RO3206 50 mil Rogers laminate High Frequency PCB with Immersion Gold
Overview
RO3206 high frequency circuits are laminates with ceramic fillers and woven fiberglass reinforcement. These materials are designed to provide excellent electrical performance and mechanical stability at competitive prices. The key feature of RO3206 high frequency materials is their enhanced mechanical stability.
RO3206 Rogers laminates combine the smoothness of a non-woven PTFE laminate, allowing for more precise line etching, with the rigidity of a woven-glass PTFE laminate. Standard PTFE circuit board processing techniques can be used to fabricate printed circuit boards from these materials.
RO3206 laminates are produced under an ISO 9002 certified quality system. Let's examine its properties in more detail.
RO3206 Typical Characteristics
The dielectric constant of this material is a significant property. At a frequency of 10 GHz and a temperature of 23°C, the process dielectric constant in the Z direction is 6.15 ± 0.15, as measured by the IPC-TM-650 2.5.5.5 Clamped Stripline test method. For design purposes between 8 GHz and 40 GHz, the dielectric constant in the Z direction is 6.6 and is measured using the Differential Phase Length Method.
The more typical properties as follow:
|
Property
|
RO3206
|
Direction
|
Unit
|
Condtion
|
Test Method
|
|
Dielectric Constant, εr Process
|
6.15± 0.15
|
Z
|
-
|
10 GHz 23°C
|
IPC-TM-650 2.5.5.5 Clamped Stripline
|
|
Dielectric Constant, εr Design
|
6.6
|
Z
|
-
|
8 GHz - 40 GHz
|
Differential Phase Length Method
|
|
Dissipation Factor, tan δ
|
0.0027
|
Z
|
-
|
10 GHz 23°C
|
IPC-TM-650 2.5.5.5
|
|
Thermal Coefficient of εr
|
-212
|
Z
|
ppm/°C
|
10 GHz 0-100°C
|
IPC-TM-650 2.5.5.5
|
|
Dimensional Stability
|
0.8
|
X,Y
|
mm/m
|
COND A
|
ASTM D257
|
|
Volume Resistivity
|
10^3
|
|
MΩ•cm
|
COND A
|
IPC 2.5.17.1
|
|
Surface Resistivity
|
10^3
|
|
MΩ
|
COND A
|
IPC 2.5.17.1
|
|
Tensile Modulus
|
462
462
|
MD
CMD
|
kpsi
|
23°C
|
ASTM D638
|
|
Water Absorption
|
<0.1
|
-
|
%
|
D24/23
|
IPC-TM-650
2.6.2.1
|
|
Specific Heat
|
0.85
|
|
J/g/K
|
|
Calculated
|
|
Thermal Conductivity
|
0.67
|
-
|
W/m/K
|
80°C
|
ASTM C518
|
|
Coefficient of Thermal Expansion (-55 to 288 °C)
|
13
34
|
X,Y,
Z
|
ppm/°C
|
23°C/50% RH
|
IPC-TM-650 2.4.41
|
|
Td
|
500
|
|
°C
|
TGA
|
ASTM D3850
|
|
Color
|
Tan
|
|
|
|
|
|
Density
|
2.7
|
|
gm/cm3
|
|
|
|
Copper Peel Strength
|
10.7
|
|
pli
|
1 oz. EDC After Solder Float
|
IPC-TM-2.4.8
|
|
Flammability
|
V-0
|
|
|
|
UL 94
|
|
Lead Free Process
Compatible
|
YES
|
|
|
|
|
RO3206 PCB Capability
|
PCB Material:
|
Ceramic-filled Laminates Reinforced with Woven Fiberglass
|
|
Designation:
|
RO3206
|
|
Dielectric constant:
|
6.15
|
|
Dissipation factor
|
0.0027
|
|
Layer count:
|
Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB
|
|
Copper weight:
|
1oz (35µm), 2oz (70µm)
|
|
Dielectric thickness
|
25mil (0.635mm), 50mil (1.27mm)
|
|
PCB size:
|
≤400mm X 500mm
|
|
Solder mask:
|
Green, Black, Blue, Yellow, Red etc.
|
|
Surface finish:
|
Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold plated etc..
|
An example of a RO3206 PCB
The display features a 50mil RO3206 PCB with immersion gold, expertly crafted for microstrip patch antennas.
RO3206 50mil substrate PCBs have a wide range of applications, including automotive collision avoidance systems, automotive global positioning satellite antennas, wireless telecommunications systems, direct broadcast satellites, datalink on cable systems, remote meter readers, power backplanes, LMDS and wireless broadband, and base station infrastructure, among others.
Conclusion
Rogers 3206 materials can be used with traditional electroless copper and direct deposit metallization processes. Cores should be baked (30-90 minutes @ 110°C-125°C) before metal deposition, unless hole walls have been prepared for plating using plasma treatment.
Standard equipment and chemical processes are utilized to plate, image, and etch circuit patterns onto Rogers 32006 high frequency materials. It is essential to handle these processes carefully to preserve the integrity of the post-etch laminate surface. The remaining topography after copper removal promotes improved adhesion to solder masks.
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