RO4350B PCB 3-layer 1.7mm RO4450F Bondply Material Multilayer Laminates ENIG Surface Finish

RO4350B PCB 3-layer 1.7mm RO4450F Bondply Material Multilayer Laminates ENIG Surface Finish

Introduction:

The Rogers RO4350B PCB, featuring Rogers' renowned RO4350B and RO4450F bondply materials, stands as a testament to cutting-edge engineering and high-performance functionality. This wholesale multilayer PCB is a marvel of modern technology, offering exceptional dielectric control and low loss characteristics that are crucial for demanding applications in industries such as telecommunications, automotive, and aerospace.

RO4350B Material Overview:

The RO4350B high frequency laminates are a proprietary blend of woven glass reinforced hydrocarbon/ceramics, delivering electrical performance comparable to PTFE/woven glass at a fraction of the cost. These laminates boast a tight control on dielectric constant (Dk) and maintain low loss while being processed using standard epoxy/glass methods. With a UL 94 V-0 rating, they are ideal for active devices and high-power RF designs.

One of the standout features of the 30mil RO4350B material is its thermal coefficient of expansion (CTE), which closely matches that of copper. This characteristic ensures excellent dimensional stability, making it perfect for mixed dielectric multi-layer board constructions. The material's low Z-axis CTE guarantees reliable plated through-hole quality, even under extreme thermal shock conditions, thanks to its high glass transition temperature (Tg) of over 280°C.

RO4450F Bondply:

Complementing the RO4350B Rogers PCB material is the RO4450F bondply, which offers compatibility with RO4000 series core materials. This bondply is designed for multi-layer constructions, excelling in sequential laminations due to its high postcure Tg. The lateral flow capability of the RO4450F bondply has shown significant improvements, making it a preferred choice for intricate designs with challenging fill requirements.

PCB Stackup and Construction Details

This 3 layer PCB boasts a meticulous construction:

Copper Layer 1: 35μm

RO4350B Core: 0.762 mm (30mil)

Copper Layer 2: 18μm

Prepreg Bond-ply (RO4450F): 0.101mm (4mil)

RO4350B Core: 0.762 mm (30mil)

Copper Layer 2: 35μm

Specifications

PCB Statistics

Additional Information

Artwork Supplied: Gerber RS-274-X

Quality Standard: IPC-Class-2

Availability: Worldwide

Applications

Cellular Base Station Antennas and Power Amplifiers

RF Identification Tags

Automotive Radar and Sensors

LNB's for Direct Broadcast Satellites

Conclusion

In conclusion, the RO4350B 1.7mm PCB represents a pinnacle of engineering excellence, combining advanced materials and meticulous construction to deliver outstanding performance in diverse applications. With its exceptional dielectric properties, thermal stability, and reliability, this multi circuit boards PCB is poised to meet the evolving needs of modern technology and industry standards. Trust in the RO4350B high frequency PCB for your next project, and experience the difference that quality and innovation can make.