufacturing capability, our RO3035 PCB empowers engineers to create cutting-edge designs in automotive, telecommunications, aerospace, and other industries. Experience the nextlevel of PCB technology with our RO3035 PCB and unlock the full potential of your high-frequency applications.