RO4350B LoPro Low Profile PCB 2-Layer 60.7mil 1.542mm Rogers Substrate ENEPIG Custom Board

RO4350B LoPro Low Profile PCB 2-Layer 60.7mil 1.542mm Rogers Substrate ENEPIG Custom Board  

Designed for high-speed digital and RF applications demanding exceptional signal integrity and thermal stability, the RO4350B LoPro 2-Layer 60.7mil PCB stands as a flagship solution for industries ranging from 5G infrastructure to satellite communications. Leveraging Rogers’proprietary low-profile laminate technology, this RO4350B Low Profile PCB merges ultra-low insertion loss, robust mechanical performance, and cost-effective fabrication—all while adhering to global quality standards. Below is a comprehensive breakdown of its specifications, capabilities, and value propositions.

PCB Construction

The Rogers ENEPIG PCB’s construction is engineered for precision and consistency, with key parameters optimized for high-frequency operation and manufacturing compatibility.

PCB Stackup

The 2-layer stackup is meticulously designed to balance impedance control, heat dissipation, and structural rigidity, critical for high-frequency applications.

PCB Statistics

The RO4350B LoPro high frequency PCB’s layout optimizes component integration and signal routing, ensuring minimal interference and maximum functionality within a compact form factor.

RO4350B LoPro Laminate

At its core, the PCB utilizes Rogers RO4350B LoPro laminates—crafted with proprietary reverse-treated foil technology that bonds seamlessly to standard RO4350B dielectric. This innovation delivers ultra-low conductor loss, enhancing insertion loss and signal integrity while retaining the laminate’s signature high-frequency performance and cost efficiency. Unlike specialized materials, it compatible with standard FR-4 fabrication processes, eliminating the need for sodium etch or custom via preparation—slashing manufacturing costs without compromising quality.

Key Features

• Dielectric constant (10 GHz/23°C): 3.48±0.05 (stable across frequency ranges)
• Dissipation factor (10 GHz/23°C): 0.0037 (ultra-low loss for high-speed signals)
• Thermal stability: Tg >280°C (TMA), Td >390°C (supports high-temperature processing)
• Thermal conductivity: 0.69 W/mK (superior heat dissipation)
• CTE matching: X-axis 10 ppm/°C, Y-axis 12 ppm/°C, Z-axis 32 ppm/°C (-55 to 288°C) for copper compatibility
• Flammability rating: UL 94-V0 (enhanced safety)
• Lead-free compatible (meets global environmental regulations)

Benefits for Your Applications

1) High-frequency capability: Supports operations beyond 40 GHz, ideal for next-gen communications

2) Reduced PIM: Minimizes passive inter-modulation, critical for base station antennas

3) Enhanced thermal performance: Lower conductor loss translates to better heat management

4) Design flexibility: Compatible with multilayer configurations and standard fabrication workflows

5) CAF resistance: Mitigates conductive anodic filament formation for long-term reliability

6) Environmental compliance: Aligns with lead-free and RoHS requirements

Typical Applications

This RO4350B LoPro PCB excels in diverse high-demand scenarios, including:

• Digital infrastructure: Servers, routers, high-speed backplanes
• Cellular communications: 5G base station antennas, power amplifiers
• Satellite technology: Direct broadcast satellite LNBs
• RFID systems: High-performance identification tags

Quality & Availability Assurance

• Artwork format: Gerber RS-274-X (industry-standard compatibility)
• Quality standard: IPC-Class-2 (meets rigorous performance and reliability requirements)
• Global availability: Shipped worldwide to support your regional production needs

Whether you’re designing next-gen 5G hardware, high-speed digital systems, or satellite communications equipment, the RO4350B LoPro 60.7mil PCB delivers the perfect balance of performance, cost, and reliability. Its advanced material science, optimized structure, and global support make it the preferred choice for engineering teams pushing the boundaries of technology.

For custom modifications, volume pricing, or technical support tailored to your application, contact our sales team today—we’re ready to help you accelerate your product’s success.