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RO4003C 0.7mm 4-layer PCB stands as a pinnacle of innovation in the realm of printed circuit boards, offering unmatched performance, reliability, and cost-efficiency across a spectrum of applications.
Item NO.:
BIC-266-v332.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
Rogers RO4003C PCB 4-layer 0.7mm Thick RO4450F Bondply Multilayer ENIG High Frequency Laminates
Introduction
Rogers 4003C PCBs represent a cutting-edge advancement in the realm of printed circuit boards. Crafted from proprietary woven glass reinforced hydrocarbon/ceramic materials, these boards offer an exceptional blend of electrical performance reminiscent of PTFE/woven glass compositions and the ease of manufacturability associated with epoxy/glass constructions.
Redefining industry standards,RO4003C laminates boast a versatile range of configurations, incorporating 1080 and 1674 glass fabric styles while ensuring uniform electrical performance across all setups. The hallmark of Rogers RO4003C lies in its precise control over dielectric constant (Dk) and minimal loss, achieved through a cost-effective production process akin to standard epoxy/glass laminates. Notably, unlike PTFE-based microwave materials, RO4003C eliminates the need for specialized through-hole treatments or delicate handling procedures.
Distinguished by their non-brominated composition and absence of UL 94 V-0 rating, RO4003C PCBs emerge as a sophisticated choice for diverse applications demanding superior performance and reliability.
Features
Dielectric Constant (DK): 3.38 +/-0.05 at 10GHz
Dissipation Factor: 0.0027 at 10GHz
Thermal Conductivity: 0.71 W/m/°K
Thermal Coefficient of Dielectric Constant: +40 ppm/°C (ranging -50°C to 150°C)
CTE Matched to Copper: X axis of 11ppm/°C, Y axis of 14ppm/°C
Low Z-axis Coefficient of Thermal Expansion: 46 ppm/°C
Tg: Greater than 280°C
Low Moisture Absorption: 0.06%
Benefits
The RO4003C Multilayer PCB offers a host of benefits that set it apart as a premium choice for high-performance applications:
1)Ideal for Multi-Layer Board (MLB) Constructions:
Ensures reliability and consistency in complex circuit designs.
2)Cost-Effective Processing:
Processes akin to FR-4 at a lower fabrication cost, making it a viable option for various projects.
3)Designed for Performance-Sensitive Applications:
Tailored for high-volume production environments where performance is critical.
4)Competitive Pricing:
Balances exceptional quality with affordability, making it accessible for a wide range of applications.
PCB Stackup
The 4-layer rigid PCB stackup featuring8mil RO4003C PCB and RO4450F Bondply ensures optimal performance and reliability. The detailed construction includes:
Layer |
Material |
Thickness (mm) |
Thickness (mil) |
Copper_layer_1 |
Copper |
0.035 |
1.38 |
Rogers 4003C Core |
RO4003C |
0.203 |
8 |
Copper_layer_2 |
Copper |
0.035 |
1.38 |
RO4450F Bondply |
RO4450F Bondply |
0.101 |
4 |
Copper_layer_1 |
Copper |
0.035 |
1.38 |
Rogers 4003C Core |
RO4003C |
0.203 |
8 |
Copper_layer_2 |
Copper |
0.035 |
1.38 |
PCB Construction Details
Detail |
Value |
Board Dimensions |
112mm x 121mm = 2 Types = 2PCS, +/- 0.15mm |
Minimum Trace/Space |
5/6 mils |
Minimum Hole Size |
0.3mm |
Blind Vias |
No |
Finished Board Thickness |
0.7mm |
Finished Cu Weight |
1oz (1.4 mils) outer layers, 1oz (1.4 mils) inner layers |
Via Plating Thickness |
20 μm |
Surface Finish |
ENIG |
Top Silkscreen |
White |
Bottom Silkscreen |
No |
Top Solder Mask |
Green |
Bottom Solder Mask |
No |
100% Electrical Test |
Yes (prior to shipment) |
PCB Statistics
Statistic |
Value |
Components |
16 |
Total Pads |
35 |
Thru Hole Pads |
24 |
Top SMT Pads |
11 |
Bottom SMT Pads |
0 |
Vias |
18 |
Nets |
2 |
Artwork & Quality Standards
Type of Artwork Supplied: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide
Typical Applications
The versatility of the Rogers 4003C PCB makes it an ideal choice for various applications, including:
Cellular Base Station Antennas and Power Amplifiers
RF Identification Tags
Automotive Radar and Sensors
LNB's for Direct Broadcast Satellites
RO4450F Bondply
The RO4450F bondply, an integral component of the RO4003C PCB, offers a range of grades derived from the RO4000 series core materials. Designed for compatibility in multi-layer configurations withRO4000 laminates, the high postcure Tg of Rogers RO4450F makes it an ideal choice for sequential laminations in multi-layer constructions.
Boasting enhanced lateral flow capabilities and the ability to withstand multiple lamination cycles, fully cured RO4450F bondplies cater to intricate design requirements with ease. Its compatibility with FR-4 bond requirements enables seamless integration into non-homogeneous multi-layer structures, facilitating versatile design possibilities and superior performance outcomes.
Conclusion
In conclusion, the RO4003C 0.7mm 4-layer PCB stands as a pinnacle of innovation in the realm of printed circuit boards, offering unmatched performance, reliability, and cost-efficiency across a spectrum of applications. With a comprehensive feature set, robust construction details, and a commitment to quality standards, thisRogersPCB variant emerges as a go-to solution for industries at the forefront of technological advancement.
For more information or to place an order, contact us today to experience the transformative capabilities of the Rogers RO4003C High Frequency PCB in your next project.
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