RT/duroid 5880 Copper Clad Laminate0.127mm 0.252mm 0.508mm 0.787mm 1.575mm Substrate
1. Product Overview
RT/duroid 5880 is a high-performance laminate constructed from glass microfiber-reinforced PTFE (polytetrafluoroethylene) composite. It is specifically engineered to meet the rigorous requirements of stripline and microstrip circuit applications that demand precision and reliability.
The randomly distributed microfibers within the material contribute to exceptional dielectric constant uniformity—ensuring consistent performance across individual panels and maintaining stability over a broad frequency range. Its ultra-low dissipation factor extends its applicability to Ku-band and higher frequency scenarios, making it a top choice for high-frequency systems.
In terms of processability, RT/duroid 5880 substrate offers excellent machinability: it can be easily cut, sheared, and shaped into custom configurations to match diverse design needs. It also exhibits robust chemical resistance, withstanding all solvents and reagents (both hot and cold) commonly used in printed circuit manufacturing processes such as etching, edge plating, and hole plating.
Cladding Options
As standard supply, RT/duroid 5880 laminates are clad with electrodeposited (ED) copper or reverse-treated EDC copper on both sides. The copper weight ranges from½ounce/ft²(18μm) to 2 ounces/ft²(70μm). For applications with more critical electrical performance requirements, rolled copper foil cladding is available as an alternative. Additionally, custom cladding specifications—including aluminum, copper, or brass plate—can be requested to suit specialized use cases.
Ordering Notes
When placing an order for Rogers 5880 copper clad laminates, the following key details must be specified:
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Dielectric thickness and corresponding tolerance
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Type of copper foil (rolled, electrodeposited, or reverse treated)
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Required copper foil weight
2. Key Features
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Exceptionally low electrical loss among reinforced PTFE materials
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Minimal moisture absorption for stable performance in varying environments
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Isotropic material properties ensuring consistent performance across all directions
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Uniform electrical characteristics maintained over a wide frequency spectrum
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Superior resistance to chemicals, solvents, and reagents used in PCB manufacturing
3. Typical Applications
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Commercial airline broadband antennas
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Microstrip and stripline circuits
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Millimeter wave communication systems
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Military radar systems
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Missile guidance systems
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Point-to-point digital radio antennas
4. Technical Specifications Table
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RT/duroid 5880 Typical Value
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Property
|
RT/duroid 5880
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Direction
|
Units
|
Condition
|
Test Method
|
|
Dielectric Constant,εProcess
|
2.20
2.20±0.02 spec.
|
Z
|
N/A
|
C24/23/50
C24/23/50
|
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
|
|
Dielectric Constant,εDesign
|
2.2
|
Z
|
N/A
|
8GHz to 40 GHz
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Differential Phase Length Method
|
|
Dissipation Factor,tanδ
|
0.0004
0.0009
|
Z
|
N/A
|
C24/23/50
C24/23/50
|
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
|
|
Thermal Coefficient of ε
|
-125
|
Z
|
ppm/℃
|
-50℃to 150℃
|
IPC-TM-650 2.5.5.5
|
|
Volume Resistivity
|
2 x 107
|
Z
|
Mohm cm
|
C/96/35/90
|
ASTM D 257
|
|
Surface Resistivity
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3 x 107
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Z
|
Mohm
|
C/96/35/90
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ASTM D 257
|
|
Specific Heat
|
0.96(0.23）
|
N/A
|
j/g/k
(cal/g/c)
|
N/A
|
Calculated
|
|
Tensile Modulus
|
Test at 23℃
|
Test at 100℃
|
N/A
|
MPa(kpsi)
|
A
|
ASTM D 638
|
|
1070(156)
|
450(65)
|
X
|
|
860(125)
|
380(55)
|
Y
|
|
Ultimate Stress
|
29(4.2)
|
20(2.9)
|
X
|
|
27(3.9）
|
18(2.6)
|
Y
|
|
Ultimate Strain
|
6
|
7.2
|
X
|
%
|
|
4.9
|
5.8
|
Y
|
|
Compressive Modulus
|
710(103)
|
500(73)
|
X
|
MPa(kpsi)
|
A
|
ASTM D 695
|
|
710(103)
|
500(73)
|
Y
|
|
940(136)
|
670(97)
|
Z
|
|
Ultimate Stress
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27(3.9)
|
22(3.2)
|
X
|
|
29(5.3)
|
21(3.1)
|
Y
|
|
52(7.5)
|
43(6.3)
|
Z
|
|
Ultimate Strain
|
8.5
|
8.4
|
X
|
%
|
|
7.7
|
7.8
|
Y
|
|
12.5
|
17.6
|
Z
|
|
Moisture Absorption
|
0.02
|
N/A
|
%
|
0.62"(1.6mm) D48/50
|
ASTM D 570
|
|
Thermal Conductivity
|
0.2
|
Z
|
W/m/k
|
80℃
|
ASTM C 518
|
|
Coefficient of Thermal Expansion
|
31
48
237
|
X
Y
Z
|
ppm/℃
|
0-100℃
|
IPC-TM-650 2.4.41
|
|
Td
|
500
|
N/A
|
℃ TGA
|
N/A
|
ASTM D 3850
|
|
Density
|
2.2
|
N/A
|
gm/cm3
|
N/A
|
ASTM D 792
|
|
Copper Peel
|
31.2(5.5)
|
N/A
|
Pli(N/mm)
|
1oz(35mm)EDC foil
after solder float
|
IPC-TM-650 2.4.8
|
|
Flammability
|
V-0
|
N/A
|
N/A
|
N/A
|
UL 94
|
|
Lead-free Process Compatible
|
Yes
|
N/A
|
N/A
|
N/A
|
N/A
|
5. Standard Dimensions & Custom Options
Standard Thicknesses (with Tolerances)
0.005”(0.127mm)±0.0005”
0.010”(0.252mm)±0.0007”
0.020”(0.508mm)±0.0015”
0.031”(0.787mm)±0.0020”
0.062”(1.575mm)±0.0030”
Custom thicknesses available: 0.0035”- 0.375”in varying increments
Standard Panel Sizes
18” ×12”(457×305mm)
18” ×24”(457×610mm)
Custom panel sizes available upon request
Additional Cladding Options
Heavy metal cladding
Resistive foil cladding
Unclad (no metal cladding)
For custom cladding configurations, contact our Customer Service or Sales Engineering team
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