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Home High Frequency PCB Rogers 20mil AD250C PCB Pure Gold High-Frequency Antenna Circuit Board

Rogers 20mil AD250C PCB Pure Gold High-Frequency Antenna Circuit Board

This 20mil AD250C pure gold PCB with pure gold finish is a purpose-built high-frequency antenna solution. 

  • Item NO.:

    BIC-625-v710
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


Rogers 20mil AD250C PCB Pure Gold High-Frequency Antenna Circuit Board



Executive Summary


This article specifies a 2-layer rigid PCB on Rogers AD250C high-frequency laminate with pure gold finish. At 0.6 mm finished thickness with a 20 mil dielectric core, it targets antenna applications requiring low loss, controlled impedance, and excellent PIM performance. 


Part I covers PCB construction, stackup, and statistics; Part II reviews the AD250C copper-clad laminate, including its full datasheet, standard offerings, and material science.


 

Part I: PCB Product Description


1. Product Overview


The 20mil AD250C PCB is a 2-layer rigid board measuring 55.36 by 76.2 mm, tolerance plus or minus 0.15 mm. Built on glass-reinforced PTFE, it carries 1 oz copper on both layers and a pure gold finish for superior conductivity and corrosion resistance. Minimum trace and space is 4/6 mils, minimum drill 0.4 mm. Every board passes 100 percent electrical test and meets IPC-Class-2, with worldwide availability.

 


2. PCB Construction Details


The table below summarizes the complete construction specifications.


 

Parameter

Specification

Base Material

AD250C

Layer Count

2-layer rigid

Dimensions

55.36 x 76.2 mm (+/-0.15)

Min Trace/Space

4/6 mils

Min Hole Size

0.4 mm

Via Type

Through-hole only

Finished Thickness

0.6 mm

Cu Weight

1 oz outer layers

Via Plating

20 micron

Surface Finish

Pure Gold

Top Silkscreen

Yellow

Bottom Silkscreen

None

Top Solder Mask

Green

Bottom Solder Mask

Green

Electrical Test

100% prior to ship

Quality Standard

IPC-Class-2

Artwork

Gerber RS-274-X

Availability

Worldwide

 

 

3. PCB Stackup

A symmetric 2-layer stackup is centered on a 20 mil AD250C core.


 

Layer

Material

Thickness

Copper L1

Copper (1 oz)

35 micron

Core

AD250C

0.508 mm (20 mil)

Copper L2

Copper (1 oz)

35 micron

 

 

4. PCB Statistics

The design comprises 36 components, 51 pads, and 49 through-hole vias across 2 nets.

 


Metric

Count

Components

36

Total Pads

51

Thru-Hole Pads

24

Top SMT Pads

27

Bottom SMT Pads

0

Vias

49

Nets

2

 

 

5. Key Performance and Differentiation


Pure gold finish provides a flat, highly conductive RF contact surface, avoiding the nickel layer in ENIG that adds loss at microwave frequencies. 

AD250C yields a controlled Dk of 2.5 plus or minus 0.04 at 10 GHz and Df of 0.0013, ensuring consistent impedance and minimal insertion loss. PIM of -159 dBc at 1900 MHz suppresses intermodulation distortion critical for base station arrays. The 4/6 mil trace capability enables compact feed networks; 20 micron via plating secures reliable interconnects. No blind or buried vias simplifies fabrication and improves yield.


 

20mil AD250C PCB Pure gold



6. Typical Applications


Cellular base station antennas,

Automotive telematics antenna systems

Commercial satellite radio antennas.

Low loss and strong PIM performance benefit multi-element arrays where signal purity governs network capacity.

 

 

7. PCB Conclusion

 

This 20mil AD250C pure gold PCB with pure gold finish is a purpose-built high-frequency antenna solution. 

A low-loss PTFE composite substrate, 4/6 mil trace geometry, 100 percent electrical testing, and IPC-Class-2 construction combine to deliver repeatable RF performance. The symmetric stackup on a 20 mil core offers excellent dimensional stability for demanding wireless designs.

 


 

Part II: AD250C CCL Material Knowledge

 


1. Introduction to AD Series


Rogers AD Series antenna materials are high-performance specialty laminates engineered for wireless antenna markets. These glass-reinforced, PTFE-based composites deliver controlled dielectric constant, low loss, and very good PIM. Woven glass reinforcement affords processability and high-yield fabrication. All AD Series products offer standard ED or reverse-treated ED copper foil to reduce circuit loss and antenna PIM.

