RO4360G2 PCB 2-Layer 32mil 0.813mm Rogers 4360G2 Immersion Gold Custom High Frequency Board

RO4360G2 PCB 2-Layer 32mil 0.813mm Rogers 4360G2 Immersion Gold Custom High Frequency Board

Designed for demanding base station and small cell applications, the RO4360G2 2-Layer 32 mil PCB delivers an unbeatable balance of low loss, mechanical reliability, and cost-effectiveness. Leveraging Rogers’ industry-leading RO4360G2 laminate—an innovative thermoset material that combines FR-4-like processability with high dielectric performance—this Rogers PCB is optimized for high-frequency signal integrity, making it the ideal choice for power amplifiers and transceivers where precision and durability are non-negotiable. Below is a comprehensive breakdown of its specifications, advantages, and applications.

PCB Construction Details

The RO4360G2 PCB’s construction is precision-engineered to meet IPC-Class-2 quality standards, ensuring consistent performance and manufacturability across global production:

PCB Stackup

The symmetric 2-layer rigid stackup is tailored for thermal stability and signal consistency, featuring uniform copper layers and Rogers’ high-performance substrate:

PCB Statistics

Component and interconnect metrics reflect a streamlined design optimized for high-frequency telecom applications:

Material & Performance Advantages

At the heart of this PCB is Rogers RO4360G2—a glass-reinforced, hydrocarbon ceramic-filled thermoset laminate that redefines high-Dk performance. Unlike traditional high-performance materials, Rogers 4360G2 can be processed using standard FR-4 manufacturing workflows, eliminating the need for specialized equipment and reducing fabrication costs. It is lead-free compatible (94V-0 flammable rating) and pairs seamlessly with RO440 series prepregs or lower-Dk RO4000 laminates, offering exceptional design flexibility for multi-layer extensions.

Key Technical Features

• Dielectric Consistency: Dk of 6.15±0.15 at 10 GHz/23°C ensures stable signal propagation
• Low Loss: Dissipation factor of 0.0038 (10 GHz/23°C) minimizes signal attenuation in high-frequency circuits
• Thermal Durability: Tg >280°C (TMA) and Td >407°C support harsh operating environments
• Thermal Conductivity: 0.75 W/mK enhances heat dissipation for power-dense applications
• CTE Matching: Copper-aligned thermal expansion (X:13 ppm/°C, Y:14 ppm/°C) reduces thermal stress and improves via reliability
• Z-Axis Stability: 28 ppm/°C CTE ensures structural integrity during thermal cycling (-55 to 288°C)

Customer-Centric Benefits

Design Flexibility: FR-4 processability and compatibility with standard prepregs enable rapid prototyping and customizations

Reliability: Plated through-hole (PTH) integrity and thermal stability ensure long service life in base stations

Manufacturing Efficiency: Automated assembly compatibility and lead-free compliance streamline production

Cost-Effectiveness: Efficient supply chains and short lead times reduce total ownership costs

Environmental Compliance: Lead-free process aligns with global sustainability standards

Target Applications

This RO4360G2 high frequency PCB is purpose-built for telecom infrastructure where high-frequency performance and reliability are critical:

- Base Station Power Amplifiers

- Small Cell Transceivers

Quality & Availability

Manufactured to IPC-Class-2 standards and validated via 100% electrical testing prior to shipment, this 32 mil Rogers substrate PCB ensures zero-defect performance. Gerber RS-274-X artwork compatibility simplifies integration into existing production workflows. With worldwide availability and a responsive supply chain, we deliver short lead times to meet your project timelines—whether for prototyping or high-volume production.

For telecom engineers and procurement teams seeking a high-performance, cost-effective PCB solution, the RO4360G2 custom PCB combines Rogers’ industry-leading material technology with precision manufacturing to exceed your most demanding requirements.