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Home Rogers PCB Board Rogers CLTE-XT High Frequency PCB 9.4mil 25mil 40mil 59mil ceramic filled woven glass reinforced PTFE Circuit Boards

Rogers CLTE-XT High Frequency PCB 9.4mil 25mil 40mil 59mil ceramic filled woven glass reinforced PTFE Circuit Boards

The Rogers CLTE-XT is a composite laminate that is filled with tiny-dispersed filler ceramics.

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Rogers CLTE-XT High Frequency PCB 9.4mil 25mil 40mil 59mil ceramic filled woven glass reinforced PTFE Circuit Boards

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

General Description

The CLTE-XT laminates are composites of PTFE, woven fiberglass reinforcement, CLTE-XT PCB and micro-dispersed ceramic filler that are intended to increase loss tangent while preserving good dimensional stability and offering excellent thermal reliability and electrical performance.

Features and Benefits

1.Copper matched CTE in X and Y axis

2.Low Z-direction CTE of 20 ppm /°C

3.Low dissipation factor of 0.0010 at 10 GHz reduced circuit losses without sacrificing dimensional stability

4.Tightest dielectric constant tolerance(+/- .03) and DK stability with temperature change

5.High reliability on plated through holes

6.0.02% low moisture absorption

7.Great number of NASA outgassing values.

8.High thermal conductivity of 0.56 W/m/K


Our PCB Capability (CLTE-XT laminates)

PCB Capability (CLTE-XT Laminates)
PCB material: Ceramic/PTFE Microwave Composite
Designation: CLTE-XT
Dielectric constant: 2.94
Layer count: Sinlge-sided PCB, Double-sided PCB, Multi-layer PCB, Hybrid PCB
Dielectric thickness: 5.1mil(0.130mm), 9.4mil (0.239mm), 20mil (0.508mm), 25mil(0.635mm), 30mil(0.762mm), 40mil(1.016mm), 45mil(1.143mm), 59mil(1.499mm), 60mil(1.524mm)
Copper weight: 1oz (35µm), 2oz (70µm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Red, Yellow etc.
Surface finish: Immersion gold, HASL, Immersion silver, Immersion tin,Bare copper, OSP, Pure gold plated etc..

The majority of final finishes, including HASL, Sn, Ag, Ni/Au, OSP, etc., have been applied to CLTE-XT materials without incident or cause for concern. Individual circuit board can be routed, punched, or laser cut depending on preference, tolerances, and edge quality requirements.

Typical Applications

1. Advanced Driver Assistance Systems (ADAS)

2. CNI (communication, navigation and identification) Applications

3. Defense Microwave/RF Applications

4. Microwave Feed Networks

5. Phased Array Antennas

6. Power Amplifiers

7. Patch Antennas

8. Radar Manifolds

9. Satellite & Space Electronics


Data Sheet (CLTE-XT laminates)

Properties CLTE-XT PCB Units Test Conditions Test Method
Electrical Properties
Dielectric Constant 2.94 - 23˚C @ 50% RH 10 GHz IPC TM-650
Dissipation Factor 0.0010 - 23˚C @ 50% RH 10 GHz IPC TM-650
Dielectric Constant (design) 2.93 - C-24/23/50 10 GHz Microstrip Differential Phase Length
Thermal Coefficient of Dielectric Constant -8 ppm/˚C -50°C to 150°C 10 GHz IPC TM-650
Volume Resistivity 4.25x10⁸ Mohm-cm C-96/35/90 - IPC TM-650
Surface Resistivity 2.49x10⁸ Mohm C-96/35/90 - IPC TM-650
Electrical Strength (dielectric strength) 1000 V/mil - - IPC TM-650
Dielectric Breakdown 58 kV D-48/50 X/Y direc- tion IPC TM-650 2.5.6
PIM (For antenna only) - dBc - 50 ohm
43dBm  1900 MHz
Thermal Properties
Decomposition Temperature (Td) 539 ˚C 2hrs @ 105˚C 5% Weight Loss IPC TM-650 2.3.40
Coefficient of Thermal Expansion - x 12.7 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41
Coefficient of Thermal Expansion - y 13.7 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41
Coefficient of Thermal Expansion - z 40.8 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41
Thermal Conductivity 0.56 W/(m.K) - z direction ASTM D5470
Time to Delamination >60 minutes as-received 288˚C IPC TM-650
Mechanical Properties
Copper Peel Strength after Thermal Stress 1.7
N/mm (lbs/ in) 10s @288˚C 35 μm foil IPC TM-650 2.4.8
Flexural Strength (MD, CMD) 40.7, 40.0
(5.9, 5.8)
MPa (ksi ) 25˚C±3˚C - ASTM D790
Tensile Strength (MD, CMD) 29.0, 25.5
(4.2, 3.7)
MPa (ksi ) 23C/50RH - ASTM D638
Flex Modulus (MD. CMD) 3247, 3261
(471, 473)
MPa (ksi ) 25C±3C - ASTM D790
Dimensional Stability (MD, CMD) -0.37, -0.67 mm/m 4 hr at 105˚C - IPC-TM-650 2.4.39a
Physical Properties
Flammability V-0 - - C48/23/50 &  C168/70 UL 94
Moisture Absorption 0.02 % E1/105+D24/23 - IPC TM-650
Density 2.17 g/cm³ C-24/23/50 - ASTM D792
Specifc Heat Capacity 0.61 J/g˚K 2 hours at 105˚C - ASTM E2716
NASA Outgassing 0.02 / 0.00 % TML/CVCM ASTM E595




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