Rogers CLTE-XT High Frequency PCB 9.4mil 25mil 40mil 59mil
ceramic filled woven glass reinforced PTFE Circuit Boards
(Printed
Circuit Boards are custom-made products, the picture and parameters shown are
just for reference)
General Description
The CLTE-XT laminates are composites of PTFE, woven fiberglass reinforcement, CLTE-XT PCB and
micro-dispersed ceramic filler that are intended to increase loss tangent while
preserving good dimensional stability and offering excellent thermal
reliability and electrical performance.
Features and Benefits
1.Copper
matched CTE in X and Y axis
2.Low Z-direction
CTE of 20 ppm /°C
3.Low
dissipation factor of 0.0010 at 10 GHz reduced circuit losses without
sacrificing dimensional stability
4.Tightest
dielectric constant tolerance(+/- .03) and DK stability with temperature change
5.High
reliability on plated through holes
6.0.02% low
moisture absorption
7.Great number
of NASA outgassing values.
8.High thermal
conductivity of 0.56 W/m/K
Our PCB Capability (CLTE-XT laminates)
|
PCB Capability (CLTE-XT Laminates)
|
|
PCB material:
|
Ceramic/PTFE
Microwave Composite
|
|
Designation:
|
CLTE-XT
|
|
Dielectric constant:
|
2.94
|
|
Layer count:
|
Sinlge-sided PCB, Double-sided
PCB, Multi-layer PCB, Hybrid PCB
|
|
Dielectric
thickness:
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5.1mil(0.130mm),
9.4mil (0.239mm), 20mil (0.508mm), 25mil(0.635mm), 30mil(0.762mm),
40mil(1.016mm), 45mil(1.143mm), 59mil(1.499mm), 60mil(1.524mm)
|
|
Copper weight:
|
1oz (35µm), 2oz (70µm)
|
|
PCB size:
|
≤400mm X 500mm
|
|
Solder mask:
|
Green, Black, Blue,
Red, Yellow etc.
|
|
Surface
finish:
|
Immersion
gold, HASL, Immersion silver, Immersion tin,Bare copper, OSP, Pure gold
plated etc..
|
The
majority of final finishes, including HASL, Sn, Ag, Ni/Au, OSP, etc., have been
applied to CLTE-XT materials without incident or cause for concern. Individual
circuit board can be routed, punched, or laser cut depending on preference,
tolerances, and edge quality requirements.
Typical Applications
1.
Advanced Driver Assistance Systems (ADAS)
2.
CNI (communication, navigation and identification) Applications
3.
Defense Microwave/RF Applications
4.
Microwave Feed Networks
5.
Phased Array Antennas
6.
Power Amplifiers
7.
Patch Antennas
8.
Radar Manifolds
9.
Satellite & Space Electronics
Data Sheet (CLTE-XT laminates)
|
Properties
|
CLTE-XT PCB
|
Units
|
Test
Conditions
|
Test Method
|
|
Electrical
Properties
|
|
Dielectric Constant
|
2.94
|
-
|
23˚C
@ 50% RH
|
10
GHz
|
IPC
TM-650 2.5.5.5
|
|
Dissipation Factor
|
0.0010
|
-
|
23˚C
@ 50% RH
|
10
GHz
|
IPC
TM-650 2.5.5.5
|
|
Dielectric Constant (design)
|
2.93
|
-
|
C-24/23/50
|
10
GHz
|
Microstrip
Differential Phase Length
|
|
Thermal Coefficient of Dielectric Constant
|
-8
|
ppm/˚C
|
-50°C
to 150°C
|
10
GHz
|
IPC
TM-650 2.5.5.5
|
|
Volume Resistivity
|
4.25x10⁸
|
Mohm-cm
|
C-96/35/90
|
-
|
IPC
TM-650 2.5.17.1
|
|
Surface Resistivity
|
2.49x10⁸
|
Mohm
|
C-96/35/90
|
-
|
IPC
TM-650 2.5.17.1
|
|
Electrical Strength (dielectric strength)
|
1000
|
V/mil
|
-
|
-
|
IPC
TM-650 2.5.6.2
|
|
Dielectric Breakdown
|
58
|
kV
|
D-48/50
|
X/Y
direc- tion
|
IPC
TM-650 2.5.6
|
|
PIM (For antenna only)
|
-
|
dBc
|
-
|
50
ohm
0.060"
|
43dBm 1900 MHz
|
|
Thermal
Properties
|
|
Decomposition Temperature (Td)
|
539
|
˚C
|
2hrs
@ 105˚C
|
5%
Weight Loss
|
IPC
TM-650 2.3.40
|
|
Coefficient of Thermal Expansion - x
|
12.7
|
ppm/˚C
|
-
|
-55˚C
to 288˚C
|
IPC
TM-650 2.4.41
|
|
Coefficient of Thermal Expansion - y
|
13.7
|
ppm/˚C
|
-
|
-55˚C
to 288˚C
|
IPC
TM-650 2.4.41
|
|
Coefficient of Thermal Expansion - z
|
40.8
|
ppm/˚C
|
-
|
-55˚C
to 288˚C
|
IPC
TM-650 2.4.41
|
|
Thermal Conductivity
|
0.56
|
W/(m.K)
|
-
|
z
direction
|
ASTM
D5470
|
|
Time to Delamination
|
>60
|
minutes
|
as-received
|
288˚C
|
IPC
TM-650 2.4.24.1
|
|
Mechanical
Properties
|
|
Copper Peel Strength after Thermal Stress
|
1.7
(9)
|
N/mm
(lbs/ in)
|
10s
@288˚C
|
35
μm foil
|
IPC
TM-650 2.4.8
|
|
Flexural Strength (MD, CMD)
|
40.7,
40.0
(5.9, 5.8)
|
MPa
(ksi )
|
25˚C±3˚C
|
-
|
ASTM
D790
|
|
Tensile Strength (MD, CMD)
|
29.0,
25.5
(4.2, 3.7)
|
MPa
(ksi )
|
23C/50RH
|
-
|
ASTM
D638
|
|
Flex Modulus (MD. CMD)
|
3247,
3261
(471, 473)
|
MPa
(ksi )
|
25C±3C
|
-
|
ASTM
D790
|
|
Dimensional Stability (MD, CMD)
|
-0.37,
-0.67
|
mm/m
|
4
hr at 105˚C
|
-
|
IPC-TM-650
2.4.39a
|
|
Physical
Properties
|
|
Flammability
|
V-0
|
-
|
-
|
C48/23/50
& C168/70
|
UL
94
|
|
Moisture Absorption
|
0.02
|
%
|
E1/105+D24/23
|
-
|
IPC
TM-650 2.6.2.1
|
|
Density
|
2.17
|
g/cm³
|
C-24/23/50
|
-
|
ASTM
D792
|
|
Specifc Heat Capacity
|
0.61
|
J/g˚K
|
2
hours at 105˚C
|
-
|
ASTM
E2716
|
|
NASA Outgassing
|
0.02
/ 0.00
|
%
|
|
TML/CVCM
|
ASTM
E595
|
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