RO4003C LoPro PCB 2-Layer 20.7mil 0.526mm Silver Underplating + Gold Plating Custom Board

RO4003C LoPro PCB 2-Layer 20.7mil 0.526mm Silver Underplating + Gold Plating Custom Board

Introducing the RO4003C LoPro 2-Layer 20.7mil PCB—an advanced engineered solution that merges Rogers’industry-leading laminate technology with precision manufacturing to deliver exceptional signal integrity, thermal resilience, and cost efficiency. Designed for high-frequency and mission-critical applications, this Rogers RO4003C LoPro PCB leverages proprietary low-profile material science to outperform standard alternatives while maintaining compatibility with mainstream fabrication processes, making it a strategic choice for technical teams and procurement professionals alike.

PCB Construction Details

Below is a comprehensive breakdown of the RO4003C LoPro PCB’s construction parameters, ensuring full transparency on manufacturing standards and performance-critical specifications:

PCB Stackup

The 2-layer rigid stackup is optimized for signal transmission and structural stability, leveraging the unique properties of Rogers RO4003C LoPro substrate:

PCB Statistics

The following metrics reflect the Rogers 4003C LoPro PCB’s layout efficiency and compatibility with compact, high-performance assemblies:

Core Material Advantage: RO4003C LoPro Laminate

At the heart of this PCB is Rogers’ proprietary RO4003C LoPro laminate, which uses reverse treated foil bonded to standard RO4003C dielectric. This innovation delivers ultra-low conductor loss—enhancing insertion loss and signal integrity—while preserving the laminate’s superior high-frequency performance and cost-effectiveness. Critically, it is fully compatible with standard epoxy/glass (FR-4) fabrication processes, eliminating the need for specialized via preparation (e.g., sodium etch) and reducing manufacturing costs without sacrificing quality.

Key Technical Features

• Dielectric constant: 3.38±0.05 (10 GHz/23°C) for consistent signal propagation
• Dissipation factor: 0.0027 (10 GHz/23°C) for minimal energy loss
• High thermal stability: Tg >280°C (TMA), Td >425°C for extreme processing
• Thermal conductivity: 0.64 W/mK for improved heat dissipation
• Low Z-axis CTE: 46 ppm/°C to prevent thermal stress
• Copper-matched CTE (-55 to 288°C): X-axis 11 ppm/°C, Y-axis 14 ppm/°C
• Lead-free process compatible, meeting global environmental standards

Unmatched Benefits

This 2-Layer RO4003C LoPro PCB translates technical excellence into tangible value: lower insertion loss enables operating frequencies exceeding 40 GHz; reduced passive inter-modulation (PIM) optimizes base station antenna performance; improved thermal efficiency minimizes overheating risks; and multilayer capability (when scaled) offers design flexibility. It is CAF resistant, supports high-temperature processing, and addresses environmental concerns—all while reducing manufacturing costs through FR-4 process compatibility.

Typical Applications

• Digital infrastructure: Servers, routers, high-speed backplanes
• Cellular networks: Base station antennas and power amplifiers
• Satellite communication: LNBs for direct broadcast satellites
• RF identification: RFID tags

Quality & Availability

Manufactured to IPC-Class-2 standards, each PCB undergoes 100% electrical testing to ensure reliability. We accept Gerber RS-274-X artwork for seamless design integration, and the product is available for worldwide shipping—ensuring timely access for global projects.

Whether you’re designing high-speed digital systems, critical RF components, or satellite communication devices, the RO4003C LoProhigh frequency PCB delivers the performance, durability, and cost efficiency your projects demand. Backed by Rogers’proven material technology and rigorous quality control, this Rogers PCB is engineered to elevate your designs to new heights.

For customized quotes, technical support, or volume ordering inquiries, please reach out to our sales team—we’re ready to help you integrate this high-performance solution into your next project.