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Home Newly Shipped RF PCB Rogers RO4003C PCB 4-layer 0.7mm Thick RO4450F Bondply Multilayer ENIG High Frequency Laminates

Rogers RO4003C PCB 4-layer 0.7mm Thick RO4450F Bondply Multilayer ENIG High Frequency Laminates


RO4003C 0.7mm 4-layer PCB stands as a pinnacle of innovation in the realm of printed circuit boards, offering unmatched performance, reliability, and cost-efficiency across a spectrum of applications. 



  • Item NO.:

    BIC-266-v332.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


Rogers RO4003C PCB 4-layer 0.7mm Thick RO4450F Bondply Multilayer ENIG High Frequency Laminates

 

Introduction

Rogers 4003C PCBs represent a cutting-edge advancement in the realm of printed circuit boards. Crafted from proprietary woven glass reinforced hydrocarbon/ceramic materials, these boards offer an exceptional blend of electrical performance reminiscent of PTFE/woven glass compositions and the ease of manufacturability associated with epoxy/glass constructions.

 

Redefining industry standards,RO4003C laminates boast a versatile range of configurations, incorporating 1080 and 1674 glass fabric styles while ensuring uniform electrical performance across all setups. The hallmark of Rogers RO4003C lies in its precise control over dielectric constant (Dk) and minimal loss, achieved through a cost-effective production process akin to standard epoxy/glass laminates. Notably, unlike PTFE-based microwave materials, RO4003C eliminates the need for specialized through-hole treatments or delicate handling procedures.

 

Distinguished by their non-brominated composition and absence of UL 94 V-0 rating, RO4003C PCBs emerge as a sophisticated choice for diverse applications demanding superior performance and reliability.


RO4003C Multilayer PCB

 

Features

Dielectric Constant (DK): 3.38 +/-0.05 at 10GHz

Dissipation Factor: 0.0027 at 10GHz

Thermal Conductivity: 0.71 W/m/°K

Thermal Coefficient of Dielectric Constant: +40 ppm/°C (ranging -50°C to 150°C)

CTE Matched to Copper: X axis of 11ppm/°C, Y axis of 14ppm/°C

Low Z-axis Coefficient of Thermal Expansion: 46 ppm/°C

Tg: Greater than 280°C

Low Moisture Absorption: 0.06%

 

Benefits

The RO4003C Multilayer PCB offers a host of benefits that set it apart as a premium choice for high-performance applications:

 

1)Ideal for Multi-Layer Board (MLB) Constructions:

Ensures reliability and consistency in complex circuit designs.

 

2)Cost-Effective Processing:

Processes akin to FR-4 at a lower fabrication cost, making it a viable option for various projects.

 

3)Designed for Performance-Sensitive Applications:

Tailored for high-volume production environments where performance is critical.

 

4)Competitive Pricing:

Balances exceptional quality with affordability, making it accessible for a wide range of applications.

 

 

PCB Stackup

The 4-layer rigid PCB stackup featuring8mil RO4003C PCB and RO4450F Bondply ensures optimal performance and reliability. The detailed construction includes:

 

Layer

Material

Thickness (mm)

Thickness (mil)

Copper_layer_1

Copper

0.035

1.38

Rogers 4003C Core

RO4003C

0.203

8

Copper_layer_2

Copper

0.035

1.38

RO4450F Bondply

RO4450F Bondply

0.101

4

Copper_layer_1

Copper

0.035

1.38

Rogers 4003C Core

RO4003C

0.203

8

Copper_layer_2

Copper

0.035

1.38

 

 

PCB Construction Details

Detail

Value

Board Dimensions

112mm x 121mm = 2 Types = 2PCS, +/- 0.15mm

Minimum Trace/Space

5/6 mils

Minimum Hole Size

0.3mm

Blind Vias

No

Finished Board Thickness

0.7mm

Finished Cu Weight

1oz (1.4 mils) outer layers, 1oz (1.4 mils) inner layers

Via Plating Thickness

20 μm

Surface Finish

ENIG

Top Silkscreen

White

Bottom Silkscreen

No

Top Solder Mask

Green

Bottom Solder Mask

No

100% Electrical Test

Yes (prior to shipment)

 

 

PCB Statistics

Statistic

Value

Components

16

Total Pads

35

Thru Hole Pads

24

Top SMT Pads

11

Bottom SMT Pads

0

Vias

18

Nets

2

 

 

 

Artwork & Quality Standards

Type of Artwork Supplied: Gerber RS-274-X

Quality Standard: IPC-Class-2

Availability: Worldwide

 

 

Typical Applications

The versatility of the Rogers 4003C PCB makes it an ideal choice for various applications, including:

 

Cellular Base Station Antennas and Power Amplifiers

RF Identification Tags

Automotive Radar and Sensors

LNB's for Direct Broadcast Satellites

 

 

RO4450F Bondply

The RO4450F bondply, an integral component of the RO4003C PCB, offers a range of grades derived from the RO4000 series core materials. Designed for compatibility in multi-layer configurations withRO4000 laminates, the high postcure Tg of Rogers RO4450F makes it an ideal choice for sequential laminations in multi-layer constructions.

 

Boasting enhanced lateral flow capabilities and the ability to withstand multiple lamination cycles, fully cured RO4450F bondplies cater to intricate design requirements with ease. Its compatibility with FR-4 bond requirements enables seamless integration into non-homogeneous multi-layer structures, facilitating versatile design possibilities and superior performance outcomes.

 

 

Conclusion

In conclusion, the RO4003C 0.7mm 4-layer PCB stands as a pinnacle of innovation in the realm of printed circuit boards, offering unmatched performance, reliability, and cost-efficiency across a spectrum of applications. With a comprehensive feature set, robust construction details, and a commitment to quality standards, thisRogersPCB variant emerges as a go-to solution for industries at the forefront of technological advancement.

 

For more information or to place an order, contact us today to experience the transformative capabilities of the Rogers RO4003C High Frequency PCB in your next project.



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