RO3006 2-layer Rogers 3006 PCB 25mil 0.635mm Substrate with ENIG

RO3006 2-layer Rogers 3006 PCB 25mil 0.635mm Substrate with ENIG

Product Overview

The RO3006 2-layer PCB represents a premium solution for high-frequency applications requiring exceptional electrical stability and thermal performance. Manufactured using Rogers Corporation's advanced RO3006 ceramic-filled PTFE composite material, this Rogers 3006 circuit board delivers superior performance in demanding RF and microwave environments. With its carefully engineered construction and precise manufacturing tolerances, this RO3006 PCB is ideally suited for next-generation wireless communications, automotive radar systems, and aerospace applications where signal integrity and reliability are paramount.

PCB Construction Details

PCB Stackup

PCB Statistic

Features:

The key features of the RO3006 PCB 25mil make it an exceptional choice for high-frequency applications:

1.Rogers RO3006 Ceramic-Filled PTFE Composites:

• Provides exceptional electrical properties and mechanical stability.
• Delivers a dielectric constant of 6.15+/- 0.15 at 10 GHz/23°C, ensuring predictable signal propagation.
• Exhibits a low dissipation factor of 0.002 at 10 GHz/23°C, minimizing signal loss.

2.High Thermal Performance:

• Withstands temperatures up to Td> 500°C, ensuring reliability in demanding operating conditions.
• Boasts a thermal conductivity of 0.79 W/mK, facilitating effective heat dissipation.

3.Excellent Dimensional Stability:

• Exhibits a low moisture absorption rate of 0.02%, maintaining consistent electrical performance.
• Features a coefficient of thermal expansion that matches copper (X axis 17 ppm/°C, Y axis 17 ppm/°C, Z axis 24 ppm/°C), resulting in reliable surface-mounted assemblies in temperature-sensitive applications.

Benefits:

The Rogers RO3006 PCB 25mil offers several advantages for high-frequency circuit designs:

1.Design Flexibility:

• Maintains uniform mechanical properties across a range of dielectric constants, making it ideal for multi-layer board designs with varying signal requirements.
• Compatible with epoxy glass multi-layer board hybrid designs, expanding its suitability for diverse applications.

2.Enhanced Reliability:

• Low in-plane expansion coefficient ensures stable performance, reducing the risk of signal degradation due to temperature fluctuations.
• Provides excellent dimensional stability, minimizing the potential for material deformation and enabling reliable soldering and assembly.

3.Cost-Effective Manufacturing:

The volume manufacturing process ensures economical laminate pricing, making the RO3006 PCB 25mil a cost-effective solution for high-frequency circuitry.

Typical Applications

The versatility and performance of the RO3006 25 mil substrate PCB make it well-suited for a wide range of high-frequency applications, including:

• Automotive radar applications
• Global positioning satellite antennas
• Cellular telecommunications systems - power amplifiers and antennas
• Patch antennas for wireless communications
• Direct broadcast satellites
• Datalink on cable systems
• Remote meter readers
• Power backplanes

Accepted Standard and Availability

The RO3006 high frequency PCB conforms to the IPC-Class-2 standard, ensuring high quality and reliability. Additionally, this PCB is available for purchase worldwide, allowing customers from different regions to benefit from its advanced features and performance.

Conclusion

In conclusion, the RO3006 PCB 25mil is an advanced circuit solution tailored for high-frequency applications. With its exceptional electrical properties, mechanical stability, and cost-effective manufacturing, thisRogersPCBmaterialenables the development of reliable and high-performance electronic systems across various industries.