RO4350B PCB 6-layer Rogers 4350B 1.6mm ENIG Blind Via Multilayer Board

RO4350B PCB 6-layer Rogers 4350B 1.6mm ENIG Blind Via Multilayer Board

Designed for demanding RF, microwave, and high-power electronic systems, our RO4350B 6-layer PCB combines Rogers’premium laminate technology with precision manufacturing to deliver exceptional electrical performance, dimensional stability, and cost efficiency. Compliant with IPC-Class-2 quality standards and available worldwide, this Multilayer RO4350B PCB features blind vias (L1-L4, L5-L6) for optimized signal routing, ENIG surface finish for reliable soldering, and a 1.6mm finished thickness—ideal for compact, high-reliability designs. Below is a detailed breakdown of its key specifications, stackup, and statistics.

1. PCB Construction Details

This table outlines the foundational construction attributes, covering base material, dimensional tolerances, conductive layers, and quality testing—all critical for consistent performance in high-stress applications.

2. PCB Stackup

The 6-layer RO4350B stackup is engineered to balance signal performance, thermal stability, and manufacturability, using Rogers 4350B cores and RO4450F prepregs for consistent dielectric properties.

3. PCB Statistics

This table summarizes key component and connectivity metrics, reflecting the RO4350B PCB’s suitability for medium-density, high-functionality applications.

Core Advantages of RO4350Bmaterial & PCB Design

Rogers RO4350B laminate is the cornerstone of this PCB’s performance: it delivers PTFE-like electrical performance (low loss, stable Dk) with FR-4-like manufacturability, eliminating the need for special through-hole treatments and reducing fabrication costs by 30-50% vs. conventional microwave laminates. Key material benefits include:

• Stable Electrical Performance: Dk 3.48±0.05 (10GHz/23°C) and DF 0.0037, ensuring minimal signal attenuation for RF applications.
• Thermal Reliability: Tg >280°C, Z-axis CTE 32 ppm/°C (matching copper), and UL 94 V-0 rating—ideal for high-power designs and thermal shock environments. 
• Dimensional Stability: X/Y-axis CTE (10/12 ppm/°C) close to copper, preventing warpage in multi-layer constructions.
• The Rogers 4350B PCB’s design amplifies these benefits: blind vias reduce signal path length (lower loss), ENIG finish ensures long-term solder joint reliability, and 100% electrical testing guarantees zero defects.

Benefits

- Ideal for multi-layer board (MLB) constructions

- Processes like FR-4 at lower fabrication cost

- Excellent dimensional stability

- Competitively priced

Typical Applications

This RO4350B high frequency PCB is engineered for industries requiring high performance at competitive costs:

• Cellular Base Station Antennas & Power Amplifiers
• RF Identification (RFID) Tags
• Automotive Radar & Sensors
• Low-Noise Blocks (LNBs) for Direct Broadcast Satellites

Artwork is supplied in Gerber RS-274-X format for seamless manufacturing, and global availability ensures fast lead times for international projects.