Shenzhen Bicheng
Electronics Technology Co., Ltd

# Call Us Now ! Tel : +86 755 27374946

# Order Online Now ! Email : info@bichengpcb.com

Hybrid PCB
Hybrid PCB
Products
Home Rogers PCB Board Rogers CLTE-XT High Frequency PCB 9.4mil 25mil 40mil 59mil ceramic filled woven glass reinforced PTFE Circuit Boards

Rogers CLTE-XT High Frequency PCB 9.4mil 25mil 40mil 59mil ceramic filled woven glass reinforced PTFE Circuit Boards

The Rogers CLTE-XT is a composite laminate that is filled with tiny-dispersed filler ceramics.

  • Item NO.:

    BIC-209-v186.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail

Rogers CLTE-XT High Frequency PCB 9.4mil 25mil 40mil 59mil ceramic filled woven glass reinforced PTFE Circuit Boards

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


General Description

The CLTE-XT laminates are composites of PTFE, woven fiberglass reinforcement, CLTE-XT PCB and micro-dispersed ceramic filler that are intended to increase loss tangent while preserving good dimensional stability and offering excellent thermal reliability and electrical performance.


Features and Benefits

1.Copper matched CTE in X and Y axis

2.Low Z-direction CTE of 20 ppm /°C

3.Low dissipation factor of 0.0010 at 10 GHz reduced circuit losses without sacrificing dimensional stability

4.Tightest dielectric constant tolerance(+/- .03) and DK stability with temperature change

5.High reliability on plated through holes

6.0.02% low moisture absorption

7.Great number of NASA outgassing values.

8.High thermal conductivity of 0.56 W/m/K


CLTE-XT PCB


Our PCB Capability (CLTE-XT laminates)

PCB Capability (CLTE-XT Laminates)
PCB material: Ceramic/PTFE Microwave Composite
Designation: CLTE-XT
Dielectric constant: 2.94
Layer count: Sinlge-sided PCB, Double-sided PCB, Multi-layer PCB, Hybrid PCB
Dielectric thickness: 5.1mil(0.130mm), 9.4mil (0.239mm), 20mil (0.508mm), 25mil(0.635mm), 30mil(0.762mm), 40mil(1.016mm), 45mil(1.143mm), 59mil(1.499mm), 60mil(1.524mm)
Copper weight: 1oz (35µm), 2oz (70µm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Red, Yellow etc.
Surface finish: Immersion gold, HASL, Immersion silver, Immersion tin,Bare copper, OSP, Pure gold plated etc..


The majority of final finishes, including HASL, Sn, Ag, Ni/Au, OSP, etc., have been applied to CLTE-XT materials without incident or cause for concern. Individual circuit board can be routed, punched, or laser cut depending on preference, tolerances, and edge quality requirements.


Typical Applications

1. Advanced Driver Assistance Systems (ADAS)

2. CNI (communication, navigation and identification) Applications

3. Defense Microwave/RF Applications

4. Microwave Feed Networks

5. Phased Array Antennas

6. Power Amplifiers

7. Patch Antennas

8. Radar Manifolds

9. Satellite & Space Electronics


CLTE-XT PCB


Data Sheet (CLTE-XT laminates)