 


2. Material Composition and Technology


AD250C is a PTFE composite reinforced with woven glass fiber. The PTFE matrix gives inherently low dielectric loss and chemical stability; glass fabric improves dimensional stability and handling. Unlike ceramic-filled PTFE, glass reinforcement offers superior drillability and lower tool wear. Reverse-treated foil reduces conductor loss and PIM by minimizing roughness at the copper-dielectric interface. The material shows 0.04 percent moisture absorption, 2.6 N per mm peel strength, and decomposition above 500 degrees Celsius.

 



3. Complete Standard Properties Datasheet


The full datasheet covers electrical, thermal, mechanical, and physical properties.


 

Property

Value

Units

Conditions

Method

Electrical

Dk (process)

2.52

-

23C, 10 GHz

IPC 2.5.5.5

Dk (design)

2.50

-

10 GHz

Microstrip

Df

0.0013

-

23C, 10 GHz

IPC 2.5.5.5

Thermal Coeff Dk

-117

ppm/C

0-100C

IPC 2.5.5.5

Volume Resistivity

4.8e8

MOhm-cm

C96/35/90

IPC 2.5.17.1

Surface Resistivity

4.1e7

MOhm

C96/35/90

IPC 2.5.17.1

Elec. Strength

979

V/mil

-

IPC 2.5.6.2

Dielectric Breakdown

>40

kV

X/Y dir

IPC 2.5.6

PIM

-159/-163

dBc

1900 MHz

Rogers

Thermal

Td

>500

C

5% loss

IPC 2.3.40

CTE X

47

ppm/C

-55-288C

IPC 2.4.41

CTE Y

29

ppm/C

-55-288C

IPC 2.4.41

CTE Z

196

ppm/C

-55-288C

IPC 2.4.41

Thermal Cond.

0.33

W/m.K

Z dir

ASTM D5470

T288 Delam.

>60

min

288C

IPC 2.4.24.1

Mechanical

Peel Strength

2.6

N/mm

288C

IPC 2.4.8

Flexural Strength

60.7/44.1

MPa

25C

ASTM D790

Tensile Strength

41.4/38.6

MPa

23C

ASTM D3039

Flex Modulus

6102/5364

MPa

25C

IPC 2.4.4

Dim. Stability

0.02/0.06

mils/in

etch+bake

IPC 2.4.39a

Physical

Flammability

V-0

-

-

UL 94

Moisture Abs.

0.04

%

E1/105

IPC 2.6.2.1

Density

2.28

g/cm3

C24/23/50

ASTM D792

Spec. Heat

0.813

J/g.K

105C

ASTM E2716

 

 

4. Standard Offerings


Three standard thicknesses are available with matching panel sizes and copper options.


 

Thickness

Panel Sizes

Copper Cladding

0.020" (0.508 mm)

18x12, 18x24 in

ED/RT ED: 1/2oz, 1oz

0.030" (0.762 mm)

12x18, 24x18 in

ED/RT ED: 1/2oz, 1oz

0.060" (1.524 mm)

12x18, 24x18 in

ED/RT ED: 1/2oz, 1oz



5. CCL Product Image

 

 AD250C copper-clad laminate

Figure 1: AD250C copper-clad laminate with copper foil and dielectric layers.

 

 

6. Key Property Analysis

 

AD250C substrate features process Dk of 2.52 and design Dk of 2.50, among the lowest in the AD Series, ideal for wideband elements where low Dk minimizes phase velocity variation. Df of 0.0013 at 10 GHz is roughly an order of magnitude below FR-4, reducing insertion loss. Decomposition above 500 degrees and T288 delamination beyond 60 minutes ensure reflow robustness. CTE of 47, 29, and 196 ppm per degree in X, Y, and Z reflects glass-controlled in-plane stability far better than unreinforced PTFE. Thermal conductivity of 0.33 W per m-K provides modest heat spreading. Peel strength of 2.6 N per mm confirms strong adhesion. UL 94 V-0 and 0.04 percent moisture absorption suit humid outdoor base stations.

 


7. CCL Conclusion

 

Rogers AD250C is a purpose-engineered glass-reinforced PTFE laminate combining controlled low Dk, ultra-low Df, and excellent PIM in a high-yield processable format. Its full property set across electrical, thermal, mechanical, and physical domains makes it dependable for cellular, automotive, and satellite antennas. Multiple thicknesses, panel sizes, and foil options offer design flexibility, while V-0 flammability and low moisture absorption ensure long-term field reliability.








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