RO4730G3 PCB 2-layer 20mil 0.508mm ENIG Green Solder Mask White Silkscreen

RO4730G3 PCB 2-layer 20mil 0.508mm ENIG Green Solder Mask White Silkscreen

Designed for precision and reliability in high-frequency applications, our RO4730G3 2-layer PCB stands as a game-changer for cellular base station antennas and beyond. Crafted with Rogers’advancedRO4730G3 laminate, this custom Rogers PCB balances exceptional electrical performance with cost efficiency, making it a superior alternative to traditional PTFE-based materials. Whether for demanding antenna designs or high-frequency circuits, it delivers consistent performance across temperature variations and rigorous operational conditions.

PCB Construction Details

The following table outlines the core physical and manufacturing specifications, ensuring clarity on material selection, dimensional accuracy etc.

PCB Stackup

The stackup design is optimized to maximize signal integrity and thermal stability, leveraging the unique properties of Rogers RO4730G3.

PCB Statistics

These metrics reflect the RO4730G3 High Frequency PCB Materials’ design complexity and suitability for compact, high-performance assemblies.

Material Excellence: Rogers RO4730G3

At the heart of this PCB is Rogers 4730G3, a UL 94 V-0 rated laminate engineered for antenna applications. Unlike PTFE-based materials, it eliminates the need for special processing in plated through-hole (PTH) preparation, while remaining fully compatible with conventional FR-4 and lead-free solder workflows. This makes it a cost-effective choice without compromising performance.

Key Features & Performance Advantages

1) Electrical Stability: With a dielectric constant (Dk) of 3.0±0.05 at 10GHz and a dissipation factor of 0.0028, it minimizes signal loss, critical for high-frequency antenna operations.

2) Thermal Resilience:A glass transition temperature (Tg) >280°C and decomposition temperature (Td) of 411°C ensure stability under extreme heat, while a low thermal coefficient of Dk (34 ppm/°C) guarantees consistent performance across temperature fluctuations.

3) Mechanical Reliability:CTE values (15.9/14.4/35.2 ppm/°C in x/y/z axes) are matched to copper, reducing warpage risk. Its low Z-axis CTE (<30ppm/°C) enhances PTH durability.

4) Lightweight Design:Thanks to unique fillers and closed microspheres, it is 30% lighter than PTFE/glass laminates, easing integration in weight-sensitive applications.

5) Eco-Friendly:RoHS compliant and compatible with lead-free processes, aligning with global environmental standards.

Quality & Availability

Manufactured to IPC-Class-2 standards, this 20mil RO4730G3 PCB undergoes 100% electrical testing to ensure defect-free performance. Artwork is supplied in Gerber RS-274-X format for seamless design integration. Available worldwide, it meets the demands of global supply chains.

Typical Application

Perfectly suited for cellular base station antennas, where low insertion loss, reduced passive intermodulation (PIM), and consistent performance under varying conditions are paramount. Its combination of low loss, cost efficiency, and ease of fabrication makes it an ideal choice for modern antenna systems.

Elevate your high-frequency designs with a PCB that delivers where it matters most: performance, reliability, and value.