Properties CLTE-XT PCB Units Test Conditions Test Method
Electrical Properties
Dielectric Constant 2.94 - 23˚C @ 50% RH 10 GHz IPC TM-650 2.5.5.5
Dissipation Factor 0.0010 - 23˚C @ 50% RH 10 GHz IPC TM-650 2.5.5.5
Dielectric Constant (design) 2.93 - C-24/23/50 10 GHz Microstrip Differential Phase Length
Thermal Coefficient of Dielectric Constant -8 ppm/˚C -50°C to 150°C 10 GHz IPC TM-650 2.5.5.5
Volume Resistivity 4.25x10⁸ Mohm-cm C-96/35/90 - IPC TM-650 2.5.17.1
Surface Resistivity 2.49x10⁸ Mohm C-96/35/90 - IPC TM-650 2.5.17.1
Electrical Strength (dielectric strength) 1000 V/mil - - IPC TM-650 2.5.6.2
Dielectric Breakdown 58 kV D-48/50 X/Y direc- tion IPC TM-650 2.5.6
PIM (For antenna only) - dBc - 50 ohm
0.060"
43dBm  1900 MHz
Thermal Properties
Decomposition Temperature (Td) 539 ˚C 2hrs @ 105˚C 5% Weight Loss IPC TM-650 2.3.40
Coefficient of Thermal Expansion - x 12.7 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41
Coefficient of Thermal Expansion - y 13.7 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41
Coefficient of Thermal Expansion - z 40.8 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41
Thermal Conductivity 0.56 W/(m.K) - z direction ASTM D5470
Time to Delamination >60 minutes as-received 288˚C IPC TM-650 2.4.24.1
Mechanical Properties
Copper Peel Strength after Thermal Stress 1.7
(9)
N/mm (lbs/ in) 10s @288˚C 35 μm foil IPC TM-650 2.4.8
Flexural Strength (MD, CMD) 40.7, 40.0
(5.9, 5.8)
MPa (ksi ) 25˚C±3˚C - ASTM D790
Tensile Strength (MD, CMD) 29.0, 25.5
(4.2, 3.7)
MPa (ksi ) 23C/50RH - ASTM D638
Flex Modulus (MD. CMD) 3247, 3261
(471, 473)
MPa (ksi ) 25C±3C - ASTM D790
Dimensional Stability (MD, CMD) -0.37, -0.67 mm/m 4 hr at 105˚C - IPC-TM-650 2.4.39a
Physical Properties
Flammability V-0 - - C48/23/50 &  C168/70 UL 94
Moisture Absorption 0.02 % E1/105+D24/23 - IPC TM-650 2.6.2.1
Density 2.17 g/cm³ C-24/23/50 - ASTM D792
Specifc Heat Capacity 0.61 J/g˚K 2 hours at 105˚C - ASTM E2716
NASA Outgassing 0.02 / 0.00 % TML/CVCM ASTM E595





BICHENG PCB WORKSHOP:


BICHENG PCB EQUIPMENT:


BICHENG PCB CERTIFICATE:


Top 10 Sales of Rogers PCB


BICHENG MAIN COURIERS:


Team practice


Leave A Message

If you have questions or suggestions,please leave us a message,we will reply you as soon as we can!

Related Products
RT/Duroid 5880 High Frequency PCB
RT/Duroid 5880 20mil 0.508mm Rogers High Frequency PCB

This is a type of double sided RF PCB built on RT/duroid 5880 for the application of Radar Systems.

2 layer  60mil  RO4003C RF PCB
Rogers 4003 60mil 1.524mm RO4003C High Frequency RF PCB

RO4003C PCBs are hydrocarbon ceramic filled laminates, not PTFE which are designed to offer superior high frequency performance.

RO3003 PCB 10mil
Rogers RO3003 High Frequency PCB 2 Layer 10mil DK3.0 DF 0.001 PCB

Rogers RO3003 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. It was designed to offer exceptional electrical and mechanical stability at competitive prices.

RO3010 PCB 10mil
Rogers RO3010 High Frequency 2-Layer 10mil Printed Circuit Board PCB

RO3010 laminates are competitively priced products with exceptional mechanical and electrical stability. This stability simplifies the design of broadband components and allows the materials to be used in a wide range of applications over a very broad range of frequencies.

25mil RO3210 PCB
Rogers RF PCB RO3210 25mil 0.635mm DK10.2 Immersion Gold

These RO3210 materials are engineered to offer exceptional electrical performance and mechanical stability. RO3210 laminates combine the surface smoothness of a non-woven PTFE laminate.

RT/duroid 6035HTC
Rogers 6035 Double Sided 20mil Core With Immersion Gold PCB

RT/duroid 6035HTC laminates are an exceptional choice for high power applications.

TC350 RF PCB
TC350 Rogers RF PCB 30mil Double Sided Corel With Immersion Gold

TC350 is designed to provide enhanced heat-transfer through “Best-In-Class” thermal conductivity, while reducing dielectric loss and insertion loss. Lower losses result in higher Amplifier and Antenna Gains/Efficiencies.

Rogers RO3035 High Frequency PCB
Rogers RO3035 High Frequency 2-Layer 10mil Circuit Board DK3.5 DF 0.0015

RO3035 materials exhibit a coefficient of thermal expansion(CTE) in the X and Y axis of 17 ppm/℃. This expansion coefficient is matched to that of copper, which allows the material to exhibit excellent dimensional stability.

© Copyright: 2024 Shenzhen Bicheng Electronics Technology Co., Ltd.. All Rights Reserved.

IPv6 network supported

IPv6 network supported

top

Leave A Message

Leave A Message

    If you have questions or suggestions,please leave us a message,we will reply you as soon as we can!

  • #
  • #
  • #