RO4003C Multilayer PCB 4-Layer 4.8mm Thick Rogers 4003C High Frequency Laminates

RO4003C Multilayer PCB 4-Layer 4.8mm Thick Rogers 4003C High Frequency Laminates

Introduction

The RO4003C Multilayer PCB is a groundbreaking circuit board that combines the electrical performance of PTFE/woven glass with the manufacturability of epoxy/glass. Developed by Rogers Corporation, a leading name in advanced materials for high-frequency electronic applications, the RO4003C material offers exceptional performance at competitive prices. It has been specifically designed to meet the demands of RF microwave circuits, matching networks, and controlled impedance transmission lines.

The RO4003C Advantage

The Rogers RO4003C High Frequency PCB material exhibits low dielectric loss, making it an excellent choice for applications with higher operating frequencies where conventional laminates fall short. Featuring a proprietary woven glass reinforced hydrocarbon/ceramic composition, Rogers RO4003C provides an unmatched combination of dielectric properties and manufacturing ease. This enables designers to achieve superior high-frequency performance while benefiting from the cost-efficiency of standard epoxy/glass processes.

Features of RO4003C

RO4003C substrate possesses several key features that ensure excellent performance in high-frequency applications:

1.Dielectric Constant:

The dielectric constant of RO4003C is precisely controlled at 3.38 +/-0.05 at 10GHz, ensuring stable electrical characteristics.

2.Dissipation Factor:

With a low dissipation factor of 0.0027 at 10GHz, RO4003C minimizes energy loss, ensuring efficient signal propagation.

3.Thermal Conductivity:

RO4003C exhibits a thermal conductivity of 0.71 W/m/°K, dissipating heat effectively and maintaining circuit reliability.

4.Thermal Coefficient of Dielectric Constant:

The thermal coefficient of dielectric constant ranges from -50°C to 150°C, with a value of +40 ppm/°C. This feature ensures consistent electrical performance over a wide temperature range.

5.CTE Matched to Copper:

RO4003C has a CTE (Coefficient of Thermal Expansion) matched to copper, ensuring dimensional stability and reliability in harsh thermal environments. The X-axis CTE is 11ppm/°C, while the Y-axis is 14ppm/°C.

6.Low Z-Axis Coefficient of Thermal Expansion:

The low Z-axis coefficient of thermal expansion, measured at 46 ppm/°C, reduces stress on the board and increases its longevity.

7.High Glass Transition Temperature (Tg):

RO4003C exhibits excellent stability under high-temperature conditions, with a Tg of over 280°C.

8.Low Moisture Absorption:

With a moisture absorption rate of only 0.06%, RO4003C minimizes the negative effects of humidity on the PCB's electrical performance.

PCB Stackup and Specifications

The RO4003C PCB is designed as a 4-layer Multilayer PCB with the following stackup:

Specifications:

PCB Statistics

Availability 

The RO4003C High Frequency PCB is available worldwide, making it accessible to customers across the globe.

Typical Applications

Its exceptional performance and competitive pricing make it an attractive choice for a wide range of high-frequency applications, including:

- Commercial Airline Broadband Antennas

- Microstrip and Stripline Circuits

- Millimeter Wave Applications

- Radar Systems

- Guidance Systems

- Point to Point Digital Radio Antennas

Conclusion

In conclusion, the RO4003C multilayer circuit boards combines superior electrical performance with low-cost circuit fabrication. With its exceptional dielectric properties, thermal stability, and controlled impedance characteristics, it is the ideal choice for high-frequency applications where performance and reliability are critical. Whether it's commercial avionics, advanced radar systems, or next-generation wireless communications, the Rogers 4003C PCB offers the reliability and performance needed to drive innovation in the modern electronics industry.